JPS6476799A - Method of controlling packaging thickness of heat conductive adhesive - Google Patents

Method of controlling packaging thickness of heat conductive adhesive

Info

Publication number
JPS6476799A
JPS6476799A JP62233867A JP23386787A JPS6476799A JP S6476799 A JPS6476799 A JP S6476799A JP 62233867 A JP62233867 A JP 62233867A JP 23386787 A JP23386787 A JP 23386787A JP S6476799 A JPS6476799 A JP S6476799A
Authority
JP
Japan
Prior art keywords
heat conducting
packaging
studs
printed board
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62233867A
Other languages
Japanese (ja)
Inventor
Junji Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP62233867A priority Critical patent/JPS6476799A/en
Publication of JPS6476799A publication Critical patent/JPS6476799A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To reliably control a packaging thickness of a heat conducting adhesive interposed between a mounted element and a printed board, by forming a plurality of studs on a heat conducting body on the printed board such that the studs correspond to the packaging surface of the mounted element. CONSTITUTION:Control of a packaging thickness of a heat conducting adhesive is achieved by providing a plurality of studs 5 on a heat conducting body 11 on a printed board 10 such that each stud 5 corresponds to an edge 4 of a packaging section 2 of an element 1 to be mounted thereon. Thereby, the studs 5 serve as spacers so that a packaging thickness T of the heat conducting adhesive 15 between the packaging surface 2 of the mounted element 1 and the heat conducting body 11 is made uniform. For example, the mounted element 1 having a predetermined amount of heat conducting adhesive 15 applied on the packaging surface 2 is moved in the direction as indicated by the arrow and packaged on the heat conducting body 11 on the printed board 10. The adhesive 15 is extended by the packaging of the element 1 and fills a space defined between the packaging surface 2 of the element 1 and the heat conducting body 11 on the printed board 10, while the packaging thickness T thereof is controlled by the studs 5 formed on the heat conducting body 11. Accordingly, there is no variance in the packaging thickness T.
JP62233867A 1987-09-17 1987-09-17 Method of controlling packaging thickness of heat conductive adhesive Pending JPS6476799A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62233867A JPS6476799A (en) 1987-09-17 1987-09-17 Method of controlling packaging thickness of heat conductive adhesive

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62233867A JPS6476799A (en) 1987-09-17 1987-09-17 Method of controlling packaging thickness of heat conductive adhesive

Publications (1)

Publication Number Publication Date
JPS6476799A true JPS6476799A (en) 1989-03-22

Family

ID=16961813

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62233867A Pending JPS6476799A (en) 1987-09-17 1987-09-17 Method of controlling packaging thickness of heat conductive adhesive

Country Status (1)

Country Link
JP (1) JPS6476799A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0375564U (en) * 1989-11-24 1991-07-29
US5607538A (en) * 1995-09-07 1997-03-04 Ford Motor Company Method of manufacturing a circuit assembly
WO2015025598A1 (en) 2013-08-19 2015-02-26 株式会社Ihi Composite vane

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4980561A (en) * 1972-12-06 1974-08-03

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4980561A (en) * 1972-12-06 1974-08-03

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0375564U (en) * 1989-11-24 1991-07-29
US5607538A (en) * 1995-09-07 1997-03-04 Ford Motor Company Method of manufacturing a circuit assembly
WO2015025598A1 (en) 2013-08-19 2015-02-26 株式会社Ihi Composite vane
CN105473870A (en) * 2013-08-19 2016-04-06 株式会社Ihi Composite vane
CN105473870B (en) * 2013-08-19 2017-10-03 株式会社Ihi The composite wing
US10138738B2 (en) 2013-08-19 2018-11-27 Ihi Corporation Composite vane

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