JPS6484407A - Manufacture of thin film magnetic head - Google Patents

Abstract

PURPOSE:To prevent abnormal discharge between a substrate and a holder by performing sputtering while keeping the potentials of the metallic holder and the surface of the insulation substrate nearly equal. CONSTITUTION:A target 23 connected to a high frequency power source 22 is provided in a vacuum housing 21, and an electrode 24 is provided so as to be opposed to it. The electrode 24 is usually earthed through a lead wire 29, and the insulation substrate 25 is placed on the electrode 24, and the substrate 25 is fixed and held to the electrode 24 by the metallic holder 26. In a case that the sputtering is performed, it is performed in the state that the lead wire 29 is cut off at a point X so as to disconnected it from earthing. Thus, the electrode 24 is cut off from electric conduction from an external part together with the insulation substrate 25 and the metallic holder 26, placed on it, and comes into a floating state electrically. By performing the sputtering in this state, a metallic film (or insulation film) 27 is formed on the insulation substrate 25, and an electron 28 is charged on the surface during the formation, but since the electrode 24 is being disconnected from the earthing at that time, the potentials of the mettalic film (insulation film) 27 and the holder 26 on the insulation substrate, placed on the electrode 24, are nearly equal, and the discharge never occurs between both.