JPS6484108A - Position detecting method for alignment mark - Google Patents

Position detecting method for alignment mark

Info

Publication number
JPS6484108A
JPS6484108A JP62243194A JP24319487A JPS6484108A JP S6484108 A JPS6484108 A JP S6484108A JP 62243194 A JP62243194 A JP 62243194A JP 24319487 A JP24319487 A JP 24319487A JP S6484108 A JPS6484108 A JP S6484108A
Authority
JP
Japan
Prior art keywords
alignment mark
signal
mark
mark part
overlaps
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62243194A
Other languages
Japanese (ja)
Other versions
JPH0663740B2 (en
Inventor
Tsutomu Miyatake
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Heavy Industries Ltd
Original Assignee
Sumitomo Heavy Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Heavy Industries Ltd filed Critical Sumitomo Heavy Industries Ltd
Priority to JP62243194A priority Critical patent/JPH0663740B2/en
Publication of JPS6484108A publication Critical patent/JPS6484108A/en
Publication of JPH0663740B2 publication Critical patent/JPH0663740B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Optical Transform (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

PURPOSE:To recognize the center position of the alignment mark even if the symmetry of the alignment mark is lost by shaping the alignment mark so that when one mark part is moved in parallel, it overlaps with the other mark part, and performing similarity pattern matching as to a signal generated by differentiating an image input signal. CONSTITUTION:The alignment mark consists of the two parts so that one mark part when moved in parallel overlaps with the other mark part. Those are picked up by a two-dimensional camera to obtain an analog image signal, which is converted into a digital signal. This signal is integrated synchronously to remove noises for S/N ratio improvement, and data compression is carried out. Then the signal after this processing is differentiated to extract the edge of the alignment mark. Then the similarity pattern matching processing based upon a specific equation is carried out for the differentiated data. The position where the result becomes maximum is recognized as the center position of the alignment mark.
JP62243194A 1987-09-28 1987-09-28 Alignment mark position detection method Expired - Fee Related JPH0663740B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62243194A JPH0663740B2 (en) 1987-09-28 1987-09-28 Alignment mark position detection method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62243194A JPH0663740B2 (en) 1987-09-28 1987-09-28 Alignment mark position detection method

Publications (2)

Publication Number Publication Date
JPS6484108A true JPS6484108A (en) 1989-03-29
JPH0663740B2 JPH0663740B2 (en) 1994-08-22

Family

ID=17100232

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62243194A Expired - Fee Related JPH0663740B2 (en) 1987-09-28 1987-09-28 Alignment mark position detection method

Country Status (1)

Country Link
JP (1) JPH0663740B2 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02304303A (en) * 1989-05-18 1990-12-18 Sumitomo Heavy Ind Ltd Position detecting device using sector fresnel zone plate
JPH0712520A (en) * 1990-12-27 1995-01-17 Internatl Business Mach Corp <Ibm> How to discover standards
EP0786702A3 (en) * 1996-01-11 1998-01-07 Ushiodenki Kabushiki Kaisha Process for pattern searching and a device for positioning of a mask to a workpiece
WO2005008753A1 (en) * 2003-05-23 2005-01-27 Nikon Corporation Template creation method and device, pattern detection method, position detection method and device, exposure method and device, device manufacturing method, and template creation program
JP2006226987A (en) * 2005-01-18 2006-08-31 Mitsutoyo Corp Photoelectric encoder and scale therefor
JP2013253803A (en) * 2012-06-05 2013-12-19 Takaoka Electric Mfg Co Ltd Film thickness measuring apparatus and film thickness measuring method
CN117276105A (en) * 2023-02-27 2023-12-22 魅杰光电科技(上海)有限公司 Measurement method of semiconductor registration error
CN117276104A (en) * 2023-02-27 2023-12-22 魅杰光电科技(上海)有限公司 Overlay measurement method applied to integrated circuits

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101310029B1 (en) * 2012-03-14 2013-09-24 삼성모바일디스플레이주식회사 Detecting method of alignment mark

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02304303A (en) * 1989-05-18 1990-12-18 Sumitomo Heavy Ind Ltd Position detecting device using sector fresnel zone plate
JPH0712520A (en) * 1990-12-27 1995-01-17 Internatl Business Mach Corp <Ibm> How to discover standards
EP0786702A3 (en) * 1996-01-11 1998-01-07 Ushiodenki Kabushiki Kaisha Process for pattern searching and a device for positioning of a mask to a workpiece
WO2005008753A1 (en) * 2003-05-23 2005-01-27 Nikon Corporation Template creation method and device, pattern detection method, position detection method and device, exposure method and device, device manufacturing method, and template creation program
JP2006226987A (en) * 2005-01-18 2006-08-31 Mitsutoyo Corp Photoelectric encoder and scale therefor
JP2013253803A (en) * 2012-06-05 2013-12-19 Takaoka Electric Mfg Co Ltd Film thickness measuring apparatus and film thickness measuring method
CN117276105A (en) * 2023-02-27 2023-12-22 魅杰光电科技(上海)有限公司 Measurement method of semiconductor registration error
CN117276104A (en) * 2023-02-27 2023-12-22 魅杰光电科技(上海)有限公司 Overlay measurement method applied to integrated circuits
CN117276105B (en) * 2023-02-27 2024-06-11 魅杰光电科技(上海)有限公司 Measurement Method of Semiconductor Overlay Error
CN117276104B (en) * 2023-02-27 2024-06-18 魅杰光电科技(上海)有限公司 Overlay measurement method applied to integrated circuit

Also Published As

Publication number Publication date
JPH0663740B2 (en) 1994-08-22

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees