JPS6487667A - Adhesive composition with good oil-surface adhesivity and adhesive taking advantage of said feature - Google Patents
Adhesive composition with good oil-surface adhesivity and adhesive taking advantage of said featureInfo
- Publication number
- JPS6487667A JPS6487667A JP24340987A JP24340987A JPS6487667A JP S6487667 A JPS6487667 A JP S6487667A JP 24340987 A JP24340987 A JP 24340987A JP 24340987 A JP24340987 A JP 24340987A JP S6487667 A JPS6487667 A JP S6487667A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- 10pts
- composition
- bisphenol
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 title abstract 5
- 239000000853 adhesive Substances 0.000 title 2
- 230000001070 adhesive effect Effects 0.000 title 2
- 239000003822 epoxy resin Substances 0.000 abstract 6
- 229920000647 polyepoxide Polymers 0.000 abstract 6
- -1 guanidine compound Chemical class 0.000 abstract 4
- CHJJGSNFBQVOTG-UHFFFAOYSA-N N-methyl-guanidine Natural products CNC(N)=N CHJJGSNFBQVOTG-UHFFFAOYSA-N 0.000 abstract 2
- 229920000459 Nitrile rubber Polymers 0.000 abstract 2
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 abstract 2
- 125000002777 acetyl group Chemical class [H]C([H])([H])C(*)=O 0.000 abstract 2
- ZRALSGWEFCBTJO-UHFFFAOYSA-N anhydrous guanidine Natural products NC(N)=N ZRALSGWEFCBTJO-UHFFFAOYSA-N 0.000 abstract 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 abstract 2
- SWSQBOPZIKWTGO-UHFFFAOYSA-N dimethylaminoamidine Natural products CN(C)C(N)=N SWSQBOPZIKWTGO-UHFFFAOYSA-N 0.000 abstract 2
- 229920002554 vinyl polymer Polymers 0.000 abstract 2
- 229930185605 Bisphenol Natural products 0.000 abstract 1
- 239000004202 carbamide Substances 0.000 abstract 1
- 235000014113 dietary fatty acids Nutrition 0.000 abstract 1
- 229930195729 fatty acid Natural products 0.000 abstract 1
- 239000000194 fatty acid Substances 0.000 abstract 1
- 150000004665 fatty acids Chemical class 0.000 abstract 1
- 239000011256 inorganic filler Substances 0.000 abstract 1
- 229910003475 inorganic filler Inorganic materials 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 150000003839 salts Chemical class 0.000 abstract 1
- 229920003051 synthetic elastomer Polymers 0.000 abstract 1
- 239000005061 synthetic rubber Substances 0.000 abstract 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Paints Or Removers (AREA)
Abstract
PURPOSE:To obtain the titled composition outstanding in film formability, by incorporating a specific epoxy resin composition with polyvinyl acetal, synthetic rubber, guanidine compound etc. CONSTITUTION:The objective composition can be obtained by incorporating (A) 100pts.wt. of an epoxy resin composition comprising (i) a precondensed epoxy resin containing carboxyl group-contg. liquid acrylonitrile-butadiene rubber/bisphenol compound/bisphenol-glycidyl ether type epoxy resin (ii) dinner acid- modified and/or dibasic acid-modified epoxy resin(s) and (iii) a bisphenol-glycidyl ether type epoxy resin with (B) 5-10pts.wt. of polyvinyl acetal, (C) 3-10pts.wt. of carboxyl group-contg. acrylonitrile-butadiene rubber, (D) a guanidine compound, (E) a urea compound, (F) 4-10pts.wt. of an organic fatty acid metal salt and (G) 10-50pts.wt. of inorganic filler.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24340987A JPS6487667A (en) | 1987-09-28 | 1987-09-28 | Adhesive composition with good oil-surface adhesivity and adhesive taking advantage of said feature |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24340987A JPS6487667A (en) | 1987-09-28 | 1987-09-28 | Adhesive composition with good oil-surface adhesivity and adhesive taking advantage of said feature |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6487667A true JPS6487667A (en) | 1989-03-31 |
Family
ID=17103432
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24340987A Pending JPS6487667A (en) | 1987-09-28 | 1987-09-28 | Adhesive composition with good oil-surface adhesivity and adhesive taking advantage of said feature |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6487667A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0702070A3 (en) * | 1994-09-13 | 1996-08-07 | Mitsui Mining & Smelting Co | Glue for copper sheets and copper sheets with adhesive backing |
| US6015865A (en) * | 1991-06-26 | 2000-01-18 | Henkel-Teroson Gmbh | Hot melt adhesive from epoxy resin/amine-terminated polyalkylene glycol adduct |
| JP2008522391A (en) * | 2004-11-29 | 2008-06-26 | テサ・アクチエンゲゼルシヤフト | Adhesive strip based on thermally activated and carboxylated nitrile rubber for bonding electronic components and strip conductors together |
| US7750107B2 (en) * | 2003-05-30 | 2010-07-06 | Alzchem Trostberg Gmbh | Substituted urea accelerator with dicyandiamide for epoxy resin systems |
| JP2014111694A (en) * | 2012-12-05 | 2014-06-19 | Kyocera Chemical Corp | Thin film adhesive sheet and method for producing the same |
| JP2016138273A (en) * | 2007-11-14 | 2016-08-04 | シーカ・テクノロジー・アーゲー | Heat-curing epoxy resin composition containing non-aromatic urea as accelerant |
-
1987
- 1987-09-28 JP JP24340987A patent/JPS6487667A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6015865A (en) * | 1991-06-26 | 2000-01-18 | Henkel-Teroson Gmbh | Hot melt adhesive from epoxy resin/amine-terminated polyalkylene glycol adduct |
| EP0702070A3 (en) * | 1994-09-13 | 1996-08-07 | Mitsui Mining & Smelting Co | Glue for copper sheets and copper sheets with adhesive backing |
| US5707729A (en) * | 1994-09-13 | 1998-01-13 | Mitsui Mining & Smelting Co., Ltd. | Adhesive for copper foils and adhesive-backed copper foil |
| US7750107B2 (en) * | 2003-05-30 | 2010-07-06 | Alzchem Trostberg Gmbh | Substituted urea accelerator with dicyandiamide for epoxy resin systems |
| JP2008522391A (en) * | 2004-11-29 | 2008-06-26 | テサ・アクチエンゲゼルシヤフト | Adhesive strip based on thermally activated and carboxylated nitrile rubber for bonding electronic components and strip conductors together |
| JP2016138273A (en) * | 2007-11-14 | 2016-08-04 | シーカ・テクノロジー・アーゲー | Heat-curing epoxy resin composition containing non-aromatic urea as accelerant |
| US11198754B2 (en) | 2007-11-14 | 2021-12-14 | Sika Technology Ag | Heat-curing epoxy resin composition containing non-aromatic ureas as accelerator |
| JP2014111694A (en) * | 2012-12-05 | 2014-06-19 | Kyocera Chemical Corp | Thin film adhesive sheet and method for producing the same |
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