JPS6475774A - Woody system sound-insulating floor material - Google Patents

Woody system sound-insulating floor material

Info

Publication number
JPS6475774A
JPS6475774A JP23093887A JP23093887A JPS6475774A JP S6475774 A JPS6475774 A JP S6475774A JP 23093887 A JP23093887 A JP 23093887A JP 23093887 A JP23093887 A JP 23093887A JP S6475774 A JPS6475774 A JP S6475774A
Authority
JP
Japan
Prior art keywords
boards
wooden
finish
bonding
noise insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP23093887A
Other languages
Japanese (ja)
Other versions
JPH0791899B2 (en
Inventor
Yozo Mihara
Isao Kai
Kazuo Tamemoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Yukizai Corp
Original Assignee
Asahi Organic Chemicals Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Organic Chemicals Industry Co Ltd filed Critical Asahi Organic Chemicals Industry Co Ltd
Priority to JP62230938A priority Critical patent/JPH0791899B2/en
Publication of JPS6475774A publication Critical patent/JPS6475774A/en
Publication of JPH0791899B2 publication Critical patent/JPH0791899B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Floor Finish (AREA)

Abstract

PURPOSE: To improve the noise insulating ability of a wooden noise insulating flooring material by bonding wooden finish manufactured by decoratively finishing the uppermost single board having a buffering material layer between a plurality of wooden boards to a multilayered structure formed by laminating a plurality of single wooden boards upon another. CONSTITUTION: A multilayered structure 3 is formed by laminating single wooden boards 10 having thicknesses of <=6 mm upon another and uniting the laminated boards 10 in one body without substantially bonding them to each other, but fixing the boards to each other at important positions. On the other hand, a buffering material 11 is provided between a plurality of wooden boards 10 having thicknesses of 0.5-6 mm and pressbonded to the boards 10 by pressing the boards 10 against the material 11 with a pressure-adjusted press so that the thickness of the buffering material 11 may become 0.1-3 mm. Then wooden finish 2 having a total thickness of about 4-12 mm is manufactured by sticking a sliced veneer 12 of Japanese oak, Japanese beech, etc., to the upper surface of the laminated body and giving a wood gain to the veneer 12. Finally, a wooden noise insulating flooring material 1 is obtained by bonding the finish 2 to the structure 3. Therefore, the flooring material can improve habitability and sanitary environment.
JP62230938A 1987-09-17 1987-09-17 Wood-based sound insulation floor material Expired - Lifetime JPH0791899B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62230938A JPH0791899B2 (en) 1987-09-17 1987-09-17 Wood-based sound insulation floor material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62230938A JPH0791899B2 (en) 1987-09-17 1987-09-17 Wood-based sound insulation floor material

Publications (2)

Publication Number Publication Date
JPS6475774A true JPS6475774A (en) 1989-03-22
JPH0791899B2 JPH0791899B2 (en) 1995-10-09

Family

ID=16915653

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62230938A Expired - Lifetime JPH0791899B2 (en) 1987-09-17 1987-09-17 Wood-based sound insulation floor material

Country Status (1)

Country Link
JP (1) JPH0791899B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5557146A (en) * 1993-07-14 1996-09-17 University Of South Florida Ohmic contact using binder paste with semiconductor material dispersed therein

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6216632U (en) * 1985-07-16 1987-01-31
JPS6232139U (en) * 1985-08-12 1987-02-26
JPS62185959U (en) * 1986-05-16 1987-11-26

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6216632U (en) * 1985-07-16 1987-01-31
JPS6232139U (en) * 1985-08-12 1987-02-26
JPS62185959U (en) * 1986-05-16 1987-11-26

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5557146A (en) * 1993-07-14 1996-09-17 University Of South Florida Ohmic contact using binder paste with semiconductor material dispersed therein

Also Published As

Publication number Publication date
JPH0791899B2 (en) 1995-10-09

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