JPS6477918A - Capacitor - Google Patents

Abstract

PURPOSE:To miniaturize a film, chip capacitor while improving solderability at the time of mounting by disposing a sheathing member onto the cut surface of a film capacitor element with protective layers arranged in the upper and lower sections of a capacitance section and coloring the surface layer sections of the protective layers in black by crosslinking a resin for the protective layers. CONSTITUTION:Protective layers 9, 10 are formed to the upper and lower sections of a capacitance section, in which a double-side evaporated and double-side coated films are laminated, in order to protect the capacitance section and reinforce the whole. The protective layers 9, 10 are composed by laminating films in which resin films 12 consisting of PPO are shaped onto both surfaces of resin films 11 such as PPS films. A sheathing member 8 coats the whole end faces of the capacitance section, and is arranged extending over the whole regions or partial regions of the end faces of the cut surface sides of electrode leading-out sections 6, 7 and the end faces of the protective layers 9, 10. At least surface layer sections of the protective layers 9, 10, coating dielectric films 4, 5 in the capacitance section and the resin films 12 are colored to the black system of brown-black brown by crosslinking the resin of PPO, etc. The surface layer section of the sheathing member 8 is also colored to the black system of brown-black brown.