JPS649646A - Cooling module - Google Patents

Cooling module

Info

Publication number
JPS649646A
JPS649646A JP62165825A JP16582587A JPS649646A JP S649646 A JPS649646 A JP S649646A JP 62165825 A JP62165825 A JP 62165825A JP 16582587 A JP16582587 A JP 16582587A JP S649646 A JPS649646 A JP S649646A
Authority
JP
Japan
Prior art keywords
heat
cooling
liquid
dissipating
pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62165825A
Other languages
Japanese (ja)
Inventor
Masahiro Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP62165825A priority Critical patent/JPS649646A/en
Publication of JPS649646A publication Critical patent/JPS649646A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07354—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/341—Dispositions of die-attach connectors, e.g. layouts
    • H10W72/347—Dispositions of multiple die-attach connectors

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To make it possible to display high cooling efficiency without increasing the area of a cooling plate and the flow rate of a cooling liquid by a method wherein a heat-dissipating structure, protruding in the flow passage, to be used to supply a cooling liquid is provided against the heat-dissipating surface of a high density integrated element. CONSTITUTION:On the main body 12 of the title cooling module, a cooling-liquid circulating liquid passage 12b is formed, an aperture 12a of specific size is provided at the position opposing to each LSi 1-1 mounted on a printed board, and a pipe 4-1 for injection and exhaust of a cooling liquid is provided at both ends of the liquid passage. On a cooling structure 13, a heat-dissipating part 13-2, having the length with which its tip edge protrudes into the liquid passage 12b when it is attached to the main body 12 and also having a large surface area by laminating, for example, on the tip of a heat pipe 13-1, a disc consisting of the metal or ceramic of high heat conductivity is formed. Said heat pipe 13-1 is droopingly provided on the other end face of the heat transmission fitting 13-3 consisting of a highly heat conducting metal such as copper, for example, on which a contact surface 13-3a contacting to the LSi 1-1 is provided on cone end surface, and a refrigerant 13-6 of low boiling point is sealed into the interior of the heat pipe 13-1.
JP62165825A 1987-07-01 1987-07-01 Cooling module Pending JPS649646A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62165825A JPS649646A (en) 1987-07-01 1987-07-01 Cooling module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62165825A JPS649646A (en) 1987-07-01 1987-07-01 Cooling module

Publications (1)

Publication Number Publication Date
JPS649646A true JPS649646A (en) 1989-01-12

Family

ID=15819716

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62165825A Pending JPS649646A (en) 1987-07-01 1987-07-01 Cooling module

Country Status (1)

Country Link
JP (1) JPS649646A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5035974A (en) * 1988-06-16 1991-07-30 Fuji Photo Film Co., Ltd. Light-image forming material
CN105101753A (en) * 2015-08-12 2015-11-25 东莞市努谢尔环境设备科技有限公司 Aluminum profile, loop heat pipe system thereof and electrical cooling backplane
CN105118811A (en) * 2015-07-27 2015-12-02 电子科技大学 Temperature equalizing device adopting vapor chamber and microchannel for radiating multi-heat-source device
WO2024017042A1 (en) * 2022-07-20 2024-01-25 岚图汽车科技有限公司 Cooling device, central control unit, and automobile

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5035974A (en) * 1988-06-16 1991-07-30 Fuji Photo Film Co., Ltd. Light-image forming material
CN105118811A (en) * 2015-07-27 2015-12-02 电子科技大学 Temperature equalizing device adopting vapor chamber and microchannel for radiating multi-heat-source device
CN105101753A (en) * 2015-08-12 2015-11-25 东莞市努谢尔环境设备科技有限公司 Aluminum profile, loop heat pipe system thereof and electrical cooling backplane
WO2024017042A1 (en) * 2022-07-20 2024-01-25 岚图汽车科技有限公司 Cooling device, central control unit, and automobile

Similar Documents

Publication Publication Date Title
US6661664B2 (en) Electronic module with high cooling power
US5424916A (en) Combination conductive and convective heatsink
EP1148772A3 (en) Cold plate utilizing fin with evaporating refrigerant
WO2004003713A3 (en) Cooling unit for cooling heat generating component
IT1255588B (en) COOLING DEVICE FOR ELECTRIC COMPONENTS
CA2243412A1 (en) Soldering iron
JPS649646A (en) Cooling module
ES296575U (en) Rapid connection device for a fluid circuit.
JPS57178348A (en) Cooling unit for semiconductor integrated circuit device
JPS53113354A (en) Thermostatic oven for electronic cooling
EP0281404A3 (en) Cooling system for electronic equipment
CN210489601U (en) MRAM (magnetic random Access memory) integrated solid state disk control chip
KR200295374Y1 (en) Heat transfer device
JPS6459841A (en) Semiconductor device
CN209089333U (en) Cooling system and electronic equipment
JPS6477199A (en) Semiconductor electronic device
CN201340852Y (en) CPU fan-less pipe heat conducting device for 1U top carriage type special computer
JPS5478982A (en) Semiconductor device and its manufacture
JPS641264A (en) Cooler for integrated circuit element
CN210671093U (en) Heat radiation structure of LED display screen
CN223157290U (en) High-frequency radiating circuit board
JPS57111053A (en) Heat radiation of electronic apparatus
JPS643497A (en) Heat pipe
CN208739488U (en) A shell with enhanced thermal conductivity
JPS645045A (en) Cooling structure for integrated circuit package