JPS6490797A - Manufacture of ic card - Google Patents

Manufacture of ic card

Info

Publication number
JPS6490797A
JPS6490797A JP62249391A JP24939187A JPS6490797A JP S6490797 A JPS6490797 A JP S6490797A JP 62249391 A JP62249391 A JP 62249391A JP 24939187 A JP24939187 A JP 24939187A JP S6490797 A JPS6490797 A JP S6490797A
Authority
JP
Japan
Prior art keywords
frame
film
adhered
press
front panel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62249391A
Other languages
Japanese (ja)
Inventor
Hirohide Takahashi
Toyokazu Inaba
Akira Murakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP62249391A priority Critical patent/JPS6490797A/en
Publication of JPS6490797A publication Critical patent/JPS6490797A/en
Pending legal-status Critical Current

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  • Credit Cards Or The Like (AREA)

Abstract

PURPOSE: To surely prevent a cover film from being peeled off by press-molding in advance a frame film forming a frame intermediate layer within the predetermined thickness and mounting the press-molded frame film between a front panel and back panel. CONSTITUTION: An aperture section 31-1 and press-molding section 31-2 are formed on a frame film 31. A back panel 33 is adhered to a cover film 32. The frame film 31 and press-molding section 31-2 are superimposed on the frame film 34 and back panel 33, respectively. A substrate 35 is coupled with the aperture section 31-1 and adhered on the back panel 33. The front panel 29 is adhered on the substrate 35 and the end of the front panel 39 is adhered on the press-molding section 31-2 of the frame film 31. A cover film 41 is superimposed on the front panel 39 and the frame film 40. Thereafter, a portion forming an IC card frame is heat-pressed and heat-sealed using a heat- pressurizing device 42 adhered to the front panel 39. Being punched out by an outer edge pressuring section 42-1, an IC card is completed.
JP62249391A 1987-10-02 1987-10-02 Manufacture of ic card Pending JPS6490797A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62249391A JPS6490797A (en) 1987-10-02 1987-10-02 Manufacture of ic card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62249391A JPS6490797A (en) 1987-10-02 1987-10-02 Manufacture of ic card

Publications (1)

Publication Number Publication Date
JPS6490797A true JPS6490797A (en) 1989-04-07

Family

ID=17192299

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62249391A Pending JPS6490797A (en) 1987-10-02 1987-10-02 Manufacture of ic card

Country Status (1)

Country Link
JP (1) JPS6490797A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001331775A (en) * 2000-05-22 2001-11-30 Dainippon Printing Co Ltd Method and apparatus for manufacturing contact / contactless shared IC card

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001331775A (en) * 2000-05-22 2001-11-30 Dainippon Printing Co Ltd Method and apparatus for manufacturing contact / contactless shared IC card

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