JPS6486543A - Semiconductor mounting cooling structure - Google Patents

Semiconductor mounting cooling structure

Info

Publication number
JPS6486543A
JPS6486543A JP24253087A JP24253087A JPS6486543A JP S6486543 A JPS6486543 A JP S6486543A JP 24253087 A JP24253087 A JP 24253087A JP 24253087 A JP24253087 A JP 24253087A JP S6486543 A JPS6486543 A JP S6486543A
Authority
JP
Japan
Prior art keywords
semiconductor element
cooling body
metallic
heat
external connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP24253087A
Other languages
Japanese (ja)
Other versions
JPH0724294B2 (en
Inventor
Satoshi Ogura
Takao Funamoto
Ryoichi Kajiwara
Mitsuo Kato
Takashi Fukumaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP24253087A priority Critical patent/JPH0724294B2/en
Publication of JPS6486543A publication Critical patent/JPS6486543A/en
Publication of JPH0724294B2 publication Critical patent/JPH0724294B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Landscapes

  • Combinations Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

PURPOSE:To reduce stress applied to a terminal for a semiconductor element, and to remove heat generated from a semiconductor effectively by a method wherein a pad forming surface for external connection of the semiconductor element is arranged upward, the pad and a flexible printed circuit are soldered by a beam heat source from an upper section, the underside of the semiconductor element is joined with a cooling body and heat is absorbed by the cooling body. CONSTITUTION:A pad forming surface for external connection in a semiconductor element 1 is disposed upward, that is, in a face-up manner, and the semiconductor element 1 is insulated electrically from a metallic cooling body 7 through an adhesive layer 2, and joined so that the conduction of heat is improved. The metallic cooling body 7 is composed of a metal having superior heat conduction, cooling holes 8 are formed into the metallic cooling body 7 by using a metallic joining method, and a refrigerant is flowed into the cooling holes 8 and the metallic cooling body is cooled. Pads for external connection for the semiconductor element 1 and multilayer interconnections 10 are soldered by semiconductor element terminals 3 and multilayer interconnection terminals 5 through flexible printed circuits 4. Accordingly, a joining section having high reliability is acquired.
JP24253087A 1987-09-29 1987-09-29 Semiconductor mounted cooling structure Expired - Lifetime JPH0724294B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24253087A JPH0724294B2 (en) 1987-09-29 1987-09-29 Semiconductor mounted cooling structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24253087A JPH0724294B2 (en) 1987-09-29 1987-09-29 Semiconductor mounted cooling structure

Publications (2)

Publication Number Publication Date
JPS6486543A true JPS6486543A (en) 1989-03-31
JPH0724294B2 JPH0724294B2 (en) 1995-03-15

Family

ID=17090483

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24253087A Expired - Lifetime JPH0724294B2 (en) 1987-09-29 1987-09-29 Semiconductor mounted cooling structure

Country Status (1)

Country Link
JP (1) JPH0724294B2 (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0587982U (en) * 1992-04-30 1993-11-26 太陽誘電株式会社 Hybrid integrated circuit device having heat generating components
WO1994015366A1 (en) * 1992-12-24 1994-07-07 Tadahiro Ohmi Semiconductor device
JP2005228798A (en) * 2004-02-10 2005-08-25 Seiko Epson Corp Substrate, light source device and projector
JP2008192814A (en) * 2007-02-05 2008-08-21 Fujitsu Ltd Printed wiring board, electronic device, and printed wiring board manufacturing method
JP2008205250A (en) * 2007-02-21 2008-09-04 Fujitsu Ltd Cold plate and electronic device
JP2008311397A (en) * 2007-06-14 2008-12-25 Nec Toppan Circuit Solutions Inc Semiconductor device mounting structure, printed wiring board, and manufacturing method thereof
JP2009512215A (en) * 2005-10-13 2009-03-19 インテル・コーポレーション Integrated microchannel for 3D through silicon architecture
CN112638029A (en) * 2020-12-23 2021-04-09 华为技术有限公司 Circuit board
EP4266363A1 (en) * 2022-04-21 2023-10-25 Airbus SAS Improved power component for electric or hybrid aircraft
WO2025022657A1 (en) * 2023-07-27 2025-01-30 日立Astemo株式会社 Electronic control device

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0587982U (en) * 1992-04-30 1993-11-26 太陽誘電株式会社 Hybrid integrated circuit device having heat generating components
WO1994015366A1 (en) * 1992-12-24 1994-07-07 Tadahiro Ohmi Semiconductor device
EP0709897A4 (en) * 1992-12-24 1997-05-28 Tadahiro Ohmi SEMICONDUCTOR DEVICE
US5650650A (en) * 1992-12-24 1997-07-22 Tadahiro Ohmi High speed semiconductor device with a metallic substrate
JP2005228798A (en) * 2004-02-10 2005-08-25 Seiko Epson Corp Substrate, light source device and projector
JP2009512215A (en) * 2005-10-13 2009-03-19 インテル・コーポレーション Integrated microchannel for 3D through silicon architecture
JP2008192814A (en) * 2007-02-05 2008-08-21 Fujitsu Ltd Printed wiring board, electronic device, and printed wiring board manufacturing method
JP2008205250A (en) * 2007-02-21 2008-09-04 Fujitsu Ltd Cold plate and electronic device
JP2008311397A (en) * 2007-06-14 2008-12-25 Nec Toppan Circuit Solutions Inc Semiconductor device mounting structure, printed wiring board, and manufacturing method thereof
CN112638029A (en) * 2020-12-23 2021-04-09 华为技术有限公司 Circuit board
US12075558B2 (en) 2020-12-23 2024-08-27 Huawei Digital Power Technologies Co., Ltd. Printed circuit board
EP4266363A1 (en) * 2022-04-21 2023-10-25 Airbus SAS Improved power component for electric or hybrid aircraft
WO2025022657A1 (en) * 2023-07-27 2025-01-30 日立Astemo株式会社 Electronic control device

Also Published As

Publication number Publication date
JPH0724294B2 (en) 1995-03-15

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