JPS647628A - Semiconductor device and manufacture thereof - Google Patents

Semiconductor device and manufacture thereof

Info

Publication number
JPS647628A
JPS647628A JP62161333A JP16133387A JPS647628A JP S647628 A JPS647628 A JP S647628A JP 62161333 A JP62161333 A JP 62161333A JP 16133387 A JP16133387 A JP 16133387A JP S647628 A JPS647628 A JP S647628A
Authority
JP
Japan
Prior art keywords
chip
pads
leads
bonding
longitudinal direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62161333A
Other languages
Japanese (ja)
Other versions
JPH0777226B2 (en
Inventor
Aizo Kaneda
Masao Mitani
Shozo Nakamura
Kunihiko Nishi
Hajime Murakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP62161333A priority Critical patent/JPH0777226B2/en
Priority to KR1019880007311A priority patent/KR960013778B1/en
Publication of JPS647628A publication Critical patent/JPS647628A/en
Priority to US07/640,584 priority patent/US5184208A/en
Priority to KR1019920012675A priority patent/KR970004216B1/en
Priority to US08/000,125 priority patent/US5365113A/en
Priority to US08/329,824 priority patent/US5514905A/en
Priority to US08/458,166 priority patent/US5742101A/en
Publication of JPH0777226B2 publication Critical patent/JPH0777226B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/865—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/981—Auxiliary members, e.g. spacers
    • H10W72/983—Reinforcing structures, e.g. collars
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE:To house a large chip in a small package, to reduce thermal stress of a wire bonded section, to obtain a lead burying length and to decrease the influence of a mechanical stress at the time of forming leads by arraying a bonding pad substantially at the center of an LSI chip on a linear line in the longitudinal direction of a chip. CONSTITUTION:A plurality of bonding pads 1 are provided on a rectangular LSI chip 5, leads 7 are radially arranged on the peripheral edge of the chip 5, and the pads 1 are electrically connected by wire bonding to one ends of the leads 7. The pads 1 of a semiconductor device having a resin sealing package 9 of such a structure are arrayed substantially at the center of the chip 5 on a linear line in the longitudinal direction of the chip 5. For example, the surface of the chip 5 except the pads 1 is covered with a heat resistant electric insulating film 10, the covered surface and the rear face of a lead frame 6 are bonded fixedly in such a manner that the pads 1 oppose the ends of the leads 7, and the pads 1 are wire bonded to the end surfaces of the leads 7.
JP62161333A 1987-06-30 1987-06-30 Semiconductor device and manufacturing method thereof Expired - Fee Related JPH0777226B2 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP62161333A JPH0777226B2 (en) 1987-06-30 1987-06-30 Semiconductor device and manufacturing method thereof
KR1019880007311A KR960013778B1 (en) 1987-06-30 1988-06-17 Semiconductor memory
US07/640,584 US5184208A (en) 1987-06-30 1991-01-14 Semiconductor device
KR1019920012675A KR970004216B1 (en) 1987-06-30 1992-07-16 Semiconductor memory
US08/000,125 US5365113A (en) 1987-06-30 1993-01-04 Semiconductor device
US08/329,824 US5514905A (en) 1987-06-30 1994-10-27 Semiconductor device
US08/458,166 US5742101A (en) 1987-06-30 1995-06-02 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62161333A JPH0777226B2 (en) 1987-06-30 1987-06-30 Semiconductor device and manufacturing method thereof

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP8191868A Division JP2911409B2 (en) 1996-07-22 1996-07-22 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS647628A true JPS647628A (en) 1989-01-11
JPH0777226B2 JPH0777226B2 (en) 1995-08-16

Family

ID=15733088

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62161333A Expired - Fee Related JPH0777226B2 (en) 1987-06-30 1987-06-30 Semiconductor device and manufacturing method thereof

Country Status (1)

Country Link
JP (1) JPH0777226B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0433695A3 (en) * 1989-12-22 1991-10-02 Texas Instruments Incorporated Integrated circuit device and method to prevent cracking during surface mount
JPH08241937A (en) * 1996-03-21 1996-09-17 Hitachi Ltd Semiconductor device
JPH08255854A (en) * 1996-03-21 1996-10-01 Hitachi Ltd Semiconductor device and manufacturing method thereof
US6194779B1 (en) 1989-11-28 2001-02-27 Kabushiki Kaisha Toshiba Plastic mold type semiconductor device
JP2006286688A (en) * 2005-03-31 2006-10-19 Elpida Memory Inc Semiconductor device

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5773954A (en) * 1980-10-25 1982-05-08 Toshiba Corp Integrated circuit
JPS58124251A (en) * 1982-01-20 1983-07-23 Mitsubishi Electric Corp Resin-sealed type semiconductor device
JPS6150355A (en) * 1984-08-20 1986-03-12 Toshiba Corp Semiconductor device
JPS61241959A (en) * 1985-04-18 1986-10-28 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション Semiconductor module
JPS6216022A (en) * 1985-07-12 1987-01-24 株式会社東芝 Semiconductor type current compensator
JPS62296528A (en) * 1986-06-17 1987-12-23 Matsushita Electronics Corp Resin-sealed semiconductor device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5773954A (en) * 1980-10-25 1982-05-08 Toshiba Corp Integrated circuit
JPS58124251A (en) * 1982-01-20 1983-07-23 Mitsubishi Electric Corp Resin-sealed type semiconductor device
JPS6150355A (en) * 1984-08-20 1986-03-12 Toshiba Corp Semiconductor device
JPS61241959A (en) * 1985-04-18 1986-10-28 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション Semiconductor module
JPS6216022A (en) * 1985-07-12 1987-01-24 株式会社東芝 Semiconductor type current compensator
JPS62296528A (en) * 1986-06-17 1987-12-23 Matsushita Electronics Corp Resin-sealed semiconductor device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6194779B1 (en) 1989-11-28 2001-02-27 Kabushiki Kaisha Toshiba Plastic mold type semiconductor device
EP0433695A3 (en) * 1989-12-22 1991-10-02 Texas Instruments Incorporated Integrated circuit device and method to prevent cracking during surface mount
JPH08241937A (en) * 1996-03-21 1996-09-17 Hitachi Ltd Semiconductor device
JPH08255854A (en) * 1996-03-21 1996-10-01 Hitachi Ltd Semiconductor device and manufacturing method thereof
JP2006286688A (en) * 2005-03-31 2006-10-19 Elpida Memory Inc Semiconductor device

Also Published As

Publication number Publication date
JPH0777226B2 (en) 1995-08-16

Similar Documents

Publication Publication Date Title
US6265759B1 (en) Laterally situated stress/strain relieving lead for a semiconductor chip package
EP0247775A3 (en) Semiconductor package with high density i/o lead connection
KR880014671A (en) Resin Filled Semiconductor Device
EP0055578A3 (en) Integrated circuit package
KR860007735A (en) Semiconductor device, manufacturing method thereof, and lead frame used in manufacturing method
KR920010853A (en) Resin-sealed semiconductor device
MY120226A (en) Thin type semiconductor device, module structure using the device and method of mounting the device on board.
EP0329317A3 (en) Semiconductor device having an insulating sheet
KR970008546A (en) Manufacturing method of semiconductor lead frame and manufacturing method of semiconductor chip package using same
JPS5769765A (en) Sealed body of semiconductor device
JPH0418694B2 (en)
KR950021455A (en) Resin-sealed semiconductor device
JPH0433137B2 (en)
CA2017080A1 (en) Semiconductor device package structure
JPH10214933A (en) Semiconductor device and manufacturing method thereof
JPS55165657A (en) Multi-chip package
JPS647645A (en) Semiconductor device and manufacture thereof
JPS60226149A (en) Ceramic package with heat sink
JPS6455291A (en) Integrated circuit device
JPS62226636A (en) Plastic chip carrier
KR0184447B1 (en) Bonding Tape Structure
JPS5720440A (en) Semiconductor device
JPS5723254A (en) Semiconductor device
SG73490A1 (en) High density internal ball grid array integrated circuit package
JPS5637662A (en) Semiconductor device

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees