JPS647694A - Method and apparatus for connecting both surfaces of printed circuit board - Google Patents

Method and apparatus for connecting both surfaces of printed circuit board

Info

Publication number
JPS647694A
JPS647694A JP16299287A JP16299287A JPS647694A JP S647694 A JPS647694 A JP S647694A JP 16299287 A JP16299287 A JP 16299287A JP 16299287 A JP16299287 A JP 16299287A JP S647694 A JPS647694 A JP S647694A
Authority
JP
Japan
Prior art keywords
pattern
conductive pin
printed circuit
circuit board
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16299287A
Other languages
English (en)
Inventor
Katsushiro Iwasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP16299287A priority Critical patent/JPS647694A/ja
Publication of JPS647694A publication Critical patent/JPS647694A/ja
Pending legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP16299287A 1987-06-30 1987-06-30 Method and apparatus for connecting both surfaces of printed circuit board Pending JPS647694A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16299287A JPS647694A (en) 1987-06-30 1987-06-30 Method and apparatus for connecting both surfaces of printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16299287A JPS647694A (en) 1987-06-30 1987-06-30 Method and apparatus for connecting both surfaces of printed circuit board

Publications (1)

Publication Number Publication Date
JPS647694A true JPS647694A (en) 1989-01-11

Family

ID=15765148

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16299287A Pending JPS647694A (en) 1987-06-30 1987-06-30 Method and apparatus for connecting both surfaces of printed circuit board

Country Status (1)

Country Link
JP (1) JPS647694A (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0877539A1 (fr) * 1997-05-09 1998-11-11 Mecanismos Auxiliares Industriales S.A. M.A.I.S.A. Améliorations dans les procédés de fabrication de boítes de services et de leurs parties
EP0878986A1 (fr) * 1997-05-16 1998-11-18 Mecanismos Auxiliares Industriales S.A. M.A.I.S.A. Un système et un pin d'interconnexion pour des circuits imprimés à double face par un double procédé, vague et refusion
FR2833756A1 (fr) * 2001-12-18 2003-06-20 Valeo Electronique Procede de soudure de pion par refusion et plaque de circuit imprime a double face
US8159833B2 (en) * 2008-02-29 2012-04-17 Kabushiki Kaisha Toshiba Printed circuit board, method for forming frame ground for printed circuit board, and electronic device
JP2016219557A (ja) * 2015-05-19 2016-12-22 パナソニックＩｐマネジメント株式会社 プリント基板およびプリント基板の製造方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0877539A1 (fr) * 1997-05-09 1998-11-11 Mecanismos Auxiliares Industriales S.A. M.A.I.S.A. Améliorations dans les procédés de fabrication de boítes de services et de leurs parties
WO1998051135A1 (en) * 1997-05-09 1998-11-12 Lear Automotive Dearborn, Inc. Improvements in the manufacturing processes of service boxes and their parts
EP0878986A1 (fr) * 1997-05-16 1998-11-18 Mecanismos Auxiliares Industriales S.A. M.A.I.S.A. Un système et un pin d'interconnexion pour des circuits imprimés à double face par un double procédé, vague et refusion
WO1998052392A1 (en) * 1997-05-16 1998-11-19 Ut Automotive Dearborn, Inc. An interconnection system and pin for double faced printed circuits by double process, wave and refusion
FR2833756A1 (fr) * 2001-12-18 2003-06-20 Valeo Electronique Procede de soudure de pion par refusion et plaque de circuit imprime a double face
US8159833B2 (en) * 2008-02-29 2012-04-17 Kabushiki Kaisha Toshiba Printed circuit board, method for forming frame ground for printed circuit board, and electronic device
JP2016219557A (ja) * 2015-05-19 2016-12-22 パナソニックＩｐマネジメント株式会社 プリント基板およびプリント基板の製造方法

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