JPS6477136A - Tape carrier for semiconductor device - Google Patents

Tape carrier for semiconductor device

Info

Publication number
JPS6477136A
JPS6477136A JP62232611A JP23261187A JPS6477136A JP S6477136 A JPS6477136 A JP S6477136A JP 62232611 A JP62232611 A JP 62232611A JP 23261187 A JP23261187 A JP 23261187A JP S6477136 A JPS6477136 A JP S6477136A
Authority
JP
Japan
Prior art keywords
tape carrier
terminals
lead terminals
substrate
outer lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62232611A
Other languages
Japanese (ja)
Other versions
JP2513724B2 (en
Inventor
Ryutaro Arakawa
Kimitaka Koseki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Maxell Ltd
Original Assignee
Hitachi Maxell Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Maxell Ltd filed Critical Hitachi Maxell Ltd
Priority to JP62232611A priority Critical patent/JP2513724B2/en
Publication of JPS6477136A publication Critical patent/JPS6477136A/en
Application granted granted Critical
Publication of JP2513724B2 publication Critical patent/JP2513724B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE:To obtain a carrier tape for a semiconductor device and capable of mounting in a high integration degree using the same tape carrier by a method wherein memory ICs are bonded to the same tape carrier and each IC is provided with a plurality of outer lead terminals for chip select terminals. CONSTITUTION:A Cu foil is laminated on a tape carrier 1 consisting of a polyimide and so on and thereafter, after lead terminal patterns are formed, an Sn plating is applied to these patterns. Outer lead terminals 10 only for chip select terminals are formed two in number adjoining outer lead terminals 6. Inner lead terminals 7 of this tape carrier and Au bumps of an IC 8 are thermally fixed by pressure to each other. When the ICs 8 are mounted on a printed substrate in a two-stage superposition and are superposed on the upper and lower surfaces of the substrate, the terminals 10 only are cut off arbitrarily in such a way that these are not superposed on each other and are mounted on the upper and lower surfaces of the substrate. Thereby, a highly integrated mounting of two times of the conventional mounting becomes possible.
JP62232611A 1987-09-18 1987-09-18 Carrier tape for semiconductor device Expired - Fee Related JP2513724B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62232611A JP2513724B2 (en) 1987-09-18 1987-09-18 Carrier tape for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62232611A JP2513724B2 (en) 1987-09-18 1987-09-18 Carrier tape for semiconductor device

Publications (2)

Publication Number Publication Date
JPS6477136A true JPS6477136A (en) 1989-03-23
JP2513724B2 JP2513724B2 (en) 1996-07-03

Family

ID=16942056

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62232611A Expired - Fee Related JP2513724B2 (en) 1987-09-18 1987-09-18 Carrier tape for semiconductor device

Country Status (1)

Country Link
JP (1) JP2513724B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03154355A (en) * 1989-11-13 1991-07-02 Rohm Co Ltd Electronic parts
US5165067A (en) * 1989-12-01 1992-11-17 Inmos Limited Semiconductor chip packages
EP0473796A4 (en) * 1990-03-15 1994-05-25 Fujitsu Ltd Semiconductor device having a plurality of chips
JP2007010041A (en) * 2005-06-30 2007-01-18 Ntn Corp Wheel bearing device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03154355A (en) * 1989-11-13 1991-07-02 Rohm Co Ltd Electronic parts
US5165067A (en) * 1989-12-01 1992-11-17 Inmos Limited Semiconductor chip packages
US5512783A (en) * 1989-12-01 1996-04-30 Inmos Limited Semiconductor chip packages
EP0473796A4 (en) * 1990-03-15 1994-05-25 Fujitsu Ltd Semiconductor device having a plurality of chips
JP2007010041A (en) * 2005-06-30 2007-01-18 Ntn Corp Wheel bearing device

Also Published As

Publication number Publication date
JP2513724B2 (en) 1996-07-03

Similar Documents

Publication Publication Date Title
US6228676B1 (en) Near chip size integrated circuit package
EP0377932A3 (en) Package of semiconductor integrated circuits
KR0127678B1 (en) Semiconductor device and manufacturing method thereof
WO1997040532A3 (en) Molded flex circuit ball grid array and method of making
CA2171458A1 (en) Multi-chip module
CA2159243A1 (en) Method of Manufacturing Chip-Size Package-Type Semiconductor Device
CA2077406A1 (en) Process for flip chip connecting semiconductor chip
DE60233902D1 (en) STACKABLE LAYERS INCLUDE THE ENCAPSULATED INTEGRATED CIRCUITING SCHIPS WITH ONE OR MORE CONNECTING LINES THEREOF, AND METHOD FOR THE PRODUCTION THEREOF
EP0248314A3 (en) Soldering of electronic components
CA2108868A1 (en) Printed circuit board with electric elements mounted thereon
MY118146A (en) Flexible thin film ball grid array containing solder mask
US6408510B1 (en) Method for making chip scale packages
JPS6428856A (en) Multilayered integrated circuit
EP0337448A3 (en) Semiconductor device having a metal stem
JPS6477136A (en) Tape carrier for semiconductor device
JPS6419737A (en) Multilayer interconnection tape carrier
US5625224A (en) Method and apparatus for an integrated circuit chip carrier having improved mounting pad density
JPS6414935A (en) Semiconductor device
JPS6482646A (en) Connection of integrated circuit element
JPS6477135A (en) Semiconductor device
JPH0645763A (en) Printed wiring board
JPH0299394A (en) Memory card module
JPS63119288A (en) Circuit board
JPS6484624A (en) Semiconductor integrated circuit device using film carrier
GB1411220A (en) Method of securing electrical components to members

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees