KR100697231B1 - 소형 인쇄회로기판의 도금장치 - Google Patents
소형 인쇄회로기판의 도금장치 Download PDFInfo
- Publication number
- KR100697231B1 KR100697231B1 KR1020040114197A KR20040114197A KR100697231B1 KR 100697231 B1 KR100697231 B1 KR 100697231B1 KR 1020040114197 A KR1020040114197 A KR 1020040114197A KR 20040114197 A KR20040114197 A KR 20040114197A KR 100697231 B1 KR100697231 B1 KR 100697231B1
- Authority
- KR
- South Korea
- Prior art keywords
- printed circuit
- circuit board
- small printed
- plating
- fixing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
Claims (8)
- 삭제
- 삭제
- 소형 인쇄회로기판의 표면에 전해 도금방식에 의해 도금하는 장치에 있어서,하부에 양전류가 통전되는 용액이 수용되는 도금조(12)를 형성하고, 상부의 지지프레임(14)에는 밑단에 걸고리(15)가 형성되어 구동원(M)에 의해 정,회전되도록 음전류가 통전되는 샤프트(16)가 형성되는 하우징(10)과;상기 소형 인쇄회로기판을 호형태로 장착하여 상기 걸고리로 장착되는 고정수단(20)으로 구성되는 것을 특징으로 하는 소형 인쇄회로기판의 도금장치.
- 제3항에 있어서, 상기 샤프트(16)의 중간에는 핀결합되는 절곡부(17)를 구비하는 것을 특징으로 하는 소형 인쇄회로기판의 도금장치.
- 제3항에 있어서, 상기 고정수단(20)은 상측에 걸림대(22)가 형성되는 본체프레임(25)과, 상기 본체프레임의 외측으로 소형 인쇄회로기판이 고정되도록 하나 또는 하나 이상의 고정부재(30)를 구비하는 것을 특징으로 하는 소형 인쇄회로기판의 도금장치.
- 제5항에 있어서, 상기 고정부재(30)는 그 본체프레임의 외측으로 형성되는 다수의 원호프레임(32)과, 상기 원호프레임의 각 끝단으로 상기 소형 인쇄회로기판의 끝단을 고정하는 고정부(40)가 형성되는 것을 특징으로 하는 소형 인쇄회로기판의 도금장치.
- 제6항에 있어서, 상기 고정부(40)는 소형 인쇄회로기판의 각 끝단이 삽입되는 삽입홈(42)이 형성된 고정구(45)와, 상기 삽입홈과 연결되도록 나사 결합되는 고정스크류(46)로 구성되는 것을 특징으로 하는 소형 인쇄회로기판의 도금장치.
- 제5항 내지 제7항 중 어느 한 항에 있어서, 상기 고정수단(20)은 상기 걸림대(22)와 상기 고정구(45)의 삽입홈(42) 및 고정스크류(46)의 나사축 이외에 외측면으로 절연물질이 코팅되는 것을 특징으로 하는 소형 인쇄회로기판의 도금장치.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020040114197A KR100697231B1 (ko) | 2004-12-28 | 2004-12-28 | 소형 인쇄회로기판의 도금장치 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020040114197A KR100697231B1 (ko) | 2004-12-28 | 2004-12-28 | 소형 인쇄회로기판의 도금장치 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20060075414A KR20060075414A (ko) | 2006-07-04 |
| KR100697231B1 true KR100697231B1 (ko) | 2007-03-21 |
Family
ID=37167955
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020040114197A Expired - Lifetime KR100697231B1 (ko) | 2004-12-28 | 2004-12-28 | 소형 인쇄회로기판의 도금장치 |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR100697231B1 (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100961665B1 (ko) * | 2009-07-28 | 2010-06-14 | 주식회사 네오스코 | 반사판이 부착된 엘이디 패키지용 회로기판 도금장치 |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101230433B1 (ko) * | 2012-07-05 | 2013-02-06 | 삼현도금 주식회사 | 전기도금설비의 지그 스윙장치 |
| KR101625086B1 (ko) * | 2014-07-10 | 2016-06-08 | (주)에프티이앤이 | 나노섬유 웹의 금속도금장치 |
| KR200483257Y1 (ko) * | 2016-10-20 | 2017-04-19 | 홍승환 | 도금처리장치 |
| KR102022306B1 (ko) * | 2017-09-21 | 2019-09-18 | 송행호 | 회전 도금 장치 |
| KR102309576B1 (ko) * | 2021-07-19 | 2021-10-07 | 백운일 | 교반날개를 이용한 회전도금장치 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11193485A (ja) * | 1997-12-26 | 1999-07-21 | Ishikawajima Harima Heavy Ind Co Ltd | 細孔チューブの製造方法 |
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2004
- 2004-12-28 KR KR1020040114197A patent/KR100697231B1/ko not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11193485A (ja) * | 1997-12-26 | 1999-07-21 | Ishikawajima Harima Heavy Ind Co Ltd | 細孔チューブの製造方法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100961665B1 (ko) * | 2009-07-28 | 2010-06-14 | 주식회사 네오스코 | 반사판이 부착된 엘이디 패키지용 회로기판 도금장치 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20060075414A (ko) | 2006-07-04 |
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