KR100458069B1 - Flameproof Styrenic Resin Composition - Google Patents
Flameproof Styrenic Resin Composition Download PDFInfo
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- KR100458069B1 KR100458069B1 KR10-2002-0017064A KR20020017064A KR100458069B1 KR 100458069 B1 KR100458069 B1 KR 100458069B1 KR 20020017064 A KR20020017064 A KR 20020017064A KR 100458069 B1 KR100458069 B1 KR 100458069B1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/02—Homopolymers or copolymers of hydrocarbons
- C08L25/04—Homopolymers or copolymers of styrene
- C08L25/08—Copolymers of styrene
- C08L25/10—Copolymers of styrene with conjugated dienes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
- C08K5/523—Esters of phosphoric acids, e.g. of H3PO4 with hydroxyaryl compounds
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
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Abstract
본 발명의 난연성 스티렌계 수지 조성물은 (A) 고무강화 스티렌계 수지 60∼94.5 중량%; (B) 폴리페닐렌 에테르 수지 0.5∼20 중량%; 및 (C) (C1) 힌더드 메틸기를 가지는 올리고머형 인산 에스테르 화합물 25∼80 중량% 및 (C2) 나프틸기를 가지는 인산 에스테르 화합물 20∼75 중량%로 이루어진 인산에스테르 화합물 5∼20 중량%로 이루어지는 것을 특징으로 한다.The flame retardant styrene resin composition of the present invention comprises (A) 60 to 99.4 weight% of rubber-reinforced styrene resin; (B) 0.5 to 20% by weight of polyphenylene ether resin; And (C) (C 1) Hin hindered oligomer type phosphoric acid ester compound having a methyl group 25 to 80% by weight, and (C 2) a naphthyl phosphate ester compound having 20 to 75 5 to 20% by weight butyl phosphate ester compound comprising in weight percent Characterized in that consists of.
Description
발명의 분야Field of invention
본 발명은 환경 친화성이 우수하고 난연성이 우수한 스티렌계 수지 조성물에 관한 것이다. 보다 구체적으로, 본 발명은 고무강화 스티렌계 수지 공중합체와 폴리페닐렌 에테르 수지로 구성된 블렌드에 난연제로 힌더드 메틸기를 가지는 인산 에스테르 화합물과 나프틸기를 가지는 인산 에스테르 화합물로 이루어진 인산 에스테르 화합물을 사용함으로써, 난연성, 내열도 및 기계적 강도가 우수하고, 또한 환경 안정성 측면에서 규제가 강화되고 있는 할로겐(halogen)계 난연제를 사용하지 않으므로 환경 친화성이 우수한 스티렌계 열가소성 수지 조성물에 관한 것이다.The present invention relates to a styrene resin composition having excellent environmental friendliness and excellent flame retardancy. More specifically, the present invention uses a phosphate ester compound composed of a phosphate ester compound having a hindered methyl group and a phosphate ester compound having a naphthyl group in a blend composed of a rubber-reinforced styrene resin copolymer and a polyphenylene ether resin. The present invention relates to a styrene-based thermoplastic resin composition having excellent environmental friendliness since it does not use a halogen-based flame retardant having excellent flame retardancy, heat resistance and mechanical strength, and which has been tightened in terms of environmental stability.
발명의 배경Background of the Invention
전자제품의 외장재로 사용되고 있는 스티렌계 수지는 우수한 가공성 및 기계적 특성으로 인하여 거의 모든 전자제품에 적용되고 있다. 그러나, 스티렌계 수지 자체는 쉽게 연소가 일어날 수 있는 특성을 가지고 있기 때문에 화재에 대한 저항성이 없다. 따라서 스티렌계 수지는 외부의 발화원에 의하여 쉽게 연소가 일어날 수 있으며, 화재를 더욱 확산되게 하는 역할을 할 수 있다. 이러한 점을 감안하여 미국, 일본 및 유럽 등의 국가에서는 전자제품의 화재에 대한 안전성을 보장하기 위하여 난연 규격을 만족하는 고분자 수지만을 외장재로 사용하도록 법으로 규제하고 있다.Styrene-based resins, which are used as exterior materials for electronic products, are applied to almost all electronic products due to their excellent processability and mechanical properties. However, since the styrene resin itself has a property that combustion can easily occur, there is no fire resistance. Therefore, the styrene resin may be easily burned by an external ignition source, and may serve to further spread the fire. In view of this, the United States, Japan and Europe, etc., regulate the law to use only polymer resin that meets the flame retardant specification as an exterior material in order to ensure the safety of fire of electronic products.
