JPS648734U - - Google Patents

Info

Publication number
JPS648734U
JPS648734U JP1987102559U JP10255987U JPS648734U JP S648734 U JPS648734 U JP S648734U JP 1987102559 U JP1987102559 U JP 1987102559U JP 10255987 U JP10255987 U JP 10255987U JP S648734 U JPS648734 U JP S648734U
Authority
JP
Japan
Prior art keywords
wired
wiring structure
electrical wiring
conductive particles
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987102559U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0526747Y2 (cs
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987102559U priority Critical patent/JPH0526747Y2/ja
Publication of JPS648734U publication Critical patent/JPS648734U/ja
Application granted granted Critical
Publication of JPH0526747Y2 publication Critical patent/JPH0526747Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/074—Connecting or disconnecting of anisotropic conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers

Landscapes

  • Multi-Conductor Connections (AREA)
  • Wire Bonding (AREA)
JP1987102559U 1987-07-03 1987-07-03 Expired - Lifetime JPH0526747Y2 (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987102559U JPH0526747Y2 (cs) 1987-07-03 1987-07-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987102559U JPH0526747Y2 (cs) 1987-07-03 1987-07-03

Publications (2)

Publication Number Publication Date
JPS648734U true JPS648734U (cs) 1989-01-18
JPH0526747Y2 JPH0526747Y2 (cs) 1993-07-07

Family

ID=31332576

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987102559U Expired - Lifetime JPH0526747Y2 (cs) 1987-07-03 1987-07-03

Country Status (1)

Country Link
JP (1) JPH0526747Y2 (cs)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003031030A (ja) * 2001-07-12 2003-01-31 Sekisui Chem Co Ltd 微粒子配置導電接続フィルム、微粒子配置導電接続フィルムの製造方法及び導電接続構造体

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61279139A (ja) * 1985-06-04 1986-12-09 Nec Corp 混成集積回路装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61279139A (ja) * 1985-06-04 1986-12-09 Nec Corp 混成集積回路装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003031030A (ja) * 2001-07-12 2003-01-31 Sekisui Chem Co Ltd 微粒子配置導電接続フィルム、微粒子配置導電接続フィルムの製造方法及び導電接続構造体

Also Published As

Publication number Publication date
JPH0526747Y2 (cs) 1993-07-07

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