JPS6477149A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS6477149A
JPS6477149A JP23260787A JP23260787A JPS6477149A JP S6477149 A JPS6477149 A JP S6477149A JP 23260787 A JP23260787 A JP 23260787A JP 23260787 A JP23260787 A JP 23260787A JP S6477149 A JPS6477149 A JP S6477149A
Authority
JP
Japan
Prior art keywords
sealing resin
semiconductor device
resin
semiconductor element
modulus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23260787A
Other languages
Japanese (ja)
Inventor
Akio Anada
Hiroshi Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Maxell Ltd
Original Assignee
Hitachi Maxell Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Maxell Ltd filed Critical Hitachi Maxell Ltd
Priority to JP23260787A priority Critical patent/JPS6477149A/en
Publication of JPS6477149A publication Critical patent/JPS6477149A/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To relax a stress, which is generated in a semiconductor element due to the flexibility of a sealing resin, and to prevent a semiconductor device from being broken by an external force by a method wherein a sealing resin having a low Young's modulus is used as the above sealing resin. CONSTITUTION:A semiconductor element 2 is sealed in a module substrate 3 with a sealing resin 1 and thereafter, the substrate 3 is bonded to a vinyl chloride card 4 to constitute an IC card. At this time, a resin having a Young's modulus of 200kgf/mm<2>, such as an acrylic photo-setting resin, is used as the sealing resin 1. Thereby, a stress, which is generated in the semiconductor element, is reduced and a possibility of the breaking of a semiconductor device is reduced.
JP23260787A 1987-09-18 1987-09-18 Semiconductor device Pending JPS6477149A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23260787A JPS6477149A (en) 1987-09-18 1987-09-18 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23260787A JPS6477149A (en) 1987-09-18 1987-09-18 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS6477149A true JPS6477149A (en) 1989-03-23

Family

ID=16942002

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23260787A Pending JPS6477149A (en) 1987-09-18 1987-09-18 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS6477149A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02278788A (en) * 1989-04-19 1990-11-15 Nippondenso Co Ltd Printed wiring board for mounting of semiconductor element

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02278788A (en) * 1989-04-19 1990-11-15 Nippondenso Co Ltd Printed wiring board for mounting of semiconductor element

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