가장 많이 적용되고 있는 공지된 난연화 방법은 고무강화 스티렌계 수지에 할로겐계 화합물과 안티몬계 화합물을 함께 적용하여 난연 물성을 부여하는 것이다. 상기 할로겐계 화합물로는 폴리브로모디페닐에테르, 테트라브로모비스페놀-A, 브롬치환된 에폭시 화합물 및 염소화 폴리에틸렌 등이 주로 이용되고 있다. 상기 안티몬계 화합물로는 삼산화 안티몬과 오산화 안티몬이 주로 사용된다.The most widely known flame retardant method is to impart flame retardant properties by applying a halogen-based compound and an antimony-based compound together to the rubber-reinforced styrene resin. As the halogen-based compound, polybromodiphenyl ether, tetrabromobisphenol-A, brominated substituted epoxy compound, chlorinated polyethylene and the like are mainly used. As the antimony compound, antimony trioxide and antimony pentoxide are mainly used.
그러나, 할로겐과 안티몬 화합물을 함께 적용하여 난연성을 부여하는 방법은 난연성 확보가 용이하고 물성저하도 거의 발생하지 않는 장점이 있지만, 가공시 발생되는 할로겐화 수소 가스로 인체에 치명적인 영향을 미칠 가능성이 높다. 특히 할로겐계 난연제의 주를 이루는 폴리브롬화 디페닐에테르는 연소시에 다이옥신이나 퓨란과 같은 매우 유독한 가스를 발생할 가능성이 높기 때문에, 이러한 할로겐계 화합물을 적용하지 않는 난연화 방법에 대해 최근 관심이 모아지고 있다.However, the method of imparting flame retardancy by applying a halogen and an antimony compound together has an advantage of easily obtaining flame retardancy and hardly deteriorating physical properties. However, hydrogen halide gas generated during processing is likely to have a fatal effect on the human body. In particular, since polybrominated diphenyl ethers, which are mainly halogen-based flame retardants, are highly likely to generate very toxic gases such as dioxins and furans during combustion, recent interest in flame retardant methods that do not apply such halogen-based compounds has attracted much attention. ought.
할로겐을 함유하지 않는 난연제로서 트리페닐 포스페이트 같은 모노 인산 에스테르화합물을 첨가하여 수지 조성물에 난연성을 부여하는 방법이 연구되어 왔다.As a halogen-free flame retardant, a method of adding flame retardance to a resin composition by adding a monophosphate ester compound such as triphenyl phosphate has been studied.
미국특허 제4,526,917호에서는 폴리페닐렌 에테르와 스티렌 수지에 트리페닐 포스페이트(TPP)와 메시틸(mesityl)기를 가지는 모노 인산 에스테르 화합물을 사용하여 난연성을 향상시킨 바 있다. 그러나 상기 미국특허에서 사용된 폴리페닐렌 에테르의 양은 20 중량% 이상으로서 이러한 조성에서는 흐름성을 유지시키면서 적하형 난연성을 달성하기가 매우 어렵다는 단점이 있다.In US Pat. No. 4,526,917, flame retardancy was improved by using a monophenyl phosphate ester compound having triphenyl phosphate (TPP) and mesityl groups in polyphenylene ether and styrene resin. However, the amount of the polyphenylene ether used in the US patent is 20% by weight or more, and in such a composition, it is very difficult to achieve drop type flame retardancy while maintaining flowability.
이에 대하여, 본 발명자들은 상기 문제점들을 극복하기 위하여, 기초수지로서 고무강화 스티렌계 수지와 폴리페닐렌 에테르를 사용하고, 난연제로 힌더드 메틸기를 가지는 인산 에스테르 화합물과 나프틸기를 가지는 인산 에스테르 화합물을 적용함으로써, 환경 안정성과 난연성 및 내열도가 우수한 수지 조성물을 개발하였다. 또한, 20% 미만의 폴리페닐렌 에테르를 사용하여 흐름성 및 적하형 난연성이 우수한 수지를 개발하기에 이른 것이다.In contrast, the present inventors use a rubber-reinforced styrene resin and a polyphenylene ether as a base resin, and apply a phosphate ester compound having a hindered methyl group and a phosphate ester compound having a naphthyl group as a flame retardant. Thus, a resin composition excellent in environmental stability, flame retardancy, and heat resistance was developed. In addition, the use of less than 20% polyphenylene ether has led to the development of a resin excellent in flowability and dropping flame retardancy.
