JPS6484694A - Manufacture of insulating substrate provided with conductive layer - Google Patents
Manufacture of insulating substrate provided with conductive layerInfo
- Publication number
- JPS6484694A JPS6484694A JP62241942A JP24194287A JPS6484694A JP S6484694 A JPS6484694 A JP S6484694A JP 62241942 A JP62241942 A JP 62241942A JP 24194287 A JP24194287 A JP 24194287A JP S6484694 A JPS6484694 A JP S6484694A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- conductive layer
- resist layer
- manufacture
- insulating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title abstract 7
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000002184 metal Substances 0.000 abstract 2
- 238000009713 electroplating Methods 0.000 abstract 1
- 239000011810 insulating material Substances 0.000 abstract 1
- 230000001788 irregular Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000012778 molding material Substances 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 239000007787 solid Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Electric Cables (AREA)
Abstract
PURPOSE:To form readily a conductive layer on a three-dimensional surface by forming an insulating material on a mold surface whereon irregularities process is conducted and a conductive layer is formed. CONSTITUTION:After a resist layer 2 is formed on a conductive plate material (a temporary substrate) 1, irregular shape 1a is formed by press working. A cable way 3 is formed onto the temporary substrate 1 by electroplating. The temporary substrate 1 is arranged within a metal mold 4 and insulating molding material (resin) is injected to form an insulating substrate 6 which has a solid surface. The cable way 3 and a resist layer 2 are transcribed to the substrate 6. After the substrate 6 is removed from the metal mold 4, the resist layer 2 is eliminated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62241942A JPS6484694A (en) | 1987-09-26 | 1987-09-26 | Manufacture of insulating substrate provided with conductive layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62241942A JPS6484694A (en) | 1987-09-26 | 1987-09-26 | Manufacture of insulating substrate provided with conductive layer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6484694A true JPS6484694A (en) | 1989-03-29 |
Family
ID=17081859
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62241942A Pending JPS6484694A (en) | 1987-09-26 | 1987-09-26 | Manufacture of insulating substrate provided with conductive layer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6484694A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03151259A (en) * | 1989-11-09 | 1991-06-27 | Sekisui Chem Co Ltd | Laminated sheet |
| US6945707B2 (en) | 2000-04-21 | 2005-09-20 | Seiko Epson Corporation | Three-dimensional mounted assembly and optical transmission device |
| JP2007129273A (en) * | 2007-02-23 | 2007-05-24 | Matsushita Electric Works Ltd | Manufacturing method of LED display device |
-
1987
- 1987-09-26 JP JP62241942A patent/JPS6484694A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03151259A (en) * | 1989-11-09 | 1991-06-27 | Sekisui Chem Co Ltd | Laminated sheet |
| US6945707B2 (en) | 2000-04-21 | 2005-09-20 | Seiko Epson Corporation | Three-dimensional mounted assembly and optical transmission device |
| US7040817B2 (en) | 2000-04-21 | 2006-05-09 | Seiko Epson Corporation | Three-dimensional mounted assembly and optical transmission device |
| JP2007129273A (en) * | 2007-02-23 | 2007-05-24 | Matsushita Electric Works Ltd | Manufacturing method of LED display device |
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