JPWO2024252859A1 - - Google Patents
Info
- Publication number
- JPWO2024252859A1 JPWO2024252859A1 JP2025526013A JP2025526013A JPWO2024252859A1 JP WO2024252859 A1 JPWO2024252859 A1 JP WO2024252859A1 JP 2025526013 A JP2025526013 A JP 2025526013A JP 2025526013 A JP2025526013 A JP 2025526013A JP WO2024252859 A1 JPWO2024252859 A1 JP WO2024252859A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
- H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D80/00—Assemblies of multiple devices comprising at least one device covered by this subclass
- H10D80/20—Assemblies of multiple devices comprising at least one device covered by this subclass the at least one device being covered by groups H10D1/00 - H10D48/00, e.g. assemblies comprising capacitors, power FETs or Schottky diodes
- H10D80/251—FETs covered by H10D30/00, e.g. power FETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
- H10W74/129—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed forming a chip-scale package [CSP]
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023095099 | 2023-06-08 | ||
| PCT/JP2024/017728 WO2024252859A1 (ja) | 2023-06-08 | 2024-05-14 | 半導体装置および車両 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024252859A1 true JPWO2024252859A1 (ja) | 2024-12-12 |
Family
ID=93795327
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025526013A Pending JPWO2024252859A1 (ja) | 2023-06-08 | 2024-05-14 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20260090384A1 (ja) |
| JP (1) | JPWO2024252859A1 (ja) |
| CN (1) | CN121241679A (ja) |
| DE (1) | DE112024002454T5 (ja) |
| WO (1) | WO2024252859A1 (ja) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0745761A (ja) * | 1993-07-30 | 1995-02-14 | Takeo Yoshino | 液冷式ハイブリッドｉｃ |
| JP3507682B2 (ja) * | 1998-01-09 | 2004-03-15 | 株式会社東芝 | 半導体モジュール |
| JP6929788B2 (ja) | 2015-12-04 | 2021-09-01 | ローム株式会社 | パワーモジュール装置、および電気自動車またはハイブリッドカー |
| JP7153538B2 (ja) * | 2018-11-16 | 2022-10-14 | 日立Astemo株式会社 | パワー半導体モジュール、電力変換装置およびパワー半導体モジュールの製造方法 |
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2024
- 2024-05-14 CN CN202480036174.5A patent/CN121241679A/zh active Pending
- 2024-05-14 DE DE112024002454.8T patent/DE112024002454T5/de active Pending
- 2024-05-14 WO PCT/JP2024/017728 patent/WO2024252859A1/ja not_active Ceased
- 2024-05-14 JP JP2025526013A patent/JPWO2024252859A1/ja active Pending
-
2025
- 2025-12-01 US US19/404,864 patent/US20260090384A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| DE112024002454T5 (de) | 2026-03-26 |
| CN121241679A (zh) | 2025-12-30 |
| WO2024252859A1 (ja) | 2024-12-12 |
| US20260090384A1 (en) | 2026-03-26 |