본 발명의 목적은 화재에 대해 안정성이 있는 열가소성 난연성 스티렌계 수지 조성물을 제공하기 위한 것이다.An object of the present invention is to provide a thermoplastic flame retardant styrene resin composition that is stable against fire.
본 발명의 다른 목적은 수지의 가공이나 연소 시에 환경오염을 야기시키는 할로겐 화합물을 난연제로 사용하지 않고 환경 친화성 화합물을 난연제로 사용함으로써 환경 안정성이 있는 스티렌계 수지 조성물을 제공하기 위한 것이다.Another object of the present invention is to provide a styrene resin composition having environmental stability by using an environmentally friendly compound as a flame retardant, rather than using a halogen compound that causes environmental pollution during processing or combustion of the resin as a flame retardant.
본 발명의 또 다른 목적은 내열도 및 흐름도가 우수하여 전자제품 등의 외장재로 사용할 수 있는 난연성 스티렌계 수지 조성물을 제공하기 위한 것이다.Still another object of the present invention is to provide a flame retardant styrene resin composition which can be used as an exterior material such as electronic products with excellent heat resistance and flow chart.
본 발명의 상기 및 기타의 목적들은 하기 설명되는 본 발명에 의하여 모두 달성될 수 있다. 이하 본 발명의 내용을 하기에 상세히 설명한다.The above and other objects of the present invention can be achieved by the present invention described below. Hereinafter, the content of the present invention will be described in detail.
본 발명의 난연성 스티렌계 수지 조성물은 (A) 고무강화 스티렌계 수지 60∼94.5 중량%; (B) 폴리페닐렌 에테르 수지 0.5∼20 중량%; 및 (C) (C1) 힌더드 메틸기를 가지는 인산 에스테르 화합물 25∼80 중량% 및 (C2) 나프틸기를 가지는 인산 에스테르 화합물 20∼75 중량%로 이루어진 인산에스테르 화합물 5∼20 중량%로 이루어진다.The flame retardant styrene resin composition of the present invention comprises (A) 60 to 99.4 weight% of rubber-reinforced styrene resin; (B) 0.5 to 20% by weight of polyphenylene ether resin; And (C) (C 1) comprises a hinge hindered phosphoric acid ester compound having a methyl group, and 25-80% by weight of (C 2) 5~20% by weight of phosphoric acid ester compounds consisting of 20-75% by weight of phosphoric acid ester compound having a naphthyl .
이하, 이들 각각의 성분에 대한 상세한 설명은 다음과 같다.Hereinafter, the detailed description of each of these components is as follows.
(A) 고무강화 스티렌계 수지(A) Rubber reinforced styrene resin
본 발명에 사용되는 고무강화 스티렌계 수지는 고무와 방향족 모노알케닐 단량체 및/또는 알킬 에스테르 단량체를 혼합하고 열중합 또는 중합개시제를 사용하여 중합시켜 제조된다.The rubber-reinforced styrenic resin used in the present invention is prepared by mixing a rubber with an aromatic monoalkenyl monomer and / or an alkyl ester monomer and polymerizing using a thermal polymerization or polymerization initiator.
상기 고무는 부타디엔형 고무류, 이소프렌형 고무류, 부타디엔과 스티렌의 공중합체류 및 알킬아크릴레이트 고무류 등으로 이루어진 군으로부터 선택되며, 3∼30 중량부, 바람직하게는 5∼15 중량부를 사용하는 것이 바람직하다.The rubber is selected from the group consisting of butadiene rubbers, isoprene rubbers, copolymers of butadiene and styrene, alkyl acrylate rubbers, and the like, and preferably 3 to 30 parts by weight, preferably 5 to 15 parts by weight.
또한 상기 단량체는 방향족 모노알케닐 단량체, 아크릴산 또는 메타크릴산의알킬에스테르 단량체로 이루어진 군으로부터 선택되며, 상기 군으로부터 선택된 1종 이상의 단량체를 70∼97 중량부, 바람직하게는 85∼95 중량부를 투입하는 것이 바람직하다.In addition, the monomer is selected from the group consisting of aromatic monoalkenyl monomers, alkyl ester monomers of acrylic acid or methacrylic acid, and 70 to 97 parts by weight, preferably 85 to 95 parts by weight of one or more monomers selected from the group. It is desirable to.
본 발명은 중합개시제를 사용하여 중합되어 제조될 수 있으며, 상기 중합개시제 없이도 열중합에 의해 제조될 수 있다.The present invention may be prepared by polymerization using a polymerization initiator, and may be prepared by thermal polymerization without the polymerization initiator.
본 발명에 사용될 수 있는 중합개시제는 벤조일 퍼옥사이드, t-부틸 하이드로 퍼옥사이드, 아세틸 퍼옥사이드, 큐멘하이드로 퍼옥사이드로 이루어진 과산화물계 개시제와 아조비스 이소부티로니트릴(AIBN)과 같은 아조계 개시제 중 1종 이상이 선택되어 이용될 수 있다.Polymerization initiators that may be used in the present invention include one of peroxide initiators consisting of benzoyl peroxide, t-butyl hydroperoxide, acetyl peroxide, cumenehydro peroxide and azo initiators such as azobis isobutyronitrile (AIBN). More than one species can be selected and used.
상기 고무강화 스티렌계 수지는 괴상중합, 현탁중합, 유화중합 또는 이들의 혼합방법을 사용하여 제조될 수 있으며, 이들 중합방법 중 괴상중합방법이 바람직하게 사용될 수 있다.The rubber-reinforced styrenic resin may be prepared using a bulk polymerization, suspension polymerization, emulsion polymerization or a mixture thereof, and among these polymerization methods, a bulk polymerization method may be preferably used.
고무강화 스티렌계 수지와 폴리페닐렌 에테르 수지의 블렌드에서 최적의 물성을 내기 위해서는 고무상의 입자크기가 0.5∼2.0 ㎛인 것이 바람직하다.In order to give optimum physical properties in the blend of the rubber-reinforced styrene resin and the polyphenylene ether resin, the rubber particle size is preferably 0.5 to 2.0 µm.
(B) 폴리페닐렌에테르 수지(B) polyphenylene ether resin
고무강화 스티렌계 수지만으로는 난연성이 부족하고 내열성이 저하되기 때문에, 본 발명에서는 폴리페닐렌 에테르 수지를 첨가하여 기초수지로 사용한다. 상기 폴리페닐렌 에테르 수지로는 폴리(2,6-디메틸-1,4-페닐렌)에테르, 폴리(2,6-디에틸-1,4-페닐렌)에테르, 폴리(2,6-디프로필-1,4-페닐렌)에테르,폴리(2-메틸-6-에틸-1,4-페닐렌)에테르, 폴리(2-메틸-6-프로필-1,4-페닐렌)에테르, 폴리(2-에틸-6-프로필-1,4-페닐렌)에테르, 폴리(2,6-디페닐-1,4-페닐렌)에테르, 폴리(2,6-디메틸-1,4-페닐렌)에테르와 폴리(2,3,6-트리메틸-1,4-페닐렌)에테르의 공중합체 및 폴리(2,6-디메틸-1,4-페닐렌)에테르와 폴리(2,3,5-트리에틸-1,4-페닐렌)에테르의 공중합체가 있다. 바람직하기로는 폴리(2,6-디메틸-1,4-페닐렌)에테르와 폴리(2,3,6-트리메틸-1,4-페닐렌)에테르의 공중합체 및 폴리(2,6-디메틸-1,4-페닐렌)에테르가 사용되며, 이중에서 폴리(2,6-디메틸-1,4-페닐렌)에테르가 가장 바람직하다.Since rubber-reinforced styrene resins are insufficient in flame retardancy and deteriorated in heat resistance, in the present invention, polyphenylene ether resin is added and used as the base resin. Examples of the polyphenylene ether resin include poly (2,6-dimethyl-1,4-phenylene) ether, poly (2,6-diethyl-1,4-phenylene) ether, poly (2,6-di Propyl-1,4-phenylene) ether, poly (2-methyl-6-ethyl-1,4-phenylene) ether, poly (2-methyl-6-propyl-1,4-phenylene) ether, poly (2-ethyl-6-propyl-1,4-phenylene) ether, poly (2,6-diphenyl-1,4-phenylene) ether, poly (2,6-dimethyl-1,4-phenylene ) Copolymer of poly (2,3,6-trimethyl-1,4-phenylene) ether and poly (2,6-dimethyl-1,4-phenylene) ether and poly (2,3,5- Copolymers of triethyl-1,4-phenylene) ether. Preferably a copolymer of poly (2,6-dimethyl-1,4-phenylene) ether and poly (2,3,6-trimethyl-1,4-phenylene) ether and poly (2,6-dimethyl- 1,4-phenylene) ether is used, of which poly (2,6-dimethyl-1,4-phenylene) ether is most preferred.
