JPS649171U - - Google Patents

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Publication number
JPS649171U
JPS649171U JP10407987U JP10407987U JPS649171U JP S649171 U JPS649171 U JP S649171U JP 10407987 U JP10407987 U JP 10407987U JP 10407987 U JP10407987 U JP 10407987U JP S649171 U JPS649171 U JP S649171U
Authority
JP
Japan
Prior art keywords
spring
rod
stopper
separators
coming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10407987U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10407987U priority Critical patent/JPS649171U/ja
Publication of JPS649171U publication Critical patent/JPS649171U/ja
Pending legal-status Critical Current

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Description

【図面の簡単な説明】[Brief explanation of the drawing]

図面はこの考案の一実施例を示し、第１図はス
プリング収容具の前方斜視図、第２図は収容動作
を示す収容具の側面斜視図、第３図はスプリング
を収容した収容具の側面斜視図である。 ２…スプリング、３…通し棒、３ａ…ストツパ
、９…セパレータ、９ａ…挿通孔、１２…抜止め
キヤツプ。 The drawings show an embodiment of this invention, with Fig. 1 being a front perspective view of the spring accommodating device, Fig. 2 being a side perspective view of the accommodating device showing the accommodation operation, and Fig. 3 being a side view of the accommodating device housing the spring. FIG. 2...Spring, 3...Threading rod, 3a...Stopper, 9...Separator, 9a...Insertion hole, 12...Removal prevention cap.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] スプリングの小径環状部より小径の通し棒基端
部にスプリング抜止め用のストツパを形成し、該
通し棒に、所定形状にコイリングされたスプリン
グと、該スプリングより若干大きいセパレータと
を交互に複数個挿嵌したスプリング収容具。 A stopper for preventing the spring from coming off is formed at the base end of a through rod having a smaller diameter than the small diameter annular portion of the spring, and a plurality of springs coiled into a predetermined shape and separators slightly larger than the spring are alternately arranged on the through rod. Insert spring housing.
JP10407987U 1987-07-06 1987-07-06 Pending JPS649171U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10407987U JPS649171U (en) 1987-07-06 1987-07-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10407987U JPS649171U (en) 1987-07-06 1987-07-06

Publications (1)

Publication Number Publication Date
JPS649171U true JPS649171U (en) 1989-01-18

Family

ID=31335479

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10407987U Pending JPS649171U (en) 1987-07-06 1987-07-06

Country Status (1)

Country Link
JP (1) JPS649171U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0338051A (en) * 1989-06-29 1991-02-19 Applied Materials Inc Handling method and device for semiconductor wafer

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS628979B2 (en) * 1981-09-29 1987-02-25 Fujitsu Ltd

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS628979B2 (en) * 1981-09-29 1987-02-25 Fujitsu Ltd

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0338051A (en) * 1989-06-29 1991-02-19 Applied Materials Inc Handling method and device for semiconductor wafer

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