JPS6484700A - Electronic computer - Google Patents

Electronic computer

Info

Publication number
JPS6484700A
JPS6484700A JP62240736A JP24073687A JPS6484700A JP S6484700 A JPS6484700 A JP S6484700A JP 62240736 A JP62240736 A JP 62240736A JP 24073687 A JP24073687 A JP 24073687A JP S6484700 A JPS6484700 A JP S6484700A
Authority
JP
Japan
Prior art keywords
module
pipe
lines
cooling water
uniform
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62240736A
Other languages
Japanese (ja)
Inventor
Takuji Torii
Kenji Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP62240736A priority Critical patent/JPS6484700A/en
Publication of JPS6484700A publication Critical patent/JPS6484700A/en
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To keep temperature rise of each module at a relatively uniform value and to keep a temperature of each LSI device at a uniform value by connecting a cooling water pipe to each module in parallel. CONSTITUTION:Modules form four lines; water of the upper two lines thereof is supplied and drained from a cooling water inlet tube 3 and an outlet tube 4 provided above. Water of the lower two lines is supplied and drained from a cooling water inlet tube 3 and an outlet tube 4 provided below. As for the modules 2 of the lower two lines, for example, the bottom module is provided with a pipe 5 and a pipe 6 at its left side and the upper module is provided with a pipe 5 and a pipe 6 at its right side. Since water runs in parallel to each module 2, each module can be changed without being affected by a piping of the above or below module. The temperature rise of each module 2 is thereby kept uniform thus keeping the temperature of each LSI device uniform.
JP62240736A 1987-09-28 1987-09-28 Electronic computer Pending JPS6484700A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62240736A JPS6484700A (en) 1987-09-28 1987-09-28 Electronic computer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62240736A JPS6484700A (en) 1987-09-28 1987-09-28 Electronic computer

Publications (1)

Publication Number Publication Date
JPS6484700A true JPS6484700A (en) 1989-03-29

Family

ID=17063935

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62240736A Pending JPS6484700A (en) 1987-09-28 1987-09-28 Electronic computer

Country Status (1)

Country Link
JP (1) JPS6484700A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6621707B2 (en) 1998-08-11 2003-09-16 Fujitsu Limited Liquid-cooled electronic apparatus
JP2008509542A (en) * 2004-06-30 2008-03-27 テラダイン・インコーポレーテッド Parallel flow heat exchanger
JP2008128839A (en) * 2006-11-21 2008-06-05 Nippon Eng Kk Burn-in device
JP2018074100A (en) * 2016-11-04 2018-05-10 富士通株式会社 Rack-mount information processing equipment
CN109637989A (en) * 2019-01-30 2019-04-16 大禹电气科技股份有限公司 A kind of parallel pipeline liquid cooling heat radiator for high-power IGBT heat dissipation

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6621707B2 (en) 1998-08-11 2003-09-16 Fujitsu Limited Liquid-cooled electronic apparatus
JP2008509542A (en) * 2004-06-30 2008-03-27 テラダイン・インコーポレーテッド Parallel flow heat exchanger
JP2008128839A (en) * 2006-11-21 2008-06-05 Nippon Eng Kk Burn-in device
JP2018074100A (en) * 2016-11-04 2018-05-10 富士通株式会社 Rack-mount information processing equipment
CN109637989A (en) * 2019-01-30 2019-04-16 大禹电气科技股份有限公司 A kind of parallel pipeline liquid cooling heat radiator for high-power IGBT heat dissipation

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