폴리페닐렌 에테르의 중합도는 특별히 제한되지는 않지만, 수지 조성물의 열안정성이나 작업성을 고려하여 25℃의 클로로포름 용매에서 측정된 고유점도가 0.2 내지 0.8인 것이 바람직하다.Although the polymerization degree of polyphenylene ether is not specifically limited, It is preferable that intrinsic viscosity measured in 25 degreeC chloroform solvent is 0.2-0.8 in consideration of the thermal stability and workability of a resin composition.
(C) 인산 에스테르 화합물(C) phosphate ester compound
본 발명에서 난연제로 사용되는 인산 에스테르 화합물은 (C1)힌더드 메틸기를 가지는 인산 에스테르 화합물 25-80 중량%와 (C2)나프틸기를 가지는 인산 에스테르 화합물 20-75 중량%를 혼합하여 사용한다. 본 발명의 인산 에스테르 화합물 각각의 상세한 설명은 다음과 같다.The phosphate ester compound used as the flame retardant in the present invention is used by mixing 25-80% by weight of the phosphate ester compound having a (C 1 ) hindered methyl group and 20-75% by weight of the phosphate ester compound having a (C 2 ) naphthyl group. . Detailed description of each of the phosphate ester compounds of the present invention is as follows.
(C1) 힌더드 메틸기를 가지는 인산 에스테르 화합물(C 1 ) phosphate ester compound having a hindered methyl group
본 발명의 힌더드 메틸기를 가지는 인산 에스테르 화합물은 하기의 화학식 1로 표시된다.Phosphoric acid ester compound having a hindered methyl group of the present invention is represented by the following formula (1).
[화학식 1][Formula 1]
상기 식에서 n은 수평균 중합도(number average degree of polymerization)를 나타내며, n의 값은 0에서 4사이의 값이다. X는 디알콜로부터 유도된 것으로 카테콜, 레조시놀, 히드로퀴논 및 하기의 화학식 2와 같이 나타나는 비스페닐렌디올 등으로부터 유도된 것이 사용될 수 있다.In the above formula, n represents a number average degree of polymerization, and the value of n is a value between 0 and 4. X is derived from dialcohol, and may be one derived from catechol, resorcinol, hydroquinone, and bisphenylenediol represented by the following Formula 2.
[화학식 2][Formula 2]
상기 식에서, Y는 C1-5의 알킬렌, C1-5의 알킬리덴, C5-6의 시클로알킬리덴, S 또는 SO2를 나타내며, z는 0 또는 1이다. 이 중 레조시놀과 비스페놀 A가 바람직하다.Wherein Y represents C 1-5 alkylene, C 1-5 alkylidene, C 5-6 cycloalkylidene, S or SO 2 , z is 0 or 1. Of these, resorcinol and bisphenol A are preferable.
상기 화학식 1의 대표적인 화합물로는 트리(2,6-디메틸페닐)포스페이트, 레조시놀 디(2,6-디메틸페닐)포스페이트 와 비스페놀 A 디(2,6-디메틸페닐)포스페이트가 있으며, 이들 인계 화합물은 단독 또는 각각의 혼합물로도 적용할 수 있다.Representative compounds of Formula 1 include tri (2,6-dimethylphenyl) phosphate, resorcinol di (2,6-dimethylphenyl) phosphate and bisphenol A di (2,6-dimethylphenyl) phosphate, and these phosphorus-based compounds The compounds may be applied alone or in mixtures of each.
(C2) 나프틸기를 가지는 인산 에스테르 화합물(C 2 ) Phosphate Ester Compounds Having Naphthyl Group
본 발명의 나프틸기를 가지는 인산 에스테르 화합물은 하기 화학식 3으로 표시된다.The phosphate ester compound having a naphthyl group of the present invention is represented by the following formula (3).
[화학식 3][Formula 3]
상기 화학식 3에서 m은 0과 2 사이의 정수이다. 상기 화학식 3에 해당하는 대표적인 화합물로는 나프틸디페닐 포스페이트, 디나프틸페닐 포스페이트, 트리나프틸 포스페이트가 있으며 이들 화합물은 단독 또는 각각의 혼합물로도 사용할 수 있다.In Formula 3, m is an integer between 0 and 2. Representative compounds of Formula 3 include naphthyldiphenyl phosphate, dinaphthylphenyl phosphate, and trinaphthyl phosphate, and these compounds may be used alone or in mixtures thereof.
본 발명의 열가소성 수지 제조방법에 있어서 각각의 용도에 따라 적하방지제, 충격보강제, 가소제, 무기물 첨가제, 열안정제, 산화방지제, 상용화제, 광안정제, 안료 및/또는 염료가 부가될 수 있다. 부가되는 상기 무기물 첨가제로는 석면, 유리섬유, 탈크, 세라믹 및 황산염 등이 있으며, 이들은 본 발명의 기초수지 100 중량부에 대하여 0∼30 중량부로 사용될 수 있다.In the thermoplastic resin manufacturing method of the present invention, an antidripping agent, an impact enhancer, a plasticizer, an inorganic additive, a heat stabilizer, an antioxidant, a compatibilizer, a light stabilizer, a pigment, and / or a dye may be added according to each use. The inorganic additives to be added include asbestos, glass fibers, talc, ceramics and sulfates, which may be used in an amount of 0 to 30 parts by weight based on 100 parts by weight of the base resin of the present invention.
본 발명은 하기의 실시예에 의하여 보다 더 잘 이해될 수 있으며, 하기의 실시예는 본 발명의 예시 목적을 위한 것이며 첨부된 특허청구범위에 의하여 한정되는 보호범위를 제한하고자 하는 것은 아니다.The invention can be better understood by the following examples, which are intended for the purpose of illustration of the invention and are not intended to limit the scope of protection defined by the appended claims.
실시예Example
하기의 실시예 및 비교실시예에서 사용된 (A) 고무강화 스티렌계 수지, (B) 폴리페닐렌에테르 수지, (C) 인산 에스테르 화합물의 사양은 다음과 같다.The specifications of (A) rubber-reinforced styrene resin, (B) polyphenylene ether resin, and (C) phosphate ester compound used in the following examples and comparative examples are as follows.
(A) 고무강화 스티렌계 수지(A) Rubber reinforced styrene resin
고무강화 스티렌계 수지는 제일모직(주)의 HR-1380을 사용하였다.Rubber-reinforced styrene resin was HR-1380 manufactured by Cheil Industries.
(B)폴리페닐렌에테르(PPE) 수지(B) polyphenylene ether (PPE) resin
일본 아사히 카세이사의 폴리(2,6-디메틸-페닐에테르) (상품명 P-402)를 사용하였으며, 입자의 크기는 수십 ㎛의 평균입경을 갖는 분말형태이다.Poly (2,6-dimethyl-phenylether) (trade name P-402) of Asahi Kasei Co., Ltd., Japan, was used, and the particle size was in the form of a powder having an average particle diameter of several tens of micrometers.
(C) 인산 에스테르 화합물(C) phosphate ester compound
(C1) 힌더드 메틸기를 가지는 인산 에스테르 화합물로서, 일본 대팔화학의 레조시놀 디(2,6-디메틸페닐)포스페이트(상품명 PX-200)를 사용하였다.(C 1 ) As a phosphate ester compound having a hindered methyl group, resorcinol di (2,6-dimethylphenyl) phosphate (trade name PX-200) manufactured by Nippon Scorpion Co., Ltd. was used.
(C2) 나프틸기를 가지는 인산 에스테르 화합물로서, 융점이 62 ℃인 나프틸디페닐 포스페이트를 사용하였다.(C 2) a phosphoric acid ester compound having a naphthyl, was used for the tildi naphthyl diphenyl phosphate having a melting point of 62 ℃.
(C2) 융점이 48 ℃인 트리페닐 포스페이트 (TPP)를 사용하였다.(C 2 ) Triphenyl phosphate (TPP) with a melting point of 48 ° C. was used.
실시예 1-2Example 1-2
상기 각 구성성분을 하기 표 1에 기재된 함량으로 투입하여 통상의 이축 압출기에서 200∼280 ℃ 온도범위에서 압출하여 펠렛으로 제조하였다. 제조된 펠렛은 80 ℃에서 3시간 건조 후 6 Oz 사출기에서 성형온도 180∼280, 금형온도 40∼80 ℃의 조건으로 사출하여 물성시편을 제조하였다.Each component was added to the content shown in Table 1 below and extruded in a conventional twin screw extruder at a temperature range of 200 ~ 280 ℃ to prepare a pellet. The prepared pellet was dried at 80 ° C. for 3 hours, and then injected into a 6 Oz injection machine under conditions of a molding temperature of 180 to 280 and a mold temperature of 40 to 80 ° C. to prepare a physical specimen.
비교실시예 1-4Comparative Example 1-4
비교실시예 1-2는 난연제로 레조시놀 디(2,6-디메틸페닐)포스페이트 또는 나프틸디메틸 포스페이트만을 단독으로 사용한 것을 제외하고는 상기 실시예 1과 동일하게 시편을 제조하였다.Comparative Example 1-2 was prepared in the same manner as in Example 1, except that only resorcinol di (2,6-dimethylphenyl) phosphate or naphthyldimethyl phosphate was used alone as a flame retardant.
비교실시예 3은 본 발명의 나프틸디메틸 포스페이트 대신에 트리페닐포스페이트(TPP)를 사용한 것을 제외하고는 상기 실시예 1과 동일하게 시편을 제조하였다.Comparative Example 3 was prepared in the same manner as in Example 1, except that triphenylphosphate (TPP) was used instead of the naphthyldimethyl phosphate of the present invention.
비교실시예 4는 난연제로 트리페닐포스페이트(TPP)만을 사용한 것을 제외하고는 상기 실시예 1과 동일하게 시편을 제조하였다.Comparative Example 4 was prepared in the same manner as in Example 1 except that only triphenylphosphate (TPP) was used as a flame retardant.
상기 실시예 및 비교실시예에서 제조된 시편에 대하여 하기의 방법으로 물성을 측정하였다.Physical properties of the specimens prepared in Examples and Comparative Examples were measured by the following methods.
(1) 비캣연화온도(VST)는 ASTM D1525 규격에 의하여 200℃, 5 kgf 하중에서 측정하였다.(1) Vicat softening temperature (VST) was measured at 200 ° C and 5 kgf load according to ASTM D1525 standard.
(2) 용융흐름지수는 ASTM D1238에 준하여 측정하였다.(2) Melt flow index was measured according to ASTM D1238.
(3) Izod 충격강도는 1/8" 두께에서 ASTM 256A 조건에서 측정하였다.(3) Izod impact strength was measured under ASTM 256A conditions at 1/8 "thickness.
(4) 인장강도는 ASTM D 638조건에 의하여 평가하였다.(4) Tensile strength was evaluated according to ASTM D 638 conditions.
(5) 난연도는 UL 94 VB에 의하여 1/8" 및 1/12" 두께의 시편을 이용하여 각각 측정하였다.(5) Flame retardancy was measured by using a specimen of thickness 1/8 "and 1/12" by UL 94 VB.
실시예 1-2 및 비교실시예 1-4에서 제조된 수지의 조성 및 물성을 하기 표 1에 나타내었다.The composition and physical properties of the resin prepared in Example 1-2 and Comparative Example 1-4 are shown in Table 1 below.
상기 표1의 결과로부터, 난연제로 힌더드 메틸기를 가지는 인산 에스테르 화합물과 나프틸기를 가지는 인산 에스테르를 함께 사용할 경우, 1/8" 및 1/12" 두께에서 각각 V-2 의 난연도를 달성하였으며, 열적 성질, 기계적 물성 및 흐름성 면에서 고루 우수한 것으로 나타났다. 반면, 난연제로 나프틸기를 가지는 인산 에스테르만을 사용한 비교실시예 1의 경우, 인장강도 및 충격강도가 저하되었으며, V-2 의 난연도를 달성할 수 없었다. 또한, 난연제로 힌더드 메틸기를 가지는 인산 에스테르 화합물만을 사용한 비교실시예 2의 경우, 1/12" 두께에서 각각 V-2 의 난연도를 달성하였으나, 흐름성 및 기계적 물성이 현저하게 저하된 것을 알 수 있었다. 난연제로 나프틸기를 가지는 인산 에스테르대신에 트리페닐 포스페이트를 사용한 비교실시예 3은 내열성 및 인장강도가 저하되었다. 난연제로 트리페닐 포스페이트만을 단독 적용한 비교실시예 4의 경우도 내열성 및 기계적 성질이 현저하게 저하된 것으로 나타났다.From the results in Table 1, when using a phosphate ester compound having a hindered methyl group and a phosphate ester having a naphthyl group as a flame retardant, flame retardancy of V-2 was achieved at 1/8 "and 1/12" thickness, respectively. It was found to be excellent in thermal properties, mechanical properties and flow properties. On the other hand, in Comparative Example 1 using only a phosphate ester having a naphthyl group as the flame retardant, the tensile strength and impact strength was lowered, it was not possible to achieve the flame retardancy of V-2. In addition, in Comparative Example 2 using only a phosphate ester compound having a hindered methyl group as a flame retardant, flame retardancy of V-2 was achieved at 1/12 "thickness, respectively, but it was found that the flowability and mechanical properties were significantly reduced. The use of triphenyl phosphate in place of the phosphate ester having a naphthyl group as the flame retardant decreased the heat resistance and the tensile strength of Comparative Example 3. The heat resistance and mechanical properties of Comparative Example 4 in which only triphenyl phosphate was used as the flame retardant alone were also applied. This was found to be significantly lowered.
