JPS6480030A - Semiconductor element transfer device - Google Patents

Semiconductor element transfer device

Info

Publication number
JPS6480030A
JPS6480030A JP23577487A JP23577487A JPS6480030A JP S6480030 A JPS6480030 A JP S6480030A JP 23577487 A JP23577487 A JP 23577487A JP 23577487 A JP23577487 A JP 23577487A JP S6480030 A JPS6480030 A JP S6480030A
Authority
JP
Japan
Prior art keywords
belt
storage holes
elements
semiconductor elements
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP23577487A
Other languages
Japanese (ja)
Other versions
JPH0812874B2 (en
Inventor
Kimio Okamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP23577487A priority Critical patent/JPH0812874B2/en
Publication of JPS6480030A publication Critical patent/JPS6480030A/en
Publication of JPH0812874B2 publication Critical patent/JPH0812874B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE:To transfer semiconductor elements by the movement of a belt by placing a belt having a plurality of storage holes for receiving semiconductor elements in contact with a belt receiver having a smooth upper surface. CONSTITUTION:A metallic belt 1 having a plurality of storage holes 2 for receiving semiconductor elements 4 and perforations 3 is moved in the direction of an arrow A by a pulley 11 having a feed clink 12. The elements 4 put in the storage holes 2 of the belt 1 are moved in the direction of an arrow 14 by an air flow 13 and sucked so as to abut on one side 2a of the storage holes 2. With the belt 1 moving, one side 2b of the storage holes 2 abuts on one side 4b of the elements 4, so the elements 4 have their two sides 4a, 4b contacted with the two sides 2a, 2b of the storage holes 2 as represented in the hatched section, and are correctly positioned and transferred.
JP23577487A 1987-09-19 1987-09-19 Semiconductor element transfer device Expired - Fee Related JPH0812874B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23577487A JPH0812874B2 (en) 1987-09-19 1987-09-19 Semiconductor element transfer device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23577487A JPH0812874B2 (en) 1987-09-19 1987-09-19 Semiconductor element transfer device

Publications (2)

Publication Number Publication Date
JPS6480030A true JPS6480030A (en) 1989-03-24
JPH0812874B2 JPH0812874B2 (en) 1996-02-07

Family

ID=16991040

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23577487A Expired - Fee Related JPH0812874B2 (en) 1987-09-19 1987-09-19 Semiconductor element transfer device

Country Status (1)

Country Link
JP (1) JPH0812874B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001332383A (en) * 2000-03-17 2001-11-30 Seiko Epson Corp Method of manufacturing organic EL display, method of arranging semiconductor element, method of manufacturing semiconductor device
JP2010019599A (en) * 2008-07-08 2010-01-28 Nec Electronics Corp Jig for inspecting semiconductor chip, apparatus and method for inspection, and method of manufacturing semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001332383A (en) * 2000-03-17 2001-11-30 Seiko Epson Corp Method of manufacturing organic EL display, method of arranging semiconductor element, method of manufacturing semiconductor device
JP2010019599A (en) * 2008-07-08 2010-01-28 Nec Electronics Corp Jig for inspecting semiconductor chip, apparatus and method for inspection, and method of manufacturing semiconductor device

Also Published As

Publication number Publication date
JPH0812874B2 (en) 1996-02-07

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees