JPS648742U - - Google Patents
Info
- Publication number
- JPS648742U JPS648742U JP1987101626U JP10162687U JPS648742U JP S648742 U JPS648742 U JP S648742U JP 1987101626 U JP1987101626 U JP 1987101626U JP 10162687 U JP10162687 U JP 10162687U JP S648742 U JPS648742 U JP S648742U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- external
- soldering
- notches
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987101626U JPS648742U (cs) | 1987-07-01 | 1987-07-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987101626U JPS648742U (cs) | 1987-07-01 | 1987-07-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS648742U true JPS648742U (cs) | 1989-01-18 |
Family
ID=31330790
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987101626U Pending JPS648742U (cs) | 1987-07-01 | 1987-07-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS648742U (cs) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012044208A (ja) * | 2011-10-21 | 2012-03-01 | Mitsubishi Electric Corp | パワー半導体モジュール |
-
1987
- 1987-07-01 JP JP1987101626U patent/JPS648742U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012044208A (ja) * | 2011-10-21 | 2012-03-01 | Mitsubishi Electric Corp | パワー半導体モジュール |