JPS648637A - Semiconductor wafer - Google Patents
Semiconductor waferInfo
- Publication number
- JPS648637A JPS648637A JP16226287A JP16226287A JPS648637A JP S648637 A JPS648637 A JP S648637A JP 16226287 A JP16226287 A JP 16226287A JP 16226287 A JP16226287 A JP 16226287A JP S648637 A JPS648637 A JP S648637A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- various types
- information
- test
- probe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Semiconductor Integrated Circuits (AREA)
- Non-Volatile Memory (AREA)
Abstract
PURPOSE:To realize a markingless, to shorten steps, and to efficiently deliver data surely to ensuing steps by forming a memory cell capable of recording data on result of a wafer test and various types of information on a manufacturing device together with a plurality of chips in the same wafer. CONSTITUTION:When all chips in one wafer are completely measured in step S3, in step S4, data of test result of the wafer stored in a memory of an IC tester or a wafer probe is transferred together with various types of information on, such as lot No. and the like through a probe used for the test or a probe prepared separately to a nonvolatile memory cell 6 of the wafer 1. A time required for this transfer may be much shorter than a writing time in a recording medium. When necessary number of wafers are completed in this manner, the wafer is fed to the ensuing step in step S6. A device of the following step may transfer the various types of information of the wafer from the nonvolatile memory cell in the wafer through the probe to its own memory. Thus, the result of the wafer test and the various types of information can be recorded 1:1 to the wafer, a markingless is realized, and the steps can be shortened.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16226287A JPS648637A (en) | 1987-07-01 | 1987-07-01 | Semiconductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16226287A JPS648637A (en) | 1987-07-01 | 1987-07-01 | Semiconductor wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS648637A true JPS648637A (en) | 1989-01-12 |
Family
ID=15751101
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16226287A Pending JPS648637A (en) | 1987-07-01 | 1987-07-01 | Semiconductor wafer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS648637A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04152543A (en) * | 1990-10-16 | 1992-05-26 | Agency Of Ind Science & Technol | Integrated circuit structure body provided with self-inspection function; sorting method of good integrated circuit chip by using it |
-
1987
- 1987-07-01 JP JP16226287A patent/JPS648637A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04152543A (en) * | 1990-10-16 | 1992-05-26 | Agency Of Ind Science & Technol | Integrated circuit structure body provided with self-inspection function; sorting method of good integrated circuit chip by using it |
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