KR100841237B1 - Manufacturing method of sprayed printed circuit board - Google Patents
Manufacturing method of sprayed printed circuit board Download PDFInfo
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- KR100841237B1 KR100841237B1 KR1020060133562A KR20060133562A KR100841237B1 KR 100841237 B1 KR100841237 B1 KR 100841237B1 KR 1020060133562 A KR1020060133562 A KR 1020060133562A KR 20060133562 A KR20060133562 A KR 20060133562A KR 100841237 B1 KR100841237 B1 KR 100841237B1
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- printed circuit
- circuit board
- copper
- thin film
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0736—Methods for applying liquids, e.g. spraying
- H05K2203/075—Global treatment of printed circuits by fluid spraying, e.g. cleaning a conductive pattern using nozzles
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- Microelectronics & Electronic Packaging (AREA)
- Coating By Spraying Or Casting (AREA)
Abstract
본 발명은 인쇄회로기판 제작에 관한 것이다. 더욱 상세하게는, 구리가 도금되어있지 않은 필름 및 절연체에 분사식으로 동박막을 형성시켜서 섬세하고 다양한 패턴 구현이 가능하고 여러 기판을 연결지어 단번에 제작이 가능하며 기판의 두께도 얇게 하는 인쇄회로기판 제작에 관한 것이다.The present invention relates to printed circuit board fabrication. More specifically, by forming copper thin films by spraying on non-copper plated films and insulators, it is possible to realize delicate and various patterns, and to manufacture multiple printed circuit boards by connecting several substrates at once and making the thickness of substrates thinner. It is about.
본 발명은 필름 및 절연체판을 제공하는 단계; 상기 필름 및 절연체판에 드릴링하는 단계; 상기 드릴링한 윗면과 아랫면에 1차 분사 박막층을 형성하는 단계; 및 상기 1차 분사 박막층의 표면에 2차 동박막층을 형성하는 단계를 포함하는 것을 특징으로 한다.The present invention provides a film and an insulator plate; Drilling in the film and insulator plate; Forming a first spray thin film layer on the drilled upper and lower surfaces; And forming a secondary copper thin film layer on the surface of the primary spray thin film layer.
본 발명에 의하면, 동층이 적층되지 않은 필름 및 절연체판을 사용하여 얇으며 한번에 적층이 가능하고 가격이 저렴해지며 섬세하고 다양한 패턴이 가능한 효과가 있다.According to the present invention, by using a film and an insulator plate in which the copper layer is not laminated, a thin layer can be laminated at one time, the price is low, and there is an effect capable of delicate and various patterns.
Description
도 1a은 종래의 인쇄회로기판의 단면도,1A is a cross-sectional view of a conventional printed circuit board,
도 1b는 종래의 동도금한 인쇄회로기판의 단면도, 1B is a cross-sectional view of a conventional copper plated printed circuit board,
도 2는 종래의 인쇄회로기판의 제작 순서도, 2 is a manufacturing flowchart of a conventional printed circuit board,
도 3a은 본 발명의 바람직한 일실시예에 따른 분사식 인쇄회로기판의 단면도,Figure 3a is a cross-sectional view of a sprayed printed circuit board according to an embodiment of the present invention,
도 3b는 본 발명의 바람직한 일실시예에 따른 분사식 동도금한 인쇄회로기판의 단면도,Figure 3b is a cross-sectional view of a spray copper plated printed circuit board according to an embodiment of the present invention,
도 4a는 본 발명의 바람직한 다른 실시예에 따른 분사식 인쇄회로기판의 단면도,Figure 4a is a cross-sectional view of a sprayed printed circuit board according to another embodiment of the present invention,
도 4b는 본 발명의 바람직한 다른 실시예에 따른 분사식 인쇄회로기판의 드릴링한 단면도,Figure 4b is a cross-sectional view of the drilled printed circuit board according to another embodiment of the present invention;
도 4c는 본 발명의 바람직한 다른 실시예에 따른 분사식 인쇄회로기판의 일차분사 박막층 단면도,Figure 4c is a cross-sectional view of the first injection thin film layer of the sprayed printed circuit board according to another embodiment of the present invention,
도 4d는 본 발명의 바람직한 다른 실시예에 따른 분사식 인쇄회로기판의 이차 분사 박막층 단면도,4D is a cross-sectional view of a secondary spray thin film layer of a sprayed printed circuit board according to another exemplary embodiment of the present invention;
도 5는 본 발명의 바람직한 실시예에 따른 분사식 인쇄회로기판의 제작 순서도이다.5 is a manufacturing flow chart of a spray type printed circuit board according to a preferred embodiment of the present invention.
< 도면의 주요 부분에 대한 부호의 설명 ><Description of Symbols for Main Parts of Drawings>
100 : 필름 및 절연체 110 : 1차 분사 박막층 100: film and insulator 110: first injection thin film layer
120 : 격벽 130 : 2차 동박막층120: partition 130: secondary copper thin film layer
본 발명은 인쇄회로기판 제작에 관한 것이다. 더욱 상세하게는, 구리가 도금되어있지 않은 필름 및 절연체에 분사식으로 동박막을 형성시켜서 섬세하고 다양한 패턴 구현이 가능하고 여러 기판을 연결지어 단번에 제작이 가능하며 기판의 두께도 얇게 하는 인쇄회로기판 제작에 관한 것이다.The present invention relates to the manufacture of a printed circuit board. More specifically, by forming copper thin films by spraying on non-copper plated films and insulators, it is possible to realize delicate and various patterns, and to manufacture multiple printed circuit boards by connecting several substrates at once and making the thickness of substrates thinner. It is about.
일반적으로 인쇄회로기판은 사용하는 분야 즉 전자제품의 소형화 및 경량화가 되면서 얇고 섬세하며 다양한 방향으로 발전되어 가고 있다. In general, printed circuit boards are being developed in thin, delicate, and various directions as they become smaller and lighter in electronic fields.
그 사용하는 용도를 보면 전자제품의 핵심부품으로서 카메라, 컴퓨터, 핸드폰, 비디오 및 오디오기기, 위성장비, 의료장비 등에서 널리 사용되고 있다. In terms of its use, it is widely used in cameras, computers, mobile phones, video and audio equipment, satellite equipment, and medical equipment as core parts of electronic products.
또한 반도체의 발달로 초정밀도의 인쇄회로기판이 필요한데 여기서 초정밀도 인쇄회로기판이 가져야할 사항은 최대한 소형이어야 하며 두께도 공간을 차지하지 않도록 얇아야 하며 섬세하고 다양한 회로를 형성하는 것이 가능해야 한다. In addition, with the development of semiconductors, ultra-precision printed circuit boards are required. The matters of ultra-precision printed circuit boards should be as small as possible, thin and thin enough not to occupy space, and it should be possible to form delicate and diverse circuits.
상기한 바와 같은 특성은 우주산업에서도 필요로하고 있는데 최악의 환경속에서 견딜 수 있는 즉 내구성이 뛰어난 인쇄회로기판을 요구하고 있다.The above characteristics are also required in the aerospace industry, and require printed circuit boards that can withstand the worst environments, that is, they are durable.
도 1a는 종래의 인쇄회로기판의 단면도이고 도 1b는 종래의 동도금한 인쇄회로기판의 단면도이다.1A is a cross-sectional view of a conventional printed circuit board, and FIG. 1B is a cross-sectional view of a conventional copper plated printed circuit board.
도 1a와 도 1b를 참조하여 종래의 인쇄회로기판을 설명하면 다음과 같다. Referring to FIGS. 1A and 1B, a conventional printed circuit board will be described.
우선, 도면에 도시되어 있는 바와 같이 필름 및 절연체(10)의 윗면과 아랫면에는 동층(11)이 적층되어 있다. First, as shown in the figure, the
또한, 필름 및 절연체(10)의 중심부에는 격벽(12)으로 분할되어 있다. In addition, the
뿐만아니라, 필름 및 절연체(10)의 윗면 동층(11)과 아래면 동층(11)은 필름 및 절연체(10)에 의해서 전기가 통하지 않도록 절연되어 있다.In addition, the
다음으로 도 1a에서 준비된 인쇄회로기판에 도 1b에서 도시된 바와 같이 1차 박막(13)을 적층하고 적층된 1차 박막(13)의 표면에 2차 박막(14)을 적층시킨다. Next, as shown in FIG. 1B, the primary
도 2는 종래의 인쇄회로기판의 제작 순서도이다. 2 is a manufacturing flowchart of a conventional printed circuit board.
도 2를 참조하면 , 우선 베이스 필름의 양면에 동박이 적층된 동박적층판을 제공한다(S10).Referring to FIG. 2, first, a copper foil laminate in which copper foil is laminated on both surfaces of a base film is provided (S10).
그리고 동박적층판에 드릴로 홀을 형성한다(S20). 이처럼 드릴에 의해서 홀을 형성한 동박적층판에 1차 박막을 적층한다(S30). 다음 단계로 적층된 1차 박막위에 2차 박막을 적층한다(S40). And a hole is formed in the copper-clad laminate by a drill (S20). Thus, the primary thin film is laminated on the copper-clad laminate in which holes are formed by the drill (S30). Next, the second thin film is laminated on the laminated first thin film (S40).
지금까지 설명한 종래의 인쇄회로기판은 필름 및 절연체(10)의 윗면과 아랫 면에 동층(11)이 적층되어 있는 상태에서 1차 박막(13)과 2차 박막(14)을 적층하기 때문에 인쇄회로기판이 두꺼워지며 공정상에서 기판을 일일이 제공하여야 하고 동층(11)이 적층된 인쇄회로기판을 사용하기 때문에 가격이 상승하는 문제점이 있었다.In the conventional printed circuit board described above, the first
이러한 문제점을 해결하기 위해 본 발명은, 동층이 적층되지 않은 필름 및 절연체판을 사용하여 얇고 한번에 적층이 가능하며 가격이 저렴해지고 섬세하며 다양한 패턴이 가능한 인쇄회로기판을 제공하는 것을 그 목적으로 한다.In order to solve this problem, an object of the present invention is to provide a printed circuit board that is thin, can be laminated at one time, is inexpensive, is delicate, and has various patterns by using a film and an insulator board on which a copper layer is not laminated.
이러한 목적을 달성하기 위하여, 본 발명의 일실시예에 따른 분사식 인쇄회로기판 제작 방법은 필름 및 절연체판을 제공하는 단계; 상기 필름 및 절연체판에 드릴링하는 단계; 상기 드릴링한 윗면과 아랫면에 1차 분사 박막층을 형성하는 단계; 및 상기 1차 분사 박막층의 표면에 2차 동박막층을 형성하는 단계를 포함하는 것을 특징으로 한다.In order to achieve this object, a method of manufacturing a sprayed printed circuit board according to an embodiment of the present invention comprises the steps of providing a film and an insulator plate; Drilling in the film and insulator plate; Forming a first spray thin film layer on the drilled upper and lower surfaces; And forming a secondary copper thin film layer on the surface of the primary spray thin film layer.
또한, 본 발명의 일실시예에 따른 분사식 인쇄회로기판 제작 방법에 있어서 1차 분사 박막층은 드릴링한 표면에 분사하는 물질이 동인것을 특징으로 한다.In addition, in the method of manufacturing a spray-type printed circuit board according to an embodiment of the present invention, the primary spray thin film layer is characterized in that the material sprayed on the drilled surface is the same.
또한, 본 발명의 일실시예에 따른 분사식 인쇄회로기판 제작 방법에 있어서 제 2차 동박막층의 표면에 회로를 형성하는 단계를 더 포함하는 것을 특징으로 한다.In addition, the method of manufacturing a sprayed printed circuit board according to an embodiment of the present invention is characterized in that it further comprises the step of forming a circuit on the surface of the second copper thin film layer.
또한, 본 발명의 일실시예에 따른 분사식 인쇄회로기판 제작 방법에 있어서 필름 및 절연체의 윗면과 아랫면에는 동박막층이 형성되어 있지 않은 것을 특징으로 한다.In addition, in the method of manufacturing a sprayed printed circuit board according to an embodiment of the present invention, the upper and lower surfaces of the film and the insulator are not characterized in that the copper thin film layer is formed.
이하, 본 발명의 바람직한 실시예를 첨부된 도면들을 참조하여 상세히 설명한다. 우선 각 도면의 구성요소들에 참조부호를 부가함에 있어서, 동일한 구성요소들에 대해서는 비록 다른 도면상에 표시되더라도 가능한 한 동일한 부호를 가지도록 하고 있음에 유의해야 한다. 또한, 본 발명을 설명함에 있어서, 관련된 공지 구성 또는 기능에 대한 구체적인 설명이 본 발명의 요지를 흐릴 수 있다고 판단되는 경우에는 그 상세한 설명은 생략한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. First of all, in adding reference numerals to the components of each drawing, it should be noted that the same reference numerals are used as much as possible even if displayed on different drawings. In addition, in describing the present invention, when it is determined that the detailed description of the related well-known configuration or function may obscure the gist of the present invention, the detailed description thereof will be omitted.
도 3a는 본 발명의 바람직한 실시예에 따른 분사식 인쇄회로기판의 단면도이고 도 3b는 본 발명의 바람직한 실시예에 따른 분사식 동도금한 인쇄회로기판의 단면도이며 도 5는 본 발명의 바람직한 실시예에 따른 분사식 인쇄회로기판의 제작 순서도이다.3A is a cross-sectional view of a sprayed printed circuit board according to a preferred embodiment of the present invention, and FIG. 3B is a cross-sectional view of a sprayed copper plated printed circuit board according to a preferred embodiment of the present invention, and FIG. 5 is a sprayed type according to a preferred embodiment of the present invention. This is a manufacturing flowchart of a printed circuit board.
도 3a를 참조하면, 필름 및 절연체(100)가 도시되어 있다. 필름 및 절연체(100)의 중심부위에는 격벽(120)이 있다. Referring to FIG. 3A, a film and
여기서 사용되는 필름 및 절연체(100)는 적층되는 동박막을 절연시키는 역할을 하고 필름 및 절연체(100)의 윗면과 아랫면에는 동으로 적층되어 있지 않다. The film and the
도 3b를 참조하면, 동으로 적층되어 있지 않은 상태의 필름 및 절연체(100)의 윗면과 아랫면에 동을 분사해서 적층시켜 1차 분사 박막층(110)을 형성한다. Referring to FIG. 3B, the primary spray
다음으로 1차 분사 박막층(110)의 윗면과 아랫면에 동을 적층시켜 2차 동박 막층(130)을 형성한다.Next, copper is laminated on the upper surface and the lower surface of the primary injection
도 4a는 본 발명의 바람직한 다른 실시예에 따른 분사식 인쇄회로기판의 단면도이다. 도시된 바와 같이 인쇄회로기판이 절연체의 상단에 동층이 적층되어 있다. 4A is a cross-sectional view of a sprayed printed circuit board according to another exemplary embodiment of the present invention. As shown in the figure, a copper layer is stacked on top of an insulator.
도 4b는 본 발명의 바람직한 다른 실시예에 따른 분사식 인쇄회로기판의 드릴링한 단면도이다. 도시된 바와 같이 인쇄회로기판의 중심부에 들릴링하여 동층이 보일때까지 홈을 판다.Figure 4b is a cross-sectional view of the drilled printed circuit board according to another embodiment of the present invention. As shown in the drawing, the grooves are lifted by the center of the printed circuit board until the copper layer is visible.
도 4c는 본 발명의 바람직한 다른 실시예에 따른 분사식 인쇄회로기판의 1차분사 박막층 단면도이다. 도시된 바와 같이 인쇄회로기판의 아랫면에 1차 분사 박막층을 분사방식으로 형성시킨다.Figure 4c is a cross-sectional view of the first injection thin film layer of the jet printed circuit board according to another embodiment of the present invention. As shown in the drawing, a first spray thin film layer is formed on the bottom surface of the printed circuit board by spraying.
도 4d는 본 발명의 바람직한 다른 실시예에 따른 분사식 인쇄회로기판의 2차 분사 박막층 단면도이다. 도시된 바와 같이 1차 분사 박막층의 다음면에 2차 적으로 동을 분사시켜 박막층을 형성한다.4D is a cross-sectional view of a second injection thin film layer of a jet printed circuit board according to another exemplary embodiment of the present invention. As shown, copper is secondarily sprayed on the next surface of the first injection thin film layer to form a thin film layer.
이처럼 절연체의 한쪽면에만 동층이 있는 인쇄회로기판을 사용하고 적층을 동층이 없는 절연체의 아래면에 실시함으로써 얇은 인쇄회로기판을 형성할 수 있다.Thus, a thin printed circuit board can be formed by using a printed circuit board having a copper layer on only one side of the insulator and laminating the bottom surface of the insulator without the copper layer.
도 5를 참조하면, 동으로 윗면과 아랫면이 적층되어 있지 않은 필름 및 절연체판을 제공한다(S100). Referring to FIG. 5, a copper film and an insulator plate are not stacked on the upper and lower surfaces (S100).
다음단계로 드릴로 홀을 형성(S110)시키고 동을 분사시켜 1차 분사 박막층(110)을 형성시킨다(S120). 여기서 분사하는 방법으로 동을 적층시키기 때문에 필름 및 절연체에 적당한 동박막이 만들어지게 된다. In the next step, a hole is formed with a drill (S110), and copper is sprayed to form a first injection thin film layer 110 (S120). Since copper is laminated | stacked by the method of spraying here, the copper foil film suitable for a film and an insulator is made.
그리고 1차 분사 박막층(110)윗면과 아랫면에 동을 적층시켜 2차 동박막층(130)을 형성하게 된다(S130).Then, the copper is laminated on the upper and lower surfaces of the first injection
이상의 설명은 본 발명의 기술 사상을 예시적으로 설명한 것에 불과한 것으로서, 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자라면 본 발명의 본질적인 특성에서 벗어나지 않는 범위에서 다양한 수정 및 변형이 가능할 것이다. 따라서, 본 발명에 개시된 실시예들은 본 발명의 기술 사상을 한정하기 위한 것이 아니라 설명하기 위한 것이고, 이러한 실시예에 의하여 본 발명의 기술 사상의 범위가 한정되는 것은 아니다. 본 발명의 보호 범위는 아래 청구범위에 의하여 해석되어야 하며, 그와 동등한 범위 내에 있는 모든 기술 사상은 본 발명의 권리범위에 포함되는 것으로 해석되어야 할 것이다.The above description is merely illustrative of the technical idea of the present invention, and those skilled in the art to which the present invention pertains may make various modifications and changes without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention but to describe the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The scope of protection of the present invention should be interpreted by the following claims, and all technical ideas within the scope equivalent thereto should be construed as being included in the scope of the present invention.
이상에서 설명한 바와 같이 본 발명에 의하면, 동층이 적층되지 않은 필름 및 절연체판을 사용하여 얇으며 한번에 적층이 가능하고 가격이 저렴해지며 섬세하고 다양한 패턴이 가능한 효과가 있다.As described above, according to the present invention, the film and the insulator plate having the same copper layer are not laminated. The thin layer can be laminated at a time, the price is low, and the delicate and various patterns are possible.
Claims (4)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020060133562A KR100841237B1 (en) | 2006-12-26 | 2006-12-26 | Manufacturing method of sprayed printed circuit board |
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| Application Number | Priority Date | Filing Date | Title |
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| KR1020060133562A KR100841237B1 (en) | 2006-12-26 | 2006-12-26 | Manufacturing method of sprayed printed circuit board |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0222888A (en) * | 1988-07-12 | 1990-01-25 | Shinichiro Koga | Manufacture of printed board by metal spraying |
| JP2000244100A (en) | 1999-02-24 | 2000-09-08 | Yazaki Corp | Thermal spray circuit body and method of manufacturing the same |
| JP2003283107A (en) | 2002-03-22 | 2003-10-03 | Yazaki Corp | Thermal spray circuit body and method of manufacturing thermal spray circuit body |
| KR20070013399A (en) * | 2005-07-26 | 2007-01-31 | 연세대학교 산학협력단 | Manufacturing Method and Impedance Matching of Printed Circuit Boards with Multiple Dielectric Constants |
-
2006
- 2006-12-26 KR KR1020060133562A patent/KR100841237B1/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0222888A (en) * | 1988-07-12 | 1990-01-25 | Shinichiro Koga | Manufacture of printed board by metal spraying |
| JP2000244100A (en) | 1999-02-24 | 2000-09-08 | Yazaki Corp | Thermal spray circuit body and method of manufacturing the same |
| JP2003283107A (en) | 2002-03-22 | 2003-10-03 | Yazaki Corp | Thermal spray circuit body and method of manufacturing thermal spray circuit body |
| KR20070013399A (en) * | 2005-07-26 | 2007-01-31 | 연세대학교 산학협력단 | Manufacturing Method and Impedance Matching of Printed Circuit Boards with Multiple Dielectric Constants |
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