KR101917618B1 - 히드로실릴화 경화형 실리콘 고무 조성물 - Google Patents
히드로실릴화 경화형 실리콘 고무 조성물 Download PDFInfo
- Publication number
- KR101917618B1 KR101917618B1 KR1020137034804A KR20137034804A KR101917618B1 KR 101917618 B1 KR101917618 B1 KR 101917618B1 KR 1020137034804 A KR1020137034804 A KR 1020137034804A KR 20137034804 A KR20137034804 A KR 20137034804A KR 101917618 B1 KR101917618 B1 KR 101917618B1
- Authority
- KR
- South Korea
- Prior art keywords
- units
- sio
- component
- silicon atoms
- mass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 33
- 229920002379 silicone rubber Polymers 0.000 title claims abstract description 19
- 239000004945 silicone rubber Substances 0.000 title claims abstract description 19
- -1 rare earth salt Chemical class 0.000 claims abstract description 20
- 125000001183 hydrocarbyl group Chemical group 0.000 claims abstract description 13
- 229910052761 rare earth metal Inorganic materials 0.000 claims abstract description 13
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 12
- 238000006459 hydrosilylation reaction Methods 0.000 claims abstract description 10
- 229910052684 Cerium Inorganic materials 0.000 claims abstract description 8
- 239000007809 chemical reaction catalyst Substances 0.000 claims abstract description 7
- 229920006136 organohydrogenpolysiloxane Polymers 0.000 claims abstract description 6
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical group [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 claims abstract description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 19
- 125000003342 alkenyl group Chemical group 0.000 claims description 16
- 230000003287 optical effect Effects 0.000 claims description 13
- 229920001296 polysiloxane Polymers 0.000 claims description 12
- 239000003054 catalyst Substances 0.000 claims description 9
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 9
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 9
- 238000002834 transmittance Methods 0.000 claims description 7
- 238000006116 polymerization reaction Methods 0.000 claims description 6
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 5
- 229910004283 SiO 4 Inorganic materials 0.000 claims description 5
- OBETXYAYXDNJHR-SSDOTTSWSA-M (2r)-2-ethylhexanoate Chemical class CCCC[C@@H](CC)C([O-])=O OBETXYAYXDNJHR-SSDOTTSWSA-M 0.000 claims description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 4
- OBETXYAYXDNJHR-UHFFFAOYSA-N alpha-ethylcaproic acid Natural products CCCCC(CC)C(O)=O OBETXYAYXDNJHR-UHFFFAOYSA-N 0.000 claims description 4
- 239000000470 constituent Substances 0.000 claims description 4
- 229910052697 platinum Inorganic materials 0.000 claims description 4
- 150000001735 carboxylic acids Chemical class 0.000 claims description 3
- GGVUYAXGAOIFIC-UHFFFAOYSA-K cerium(3+);2-ethylhexanoate Chemical compound [Ce+3].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O GGVUYAXGAOIFIC-UHFFFAOYSA-K 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 229910052763 palladium Inorganic materials 0.000 claims description 2
- 150000002910 rare earth metals Chemical class 0.000 claims description 2
- 229910052703 rhodium Inorganic materials 0.000 claims description 2
- 239000010948 rhodium Substances 0.000 claims description 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims description 2
- 239000011833 salt mixture Substances 0.000 claims description 2
- 241001494479 Pecora Species 0.000 claims 2
- 239000000178 monomer Substances 0.000 claims 2
- QBKTXRLYEHZACW-UHFFFAOYSA-K 2-ethylhexanoate;neodymium(3+) Chemical compound [Nd+3].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O QBKTXRLYEHZACW-UHFFFAOYSA-K 0.000 claims 1
- LJLKMNSTMFZSEO-UHFFFAOYSA-K 2-ethylhexanoate;praseodymium(3+) Chemical compound [Pr+3].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O LJLKMNSTMFZSEO-UHFFFAOYSA-K 0.000 claims 1
- 239000002516 radical scavenger Substances 0.000 claims 1
- 229910052779 Neodymium Inorganic materials 0.000 abstract description 5
- 150000001875 compounds Chemical class 0.000 abstract description 5
- 229910052746 lanthanum Inorganic materials 0.000 abstract description 5
- 229910052777 Praseodymium Inorganic materials 0.000 abstract description 4
- 229910052772 Samarium Inorganic materials 0.000 abstract description 4
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 abstract description 4
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 abstract description 4
- PUDIUYLPXJFUGB-UHFFFAOYSA-N praseodymium atom Chemical compound [Pr] PUDIUYLPXJFUGB-UHFFFAOYSA-N 0.000 abstract description 3
- KZUNJOHGWZRPMI-UHFFFAOYSA-N samarium atom Chemical compound [Sm] KZUNJOHGWZRPMI-UHFFFAOYSA-N 0.000 abstract description 3
- 229920002050 silicone resin Polymers 0.000 abstract description 3
- 150000001732 carboxylic acid derivatives Chemical class 0.000 abstract 1
- 239000000047 product Substances 0.000 description 8
- 229920001577 copolymer Polymers 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000002253 acid Substances 0.000 description 4
- 229910000420 cerium oxide Inorganic materials 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 3
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 description 2
- 150000000703 Cerium Chemical class 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- 229910004738 SiO1 Inorganic materials 0.000 description 2
- UNJPQTDTZAKTFK-UHFFFAOYSA-K cerium(iii) hydroxide Chemical compound [OH-].[OH-].[OH-].[Ce+3] UNJPQTDTZAKTFK-UHFFFAOYSA-K 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 description 2
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- KBXJHRABGYYAFC-UHFFFAOYSA-N octaphenylsilsesquioxane Chemical group O1[Si](O2)(C=3C=CC=CC=3)O[Si](O3)(C=4C=CC=CC=4)O[Si](O4)(C=5C=CC=CC=5)O[Si]1(C=1C=CC=CC=1)O[Si](O1)(C=5C=CC=CC=5)O[Si]2(C=2C=CC=CC=2)O[Si]3(C=2C=CC=CC=2)O[Si]41C1=CC=CC=C1 KBXJHRABGYYAFC-UHFFFAOYSA-N 0.000 description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000002683 reaction inhibitor Substances 0.000 description 2
- 238000010058 rubber compounding Methods 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- 125000001731 2-cyanoethyl group Chemical group [H]C([H])(*)C([H])([H])C#N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 239000006057 Non-nutritive feed additive Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000005370 alkoxysilyl group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 125000004218 chloromethyl group Chemical group [H]C([H])(Cl)* 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000006258 conductive agent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 229920005645 diorganopolysiloxane polymer Polymers 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 229910052909 inorganic silicate Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 150000003058 platinum compounds Chemical class 0.000 description 1
- 229920001843 polymethylhydrosiloxane Polymers 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000000979 retarding effect Effects 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- PMTRSEDNJGMXLN-UHFFFAOYSA-N titanium zirconium Chemical compound [Ti].[Zr] PMTRSEDNJGMXLN-UHFFFAOYSA-N 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 238000009849 vacuum degassing Methods 0.000 description 1
- 229920006163 vinyl copolymer Polymers 0.000 description 1
- 150000003755 zirconium compounds Chemical class 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
- C08K5/098—Metal salts of carboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/42—Block-or graft-polymers containing polysiloxane sequences
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Abstract
Description
Claims (9)
- (A) 평균 중합도 50~10000이며, 1분자 중에 적어도 2개의 규소 원자와 결합한 알케닐기를 함유하는 오가노폴리실록산 100질량부
(B) R1SiO1/2 단위(M단위), SiO4/2 단위(Q단위), R2SiO2/2 단위(D단위) 및 R3SiO3/2 단위(T단위)로부터 선택되는 단위로 이루어지고, 이들 전체 구성 단위 중 M단위, Q단위 및 T단위의 합계량이 80mol% 이상인 실리콘 수지(여기서 R1, R2, R3은 탄소수 1~6의 1가 탄화수소기이며, 또한 1분자 중의 적어도 2개는 알케닐기이다.) 10~400질량부
(C) 1분자 중에 적어도 2개의 규소 원자와 결합한 수소 원자를 함유하는 오가노하이드로젠폴리실록산이며, (A) 및 (B)성분 중의 규소 원자와 결합한 알케닐기 1개당 규소 원자에 결합한 수소 원자의 수가 1.0~10.0개가 되는 양
(D) 2-에틸헥산산의 희토류염 혼합물이며, 상기 희토류염 혼합물이 2-에틸헥산산세륨, 2-에틸헥산산란타넘, 2-에틸헥산산네오디뮴, 2-에틸헥산산프라세오디뮴 및 2-에틸헥산산사마륨으로 이루어지는 혼합물이며, 다른 카복실산의 희토류염을 포함하지 않는 것이며, (A)성분 100질량부에 대해 희토류 원소의 합계량으로서 5~300ppm이 되는 양
(E) 하이드로실릴화 반응 촉매
를 함유하는 하이드로실릴화 경화형 실리콘 고무 조성물. - (A) 평균 중합도 50~10000이며, 1분자 중에 적어도 2개의 규소 원자와 결합한 알케닐기를 함유하는 오가노폴리실록산 100질량부
(B) R1SiO1/2 단위(M단위), SiO4/2 단위(Q단위), R2SiO2/2 단위(D단위) 및 R3SiO3/2 단위(T단위)로부터 선택되는 단위로 이루어지고, 이들 전체 구성 단위 중 M단위, Q단위 및 T단위의 합계량이 80mol% 이상인 실리콘 수지(여기서 R1, R2, R3은 탄소수 1~6의 1가 탄화수소기이며, 또한 1분자 중의 적어도 2개는 알케닐기이다.) 10~400질량부
(C) 1분자 중에 적어도 2개의 규소 원자와 결합한 수소 원자를 함유하는 오가노하이드로젠폴리실록산이며, (A) 및 (B)성분 중의 규소 원자와 결합한 알케닐기 1개당 규소 원자에 결합한 수소 원자의 수가 1.0~10.0개가 되는 양
(D) 2-에틸헥산산세륨을 포함하는 2-에틸헥산산이며, 다른 카복실산의 희토류염을 포함하지 않는 것이며, (A)성분 100질량부에 대해 희토류 원소(단, 세륨만)의 양으로서 5~300ppm이 되는 양
(E) 하이드로실릴화 반응 촉매
를 함유하는 하이드로실릴화 경화형 실리콘 고무 조성물. - 제 1 항 또는 제 2 항에 있어서, (B)의 전체 구성 단위 중 M단위 및 Q단위의 합계량이 80mol% 이상인 실리콘 수지인 것을 특징으로 하는 하이드로실릴화 경화형 실리콘 고무 조성물.
- 제 1 항 또는 제 2 항에 있어서, (E)성분의 하이드로실릴화 반응 촉매가 백금계 촉매, 팔라듐계 촉매, 로듐계 촉매이며, 그 함유량이 백금족 금속으로서 (A)성분 100질량부에 대해 1~100ppm인 것을 특징으로 하는 하이드로실릴화 경화형 실리콘 고무 조성물.
- 제 1 항 또는 제 2 항에 기재된 하이드로실릴화 경화형 실리콘 고무 조성물의 경화물로 이루어지는 성형체.
- 제 5 항에 있어서, 상기한 경화물로 이루어지는 성형체가 두께 2mm의 시트의 600nm에 있어서의 전광선 투과율이 90% 이상인 것을 특징으로 하는 성형체.
- 제 5 항에 있어서, 광학 렌즈, 광 도파판, 디스플레이층 혹은 적층판, 센서, 광학 디바이스의 피복·밀봉용인 것을 특징으로 하는 성형체.
- 삭제
- 삭제
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2011-268788 | 2011-12-08 | ||
| JP2011268788 | 2011-12-08 | ||
| PCT/JP2012/079885 WO2013084699A1 (ja) | 2011-12-08 | 2012-11-19 | ヒドロシリル化硬化型シリコーンゴム組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20140110717A KR20140110717A (ko) | 2014-09-17 |
| KR101917618B1 true KR101917618B1 (ko) | 2018-11-13 |
Family
ID=48574077
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020137034804A Active KR101917618B1 (ko) | 2011-12-08 | 2012-11-19 | 히드로실릴화 경화형 실리콘 고무 조성물 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9164197B2 (ko) |
| EP (1) | EP2752459B1 (ko) |
| JP (1) | JP5422755B2 (ko) |
| KR (1) | KR101917618B1 (ko) |
| CN (1) | CN103827218B (ko) |
| WO (1) | WO2013084699A1 (ko) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9902811B2 (en) * | 2013-02-22 | 2018-02-27 | Dow Corning Toray Co. Ltd. | Curable silicone composition, cured product thereof, and optical semiconductor device |
| JP5775231B1 (ja) * | 2013-12-16 | 2015-09-09 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 付加硬化型シリコーン組成物 |
| WO2015118992A1 (ja) * | 2014-02-07 | 2015-08-13 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 付加硬化型シリコーン組成物 |
| JP2016084419A (ja) * | 2014-10-27 | 2016-05-19 | 信越化学工業株式会社 | 集光型太陽電池用シリコーンゴム組成物及び集光型太陽電池用フレネルレンズ及びプリズムレンズ |
| WO2016098884A1 (ja) * | 2014-12-18 | 2016-06-23 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 成形用ポリオルガノシロキサン組成物、光学用部材、光源用レンズまたはカバー、および成形方法 |
| JP2017088776A (ja) * | 2015-11-13 | 2017-05-25 | 信越化学工業株式会社 | 付加硬化型シリコーン樹脂組成物、該組成物の製造方法、及び光学半導体装置 |
| CN107163253A (zh) * | 2016-03-08 | 2017-09-15 | 中国科学院上海有机化学研究所 | 一种含铈的聚硅氧烷化合物 |
| JP6228284B1 (ja) * | 2016-11-02 | 2017-11-08 | 株式会社ダイセル | 硬化性樹脂組成物、硬化物、及び半導体装置 |
| JP6702233B2 (ja) | 2017-03-09 | 2020-05-27 | 信越化学工業株式会社 | 付加硬化型オルガノポリシロキサン樹脂組成物、該組成物の硬化物及び該硬化物を有する半導体装置 |
| JP6751368B2 (ja) | 2017-04-27 | 2020-09-02 | 信越化学工業株式会社 | 付加硬化型シリコーン組成物、該組成物の製造方法、及び光学半導体装置 |
| KR102568774B1 (ko) * | 2018-03-14 | 2023-08-21 | 모멘티브퍼포먼스머티리얼스코리아 주식회사 | 디스플레이 패널 및 이의 제조방법 |
| JP6923475B2 (ja) * | 2018-03-23 | 2021-08-18 | 信越化学工業株式会社 | 付加硬化型シリコーン組成物、シリコーン硬化物、及び光半導体装置 |
| TWI863907B (zh) | 2018-05-11 | 2024-12-01 | 美商陶氏有機矽公司 | 製造用於可撓式顯示裝置之聚矽氧背板之方法,可撓式顯示器及電子裝置 |
| TW201946976A (zh) | 2018-05-11 | 2019-12-16 | 美商陶氏有機矽公司 | 可固化聚矽氧組成物及其固化產物 |
| EP3837305B1 (de) * | 2018-08-17 | 2021-11-03 | Wacker Chemie AG | Vernetzbare organopolysiloxan-zusammensetzungen |
| JP7088880B2 (ja) | 2019-05-30 | 2022-06-21 | 信越化学工業株式会社 | 付加硬化型シリコーン樹脂組成物、該組成物の製造方法、及び光半導体装置 |
| WO2022264768A1 (ja) * | 2021-06-15 | 2022-12-22 | Dic株式会社 | 抗菌抗ウイルス剤、抗菌抗ウイルス性コーティング組成物、積層体、抗菌抗ウイルス性樹脂組成物および成形体 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2999076A (en) * | 1956-08-28 | 1961-09-05 | Dow Corning | Organopolysiloxane elastomers containing silica and a carboxylic acid salt of cobalt, cerium or copper |
| US3142655A (en) * | 1960-03-23 | 1964-07-28 | Gen Electric | Organopolysiloxane compositions incorporating heat-age resistant rare earth compounds |
| US3884950A (en) * | 1973-12-13 | 1975-05-20 | Toray Silicone Co | Organopolysiloxane composition having improved heat stability |
| JPS5558253A (en) * | 1978-10-25 | 1980-04-30 | Toshiba Silicone Co Ltd | Organopolysiloxane composition |
| JPS60163966A (ja) | 1984-02-06 | 1985-08-26 | Shin Etsu Chem Co Ltd | 耐熱性オルガノポリシロキサン組成物 |
| JPS61285257A (ja) * | 1985-06-11 | 1986-12-16 | Shin Etsu Chem Co Ltd | シリコ−ンゴム用熱安定剤およびその製造方法 |
| JPS61286436A (ja) | 1985-06-13 | 1986-12-17 | ナショナル住宅産業株式会社 | 間仕切壁パネルの支持構造 |
| JPH06293862A (ja) * | 1993-04-08 | 1994-10-21 | Toshiba Silicone Co Ltd | 難燃性シリコーンゲル組成物及びその硬化物 |
| JP3523098B2 (ja) * | 1998-12-28 | 2004-04-26 | 信越化学工業株式会社 | 付加硬化型シリコーン組成物 |
| JP2004059783A (ja) | 2002-07-30 | 2004-02-26 | Kanegafuchi Chem Ind Co Ltd | 金型離型性を有する硬化性組成物 |
| JP4586967B2 (ja) * | 2003-07-09 | 2010-11-24 | 信越化学工業株式会社 | 発光半導体被覆保護材及び発光半導体装置 |
| TWI373150B (en) * | 2003-07-09 | 2012-09-21 | Shinetsu Chemical Co | Silicone rubber composition, light-emitting semiconductor embedding/protecting material and light-emitting semiconductor device |
| EP1845133B1 (en) * | 2005-01-24 | 2015-10-14 | Momentive Performance Materials Japan LLC | Silicone composition for encapsulating luminescent element and luminescent device |
| JP4841846B2 (ja) * | 2005-02-02 | 2011-12-21 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 硬化性オルガノポリシロキサン組成物及び半導体装置 |
| JP5085089B2 (ja) | 2006-10-17 | 2012-11-28 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | シリコーンゴム組成物 |
| US8084529B2 (en) | 2006-12-28 | 2011-12-27 | Dow Corning Toray Co., Ltd. | Thermosetting silicone rubber composition |
| JP4605402B2 (ja) * | 2007-05-25 | 2011-01-05 | 信越化学工業株式会社 | 光導波板用液状シリコーンゴム組成物 |
| JP2008291148A (ja) * | 2007-05-25 | 2008-12-04 | Shin Etsu Chem Co Ltd | 耐熱性に優れたシリコーンゲル組成物 |
| JP5475296B2 (ja) * | 2009-02-02 | 2014-04-16 | 東レ・ダウコーニング株式会社 | 高透明のシリコーン硬化物を与える硬化性シリコーン組成物 |
-
2012
- 2012-11-19 US US14/346,525 patent/US9164197B2/en active Active
- 2012-11-19 EP EP12856572.8A patent/EP2752459B1/en active Active
- 2012-11-19 KR KR1020137034804A patent/KR101917618B1/ko active Active
- 2012-11-19 CN CN201280035277.7A patent/CN103827218B/zh active Active
- 2012-11-19 JP JP2012553117A patent/JP5422755B2/ja active Active
- 2012-11-19 WO PCT/JP2012/079885 patent/WO2013084699A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2013084699A1 (ja) | 2015-04-27 |
| EP2752459A4 (en) | 2015-04-15 |
| US20140275384A1 (en) | 2014-09-18 |
| CN103827218B (zh) | 2016-03-16 |
| US9164197B2 (en) | 2015-10-20 |
| JP5422755B2 (ja) | 2014-02-19 |
| CN103827218A (zh) | 2014-05-28 |
| KR20140110717A (ko) | 2014-09-17 |
| WO2013084699A1 (ja) | 2013-06-13 |
| EP2752459A1 (en) | 2014-07-09 |
| EP2752459B1 (en) | 2017-11-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101917618B1 (ko) | 히드로실릴화 경화형 실리콘 고무 조성물 | |
| TWI666267B (zh) | 聚矽氧凝膠組合物 | |
| CN104583326B (zh) | 固化性树脂组合物及使用其的半导体装置 | |
| WO2014189153A1 (en) | Heat resistant silicone rubber composition | |
| JP6439601B2 (ja) | 難燃性室温硬化型オルガノポリシロキサン組成物及びその製造方法並びに電気電子部品 | |
| WO2019116892A1 (ja) | 室温湿気硬化型シリコーンゲル組成物及びその硬化物並びに物品 | |
| JP5009042B2 (ja) | 室温硬化性ポリオルガノシロキサン組成物 | |
| JP7108432B2 (ja) | 付加型シリコーン樹脂組成物及びこれを使用した光半導体装置 | |
| WO2017122712A1 (ja) | 硬化性樹脂組成物、硬化物、封止材、及び半導体装置 | |
| JP2000169714A (ja) | 硬化性シリコーン組成物 | |
| JP6915551B2 (ja) | 難燃性室温硬化型オルガノポリシロキサン組成物、電気又は電子部品並びに電気又は電子部品における耐熱接着性の向上方法 | |
| JP5085089B2 (ja) | シリコーンゴム組成物 | |
| JP2017057386A (ja) | 縮合硬化型オルガノポリシロキサン組成物、縮合硬化型オルガノポリシロキサン組成物キットおよびシリコーンゴム | |
| JP5608909B2 (ja) | 室温硬化性ポリオルガノシロキサン組成物 | |
| JP6792080B2 (ja) | 硬化性シリコーン組成物 | |
| JP5547037B2 (ja) | 室温硬化性ポリオルガノシロキサン組成物 | |
| JP2017002223A (ja) | 紫外線吸収性付与シリコーンゴム組成物並びに紫外線吸収性付与シリコーンゴム及びその製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20131227 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20170825 Comment text: Request for Examination of Application |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20180201 Patent event code: PE09021S01D |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20180214 Patent event code: PE09021S01D |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20180806 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20181106 Patent event code: PR07011E01D |
|
| PR1002 | Payment of registration fee |
Payment date: 20181107 End annual number: 3 Start annual number: 1 |
|
| PG1601 | Publication of registration | ||
| PR1001 | Payment of annual fee |
Payment date: 20211026 Start annual number: 4 End annual number: 4 |
|
| PR1001 | Payment of annual fee |
Payment date: 20221021 Start annual number: 5 End annual number: 5 |
|
| PR1001 | Payment of annual fee |
Payment date: 20241017 Start annual number: 7 End annual number: 7 |

