KR100856494B1 - 레이저가공용 실리콘 고무패드가 부착된 고무인 - Google Patents
레이저가공용 실리콘 고무패드가 부착된 고무인 Download PDFInfo
- Publication number
- KR100856494B1 KR100856494B1 KR1020070010556A KR20070010556A KR100856494B1 KR 100856494 B1 KR100856494 B1 KR 100856494B1 KR 1020070010556 A KR1020070010556 A KR 1020070010556A KR 20070010556 A KR20070010556 A KR 20070010556A KR 100856494 B1 KR100856494 B1 KR 100856494B1
- Authority
- KR
- South Korea
- Prior art keywords
- rubber pad
- rubber
- handle
- attached
- laser processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/02—Flooring or floor layers composed of a number of similar elements
- E04F15/04—Flooring or floor layers composed of a number of similar elements only of wood or with a top layer of wood, e.g. with wooden or metal connecting members
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B21/00—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board
- B32B21/04—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board comprising wood as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2607/00—Walls, panels
Landscapes
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
상기 지류에 일측면이 매개부재에 의해 부착되며 타측면에는 레이저가공기에 의해 문자가 각인되는 실리콘 고무패드;를 포함하여, 상기 실리콘 고무패드(130)와 손잡이대(100) 사이에 지류(110)가 부착됨으로써 상기 손잡이대(100)와 실리콘 고무패드(130)의 접착성이 향상되는 것을 특징으로 하는 레이저가공용 실리콘 고무패드가 부착된 고무인을 제공하려는 것이다.
Claims (2)
- 손잡이대(100);상기 손잡이대(100)의 저면에 접착부재(120)에 의해 부착되는 지류(110); 및상기 지류(110)에 일측면이 매개부재에 의해 부착되며 타측면에는 레이저가공기에 의해 문자(132)가 각인되는 실리콘 고무패드(130);를 포함하여상기 실리콘 고무패드(130)와 손잡이대(100) 사이에 지류(110)가 부착됨으로써 상기 손잡이대(100)와 실리콘 고무패드(130)의 접착성이 향상되는 것을 특징으로 하는 레이저가공용 실리콘 고무패드가 부착된 고무인.
- 청구항 1에 있어서, 상기 매개부재는 접착력을 갖는 프라이머(140)인 것을 특징으로 하는 레이저가공용 실리콘 고무패드가 부착된 고무인.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020070010556A KR100856494B1 (ko) | 2007-02-01 | 2007-02-01 | 레이저가공용 실리콘 고무패드가 부착된 고무인 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020070010556A KR100856494B1 (ko) | 2007-02-01 | 2007-02-01 | 레이저가공용 실리콘 고무패드가 부착된 고무인 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20080072172A KR20080072172A (ko) | 2008-08-06 |
| KR100856494B1 true KR100856494B1 (ko) | 2008-09-04 |
Family
ID=39882553
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020070010556A Expired - Fee Related KR100856494B1 (ko) | 2007-02-01 | 2007-02-01 | 레이저가공용 실리콘 고무패드가 부착된 고무인 |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR100856494B1 (ko) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR930004724Y1 (ko) * | 1990-07-19 | 1993-07-23 | 남강우 | 내열성 실리콘고무 그림문양 로울러 |
| KR200203316Y1 (ko) * | 2000-04-27 | 2000-11-15 | 방성현 | 레이저가공용 고무패드가 부착된 고무인용 손잡이대 |
| KR100343912B1 (ko) * | 1998-09-21 | 2002-07-20 | 프레스텍, 인크. | 레이져 화상 형성 장치에 사용하기 위한 리소그래픽 인쇄판 |
-
2007
- 2007-02-01 KR KR1020070010556A patent/KR100856494B1/ko not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR930004724Y1 (ko) * | 1990-07-19 | 1993-07-23 | 남강우 | 내열성 실리콘고무 그림문양 로울러 |
| KR100343912B1 (ko) * | 1998-09-21 | 2002-07-20 | 프레스텍, 인크. | 레이져 화상 형성 장치에 사용하기 위한 리소그래픽 인쇄판 |
| KR200203316Y1 (ko) * | 2000-04-27 | 2000-11-15 | 방성현 | 레이저가공용 고무패드가 부착된 고무인용 손잡이대 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20080072172A (ko) | 2008-08-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| USD593158S1 (en) | Set of labels for vehicle battery | |
| ATE352832T1 (de) | Etikettenbogen | |
| AU2003255494A1 (en) | Heat-sensitive positive working lithographic printing plate precursor with a high resistance to chemicals | |
| DE602004032236D1 (de) | Selbstlaminiertes etikettenband | |
| MXPA02006596A (es) | Etiquetador de cd. | |
| DE60108659D1 (de) | Durch wärme abziehbare druckempfindliche klebefolie | |
| ATE344149T1 (de) | Digital bedruckbare trennmittelbeschichtung und diese beschichtung verwendenes vordruckkonstrukt | |
| KR970022897A (ko) | 라벨 부착부 형성용 점착 시이트 | |
| KR100856494B1 (ko) | 레이저가공용 실리콘 고무패드가 부착된 고무인 | |
| JP2007171776A (ja) | 粘着剤部分塗布によるライナーレスラベル | |
| FI20055021A0 (fi) | Menetelmä ja laitteisto embossauksessa sekä kuumafoliopainokone | |
| EP1137325A3 (en) | Fixing member, electroluminescent device using the member and backing substrate for the device | |
| WO2006019670A3 (en) | Vibratable die attachment tool | |
| TW200707744A (en) | Semiconductor device and process for producing the same | |
| ATE357718T1 (de) | Etikett mit anfasslasche | |
| EA200501371A1 (ru) | Этикетка с удаляемым участком | |
| JP2007168388A (ja) | スタンプ印、スタンプ用台木およびスタンプ印セット | |
| KR200253961Y1 (ko) | 광고 간판 칼라 시트지 부착용 헤라 | |
| JP2007144968A (ja) | 押し印 | |
| CN201309133Y (zh) | 具有标贴的螺丝刀手柄 | |
| JP3131306U (ja) | 貼付け簡単切手 | |
| CN201736483U (zh) | 免剥离离型纸打孔单向透视膜 | |
| JP3129117U (ja) | タックシール機能付きクリアホルダー | |
| WO2005118432A3 (en) | Dvd case with high resolution printed cover | |
| JP2000037792A (ja) | ラベル及びラベルの製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| D13-X000 | Search requested |
St.27 status event code: A-1-2-D10-D13-srh-X000 |
|
| D14-X000 | Search report completed |
St.27 status event code: A-1-2-D10-D14-srh-X000 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U11-oth-PR1002 Fee payment year number: 1 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
| FPAY | Annual fee payment |
Payment date: 20110728 Year of fee payment: 4 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 4 |
|
| FPAY | Annual fee payment |
Payment date: 20120828 Year of fee payment: 5 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 5 |
|
| LAPS | Lapse due to unpaid annual fee | ||
| PC1903 | Unpaid annual fee |
St.27 status event code: A-4-4-U10-U13-oth-PC1903 Not in force date: 20130829 Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE |
|
| PC1903 | Unpaid annual fee |
St.27 status event code: N-4-6-H10-H13-oth-PC1903 Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE Not in force date: 20130829 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |