JPS6486535A - Wafer handling device - Google Patents

Wafer handling device

Info

Publication number
JPS6486535A
JPS6486535A JP62242659A JP24265987A JPS6486535A JP S6486535 A JPS6486535 A JP S6486535A JP 62242659 A JP62242659 A JP 62242659A JP 24265987 A JP24265987 A JP 24265987A JP S6486535 A JPS6486535 A JP S6486535A
Authority
JP
Japan
Prior art keywords
wafer
jig
susceptor
vacuum
fork
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62242659A
Other languages
Japanese (ja)
Inventor
Yoshiaki Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP62242659A priority Critical patent/JPS6486535A/en
Publication of JPS6486535A publication Critical patent/JPS6486535A/en
Pending legal-status Critical Current

Links

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE:To enable handling operation by the contact of a wafer sucking jig only with the rear of a wafer, and to prevent the damage to the surface of the wafer by providing a wafer susceptor, the jig and a transfer means moving the wafer to a fixed position. CONSTITUTION:A susceptor 3 is overturned from a hinge section 8, and a vacuum sucking jig 10 as a handling jig is passed through a through-hole 7 bored to the susceptor 3. On the other hand, a wafer 5 is placed onto a fork 9 while the crystal growth face of the surface is directed upward, and being forwarded from a pretreatment process. The nose section of the vacuum suction 10 is made to collide with the rear of the wafer 5, and the rear of the wafer is sucked under a vacuum. The fork 9 is returned to an original position while the wafer 5 is housed into a wafer housing section 4 by downward moving the vacuum suction 10. Accordingly, a contact with the surface of the wafer of the handling jig when the wafer is mounted to or dismantled from the wafer susceptor is prevented.
JP62242659A 1987-09-29 1987-09-29 Wafer handling device Pending JPS6486535A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62242659A JPS6486535A (en) 1987-09-29 1987-09-29 Wafer handling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62242659A JPS6486535A (en) 1987-09-29 1987-09-29 Wafer handling device

Publications (1)

Publication Number Publication Date
JPS6486535A true JPS6486535A (en) 1989-03-31

Family

ID=17092331

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62242659A Pending JPS6486535A (en) 1987-09-29 1987-09-29 Wafer handling device

Country Status (1)

Country Link
JP (1) JPS6486535A (en)

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