JPS64788A - Surface conductive ceramic substrate and manufacture of the same and metallizing compound for the same - Google Patents

Surface conductive ceramic substrate and manufacture of the same and metallizing compound for the same

Info

Publication number: JPS64788A
Authority: JP; Japan
Prior art keywords: ceramic substrate; same; adhesion strength; compound; manufacture
Prior art date: 1987-03-31
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

JP4385888A

Other languages

English (en)

Other versions

JPH01788A (ja

JPH0529315B2 (ja

Inventor

Hironori Asai

Kazuo Anzai

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Toshiba Corp

Original Assignee

Toshiba Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1987-03-31

Filing date

1988-02-26

Publication date

1989-01-05

1988-02-26 Application filed by Toshiba Corp filed Critical Toshiba Corp

1988-02-26 Priority to JP4385888A priority Critical patent/JPS64788A/ja

1988-03-29 Priority to US07/174,902 priority patent/US4883704A/en

1988-03-30 Priority to DE3855613T priority patent/DE3855613T2/de

1988-03-30 Priority to EP93111133A priority patent/EP0574956B1/en

1988-03-30 Priority to EP88105174A priority patent/EP0285127B1/en

1988-03-30 Priority to DE3855680T priority patent/DE3855680T2/de

1989-01-05 Publication of JPH01788A publication Critical patent/JPH01788A/ja

1989-01-05 Publication of JPS64788A publication Critical patent/JPS64788A/ja

1989-09-22 Priority to US07/410,863 priority patent/US5063121A/en

1993-04-30 Publication of JPH0529315B2 publication Critical patent/JPH0529315B2/ja

Status Granted legal-status Critical Current

Links

239000000758 substrate Substances 0.000 title abstract 6
150000001875 compounds Chemical class 0.000 title abstract 5
239000000919 ceramic Substances 0.000 title abstract 4
238000004519 manufacturing process Methods 0.000 title abstract 2
229910052751 metal Inorganic materials 0.000 abstract 3
239000002184 metal Substances 0.000 abstract 2
150000002739 metals Chemical class 0.000 abstract 2
238000000034 method Methods 0.000 abstract 2
229910052750 molybdenum Inorganic materials 0.000 abstract 2
150000004767 nitrides Chemical class 0.000 abstract 2
229910052723 transition metal Inorganic materials 0.000 abstract 2
229910052721 tungsten Inorganic materials 0.000 abstract 2
-1 Mo and W Chemical class 0.000 abstract 1
229910052581 Si3N4 Inorganic materials 0.000 abstract 1
239000011230 binding agent Substances 0.000 abstract 1
239000002612 dispersion medium Substances 0.000 abstract 1
239000011261 inert gas Substances 0.000 abstract 1
229910052742 iron Inorganic materials 0.000 abstract 1
238000002844 melting Methods 0.000 abstract 1
230000008018 melting Effects 0.000 abstract 1
229910052759 nickel Inorganic materials 0.000 abstract 1
238000007650 screen-printing Methods 0.000 abstract 1
150000003624 transition metals Chemical class 0.000 abstract 1
229910052726 zirconium Inorganic materials 0.000 abstract 1

Landscapes

Parts Printed On Printed Circuit Boards (AREA)
Manufacturing Of Printed Wiring (AREA)
Conductive Materials (AREA)

JP4385888A 1987-03-30 1988-02-26 Surface conductive ceramic substrate and manufacture of the same and metallizing compound for the same Granted JPS64788A (en)

Priority Applications (7)

Application Number	Priority Date	Filing Date	Title
JP4385888A JPS64788A (en)	1987-03-31	1988-02-26	Surface conductive ceramic substrate and manufacture of the same and metallizing compound for the same
US07/174,902 US4883704A (en)	1987-03-30	1988-03-29	Circuit substrate comprising nitride type ceramics, method for preparing it, and metallizing composition for use in it
DE3855613T DE3855613T2 (de)	1987-03-30	1988-03-30	Metallisiertes substrat für Schaltungen aus Nitrid-Typ- Keramiken
EP93111133A EP0574956B1 (en)	1987-03-30	1988-03-30	Metallized circuit substrate comprising nitride type ceramics
EP88105174A EP0285127B1 (en)	1987-03-30	1988-03-30	Circuit substrate comprising nitride type ceramics, method for preparing it, and metallizing composition for use in it
DE3855680T DE3855680T2 (de)	1987-03-30	1988-03-30	Substrat für Schaltungen aus Nitrid-Typ-Keramiken, Verfahren zu seiner Herstellung und Metallisierung
US07/410,863 US5063121A (en)	1987-03-30	1989-09-22	Circuit substrate comprising nitride type ceramics, method for preparing it, and metallizing composition for use in it

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
JP62-76165		1987-03-31
JP7616587		1987-03-31
JP4385888A JPS64788A (en)	1987-03-31	1988-02-26	Surface conductive ceramic substrate and manufacture of the same and metallizing compound for the same

Publications (3)

Publication Number	Publication Date
JPH01788A JPH01788A (ja)	1989-01-05
JPS64788A true JPS64788A (en)	1989-01-05
JPH0529315B2 JPH0529315B2 (ja)	1993-04-30

Family

ID=26383692

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP4385888A Granted JPS64788A (en)	1987-03-30	1988-02-26	Surface conductive ceramic substrate and manufacture of the same and metallizing compound for the same

Country Status (1)

Country	Link
JP (1)	JPS64788A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5230924A (en) *	1988-12-14	1993-07-27	Li Chou H	Metallized coatings on ceramics for high-temperature uses
US11171251B2 (en)	2015-11-13	2021-11-09	Johnson Matthey Public Limited Company	Process for forming conductive track or coating

Citations (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS61291480A (ja) *	1985-06-17	1986-12-22	日本特殊陶業株式会社	窒化アルミニウム製基材の表面処理組成物
JPS62197379A (ja) *	1986-02-20	1987-09-01	株式会社東芝	窒化アルミニウム基板

1988
- 1988-02-26 JP JP4385888A patent/JPS64788A/ja active Granted

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS61291480A (ja) *	1985-06-17	1986-12-22	日本特殊陶業株式会社	窒化アルミニウム製基材の表面処理組成物
JPS62197379A (ja) *	1986-02-20	1987-09-01	株式会社東芝	窒化アルミニウム基板

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5230924A (en) *	1988-12-14	1993-07-27	Li Chou H	Metallized coatings on ceramics for high-temperature uses
US11171251B2 (en)	2015-11-13	2021-11-09	Johnson Matthey Public Limited Company	Process for forming conductive track or coating

Also Published As

Publication number	Publication date
JPH0529315B2 (ja)	1993-04-30

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