JPS6480507A - Dicing method - Google Patents

Dicing method

Info

Publication number
JPS6480507A
JPS6480507A JP23923387A JP23923387A JPS6480507A JP S6480507 A JPS6480507 A JP S6480507A JP 23923387 A JP23923387 A JP 23923387A JP 23923387 A JP23923387 A JP 23923387A JP S6480507 A JPS6480507 A JP S6480507A
Authority
JP
Japan
Prior art keywords
dicing
blade
cutting
wafer
dicing blade
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23923387A
Other languages
Japanese (ja)
Inventor
Yasuo Iguchi
Toshiko Suwa
Masaru Kimura
Takashi Kanamori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP23923387A priority Critical patent/JPS6480507A/en
Publication of JPS6480507A publication Critical patent/JPS6480507A/en
Pending legal-status Critical Current

Links

Landscapes

  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)

Abstract

PURPOSE:To form a sharp angle which is formed with a cutting surface and a wafer surface by dicing by means of a dicing blade with two blade surfaces of respectively different cutting resistance. CONSTITUTION:Two blade surfaces constituting of a dicing blade are formed with abrasive grains of different diamond particle diameters and respective surfaces are made rough or fine particulate surfaces. Such a dicing blade 35 is mounted on a spindle shaft 37, and a wafer applied is cut on a dicing table 13 while pure water is sprayed as is carried out conventionally after setting the number of revolutions of the shaft and the cutting speed. Then, a second kerf 41b is formed by revolving the whole wafer by 180 deg. and cutting similarly. As the dicing blade is cut in the curved state, a sharp angle is formed with a cutting surface and a wafer surface, and it is not necessary to use an exclusive machine of reverse trapezoid.
JP23923387A 1987-09-24 1987-09-24 Dicing method Pending JPS6480507A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23923387A JPS6480507A (en) 1987-09-24 1987-09-24 Dicing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23923387A JPS6480507A (en) 1987-09-24 1987-09-24 Dicing method

Publications (1)

Publication Number Publication Date
JPS6480507A true JPS6480507A (en) 1989-03-27

Family

ID=17041727

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23923387A Pending JPS6480507A (en) 1987-09-24 1987-09-24 Dicing method

Country Status (1)

Country Link
JP (1) JPS6480507A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06132396A (en) * 1992-10-19 1994-05-13 Rohm Co Ltd Dicing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06132396A (en) * 1992-10-19 1994-05-13 Rohm Co Ltd Dicing method

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