JPWO2025041221A1 - - Google Patents

Info

Publication number
JPWO2025041221A1
JPWO2025041221A1 JP2024510644A JP2024510644A JPWO2025041221A1 JP WO2025041221 A1 JPWO2025041221 A1 JP WO2025041221A1 JP 2024510644 A JP2024510644 A JP 2024510644A JP 2024510644 A JP2024510644 A JP 2024510644A JP WO2025041221 A1 JPWO2025041221 A1 JP WO2025041221A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024510644A
Other versions
JP7671918B1 (ja
JPWO2025041221A5 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2025041221A1 publication Critical patent/JPWO2025041221A1/ja
Application granted granted Critical
Publication of JP7671918B1 publication Critical patent/JP7671918B1/ja
Publication of JPWO2025041221A5 publication Critical patent/JPWO2025041221A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H01J37/32724—Temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32642—Focus rings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7606—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/332—Coating
    • H01J2237/3321—CVD [Chemical Vapor Deposition]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/334—Etching

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
JP2024510644A 2023-08-21 2023-08-21 半導体製造装置用部材 Active JP7671918B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/029982 WO2025041221A1 (ja) 2023-08-21 2023-08-21 半導体製造装置用部材

Publications (3)

Publication Number Publication Date
JPWO2025041221A1 true JPWO2025041221A1 (ja) 2025-02-27
JP7671918B1 JP7671918B1 (ja) 2025-05-02
JPWO2025041221A5 JPWO2025041221A5 (ja) 2025-07-30

Family

ID=94689171

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024510644A Active JP7671918B1 (ja) 2023-08-21 2023-08-21 半導体製造装置用部材

Country Status (6)

Country Link
US (2) US12463023B2 (ja)
JP (1) JP7671918B1 (ja)
KR (2) KR20260038955A (ja)
CN (1) CN121753530A (ja)
TW (1) TW202510091A (ja)
WO (1) WO2025041221A1 (ja)

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100264445B1 (ko) 1993-10-04 2000-11-01 히가시 데쓰로 플라즈마처리장치
JP3173693B2 (ja) * 1993-10-04 2001-06-04 東京エレクトロン株式会社 プラズマ処理装置及びその方法
KR100292410B1 (ko) * 1998-09-23 2001-06-01 윤종용 불순물 오염이 억제된 반도체 제조용 반응 챔버
JP4119551B2 (ja) * 1998-12-01 2008-07-16 東京エレクトロン株式会社 基板保持台、及びプラズマ処理装置
US6494955B1 (en) 2000-02-15 2002-12-17 Applied Materials, Inc. Ceramic substrate support
JP5088483B2 (ja) * 2007-12-18 2012-12-05 三菱マテリアル株式会社 ウエハを支持するためのプラズマエッチング装置用複合シリコンリング
JP5808750B2 (ja) 2009-11-30 2015-11-10 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ 傾斜側壁を備える静電チャック
US20160289827A1 (en) * 2015-03-31 2016-10-06 Lam Research Corporation Plasma processing systems and structures having sloped confinement rings
JP6530228B2 (ja) * 2015-04-28 2019-06-12 日本特殊陶業株式会社 静電チャック
US20180182635A1 (en) 2016-12-27 2018-06-28 Tokyo Electron Limited Focus ring and substrate processing apparatus
JP2018107433A (ja) * 2016-12-27 2018-07-05 東京エレクトロン株式会社 フォーカスリング及び基板処理装置
JP7071908B2 (ja) * 2018-03-22 2022-05-19 Ｓｐｐテクノロジーズ株式会社 フォーカスリング及びこれを備えたプラズマ処理装置
WO2022225797A1 (en) * 2021-04-21 2022-10-27 Lam Research Corporation Backside deposition prevention on substrates
JP7429208B2 (ja) 2021-08-17 2024-02-07 日本碍子株式会社 ウエハ載置台
KR102904705B1 (ko) * 2021-11-09 2025-12-29 삼성전자주식회사 포커스 링, 이를 포함하는 기판 처리 장치 및 이를 이용한 기판 처리 방법

Also Published As

Publication number Publication date
JP7671918B1 (ja) 2025-05-02
KR102934502B1 (ko) 2026-03-06
KR20260038955A (ko) 2026-03-19
US20250069865A1 (en) 2025-02-27
TW202510091A (zh) 2025-03-01
US20260018393A1 (en) 2026-01-15
CN121753530A (zh) 2026-03-27
KR20250029010A (ko) 2025-03-04
US12463023B2 (en) 2025-11-04
WO2025041221A1 (ja) 2025-02-27

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