본 발명은 고무강화 스티렌계 수지와 폴리페닐렌 에테르 수지로 이루어진 기초수지에 힌더드 메틸기를 가지는 인산 에스테르 화합물과 나프틸기를 가지는 인산 에스테르 화합물로 이루어지는 인산 에스테르 화합물을 적용함으로써, 환경 안정성과 화재 안전성을 가지면서 내열도, 충격강도 및 흐름성이 우수한 난연성 고무강화 스티렌계계 수지 조성물을 제공하는 효과를 갖는다.The present invention is applied to the base resin consisting of a rubber-reinforced styrene resin and a polyphenylene ether resin by applying a phosphate ester compound consisting of a phosphate ester compound having a hindered methyl group and a phosphate ester compound having a naphthyl group, thereby improving environmental stability and fire safety It has an effect of providing a flame retardant rubber-reinforced styrene resin composition having excellent heat resistance, impact strength and flowability.
본 발명의 단순한 변형 내지 변경은 이 분야의 통상의 지식을 가진 자에 의하여 용이하게 실시될 수 있으며, 이러한 변형이나 변경은 모두 본 발명의 영역에 포함되는 것으로 볼 수 있다.Simple modifications or changes of the present invention can be easily carried out by those skilled in the art, and all such modifications or changes can be seen to be included in the scope of the present invention.
Claims (4)
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| KR20030078189A KR20030078189A (en) | 2003-10-08 |
| KR100458069B1 true KR100458069B1 (en) | 2004-11-20 |
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| KR10-2002-0017064A Expired - Fee Related KR100458069B1 (en) | 2002-03-28 | 2002-03-28 | Flameproof Styrenic Resin Composition |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR100505317B1 (en) * | 2003-08-04 | 2005-08-02 | 제일모직주식회사 | Flameproof Thermoplastic Resin Composition |
| KR100778006B1 (en) | 2006-12-27 | 2007-11-28 | 제일모직주식회사 | Flame retardant thermoplastic resin composition excellent in weatherability |
| CN116023062B (en) * | 2022-12-28 | 2024-05-03 | 四川金江建材科技有限公司 | Water-based synergist for concrete and preparation method thereof |
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| JPS61200163A (en) * | 1985-02-28 | 1986-09-04 | Mitsubishi Gas Chem Co Inc | Polyphenylene ether resin composition having flame retardance |
| JP2000273269A (en) * | 1999-01-21 | 2000-10-03 | Teijin Chem Ltd | Flame retardant styrenic resin composition |
| JP2000290450A (en) * | 1999-04-08 | 2000-10-17 | Daihachi Chemical Industry Co Ltd | Flame retardant rubber-reinforcd styrene-based resin composition |
| JP2001064463A (en) * | 1999-08-26 | 2001-03-13 | Daicel Chem Ind Ltd | Styrene resin composition |
| KR20010113326A (en) * | 2000-06-19 | 2001-12-28 | 안복현 | Thermoplastic Flameproof Resin Composition |
| KR20030030421A (en) * | 2001-10-11 | 2003-04-18 | 제일모직주식회사 | Flame Retardant Thermoplastic Resin Composition |
| KR20030054168A (en) * | 2001-12-24 | 2003-07-02 | 제일모직주식회사 | Flameproof Rubber Modified Styrenic Resin Composition |
-
2002
- 2002-03-28 KR KR10-2002-0017064A patent/KR100458069B1/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61200163A (en) * | 1985-02-28 | 1986-09-04 | Mitsubishi Gas Chem Co Inc | Polyphenylene ether resin composition having flame retardance |
| JP2000273269A (en) * | 1999-01-21 | 2000-10-03 | Teijin Chem Ltd | Flame retardant styrenic resin composition |
| JP2000290450A (en) * | 1999-04-08 | 2000-10-17 | Daihachi Chemical Industry Co Ltd | Flame retardant rubber-reinforcd styrene-based resin composition |
| JP2001064463A (en) * | 1999-08-26 | 2001-03-13 | Daicel Chem Ind Ltd | Styrene resin composition |
| KR20010113326A (en) * | 2000-06-19 | 2001-12-28 | 안복현 | Thermoplastic Flameproof Resin Composition |
| KR20030030421A (en) * | 2001-10-11 | 2003-04-18 | 제일모직주식회사 | Flame Retardant Thermoplastic Resin Composition |
| KR20030054168A (en) * | 2001-12-24 | 2003-07-02 | 제일모직주식회사 | Flameproof Rubber Modified Styrenic Resin Composition |
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