JPS647622A - Device for treatment of semiconductor substrate - Google Patents

Abstract

PURPOSE:To reduce fine particles to be adhered to the surface of a semiconductor substrate and to improve quality and yield by providing an injection mechanism for spraying fluid to the liquid face of a treating tank to exhaust floating material on the liquid face out of the tank in addition to an overflow type circulation filtering system to exhaust the fine particles out of the tank without being left on the liquid face. CONSTITUTION:A device for treating a semiconductor substrate with liquid has a treating tank 1 for containing the substrate, circulation filtering mechanisms 4-6 for overflowing the liquid from the tank 1 to circulate to filter the liquid to the tank 1, and injection mechanisms 7-9, 3 for spraying the liquid to the liquid face of the tank 1 to exhaust floating material on the liquid face out of the tank. For example, an opening 2 for overflowing treatment liquid is formed at the upper edge of one sidewall of the tank 1, and an injection port 3 for injecting N2 gas is formed at the inside of the upper edge of the other sidewall. The N2 gas supplied from a supply pipe 8 through a filter 7 is introduced by a conduit provided in the sidewall of the tank 1 to the port 3 and sprayed toward the liquid face of the treatment liquid from the Port 3.