JPS6480058A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS6480058A
JPS6480058A JP23767187A JP23767187A JPS6480058A JP S6480058 A JPS6480058 A JP S6480058A JP 23767187 A JP23767187 A JP 23767187A JP 23767187 A JP23767187 A JP 23767187A JP S6480058 A JPS6480058 A JP S6480058A
Authority
JP
Japan
Prior art keywords
capacitor
wiring
seam
chip
cap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23767187A
Other languages
Japanese (ja)
Inventor
Takafumi Tamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP23767187A priority Critical patent/JPS6480058A/en
Publication of JPS6480058A publication Critical patent/JPS6480058A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To shorten the wiring between an IC chip and a capacitor as well as to remove the unnecessary alternating-circuit component of a power source system or a signal by a method wherein the title semiconductor device is constructed in such a manner that a capacitor is incorporated into the cap part of the package to be used for the semiconductor device. CONSTITUTION:Electrodes 1 and 2 are buried in a cap 5, and a capacitor 3 is formed with the electrodes 1 and 2 and the ceramic located between them. A seam-sealing metallized layer 4 is formed on the insulating part 14 located on the circumference of the capacitor 3. The cap 5 is placed on the upper part of a ceramic case 13, and it is seam-weld sealed with the metallized layer 4 and a seam-ring 8. An edge of the wiring 7 in the case is connected to a switch 10, another edge of the wiring 7 is connected to an IC chip 9 through a bonding wire 12, and other edge is connected to the external terminal. As a result, the wiring from the chip 9 to the capacitor 3 is made short, and the unnecessary alternating component of a power source system and a signal can be removed.
JP23767187A 1987-09-21 1987-09-21 Semiconductor device Pending JPS6480058A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23767187A JPS6480058A (en) 1987-09-21 1987-09-21 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23767187A JPS6480058A (en) 1987-09-21 1987-09-21 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS6480058A true JPS6480058A (en) 1989-03-24

Family

ID=17018783

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23767187A Pending JPS6480058A (en) 1987-09-21 1987-09-21 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS6480058A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09293799A (en) * 1996-04-26 1997-11-11 Nec Corp Semiconductor integrated circuit package and method of manufacturing the same
US5905301A (en) * 1996-02-01 1999-05-18 Nec Corporation Mold package for sealing a chip

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5905301A (en) * 1996-02-01 1999-05-18 Nec Corporation Mold package for sealing a chip
JPH09293799A (en) * 1996-04-26 1997-11-11 Nec Corp Semiconductor integrated circuit package and method of manufacturing the same

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