KR102000954B1 - Manufacturing method of circuit module and film formation apparatus - Google Patents

Abstract

A metal film to be shielded is formed on the circuit module with high accuracy.
A method of manufacturing a circuit module (10) for forming a shielding metal film (18) on a circuit module (10) having a mounting surface (10a), a top surface (10b) and a side surface A step of forming a cover material layer 25 on the mounting surface 10a of the circuit module 10 and a step of forming a cover material layer 25 on the mounting surface 22 of the holder 21 having the adhesive portion 22, A holding step of holding the circuit module 10 in a state in which the covering material layer 25 is contacted and the top face 10b and the side face 10c are exposed and the film forming process is performed from the side of the top face 10b of the circuit module 10 A metal film forming process for forming a metal film 18 on the upper surface 10b and the side surface 10c and a separating process for separating the covering material layer 25 from the circuit module 10. [

Description

TECHNICAL FIELD [0001] The present invention relates to a method of manufacturing a circuit module,

The present invention relates to a method of manufacturing a circuit module for forming a metal film to be shielded in a circuit module and a film forming apparatus.

2. Description of the Related Art Conventionally, there is known a circuit module having a substrate, a plurality of electronic parts mounted on the main surface of the substrate, and a resin sealing part formed on the main surface of the substrate so as to cover the plurality of electronic parts. The circuit module has a rectangular parallelepiped shape, and has a metal film which has a mounting surface, an upper surface and a side surface, and a shielding film on the upper surface and the side surface.

As an example of forming a metal film on the surface of a device, Patent Document 1 discloses a method of attaching a semiconductor device to a holder (support) using an adhesive and then forming a metal film on the semiconductor device by sputtering.

Japanese Patent Application Laid-Open No. 2014-41923

However, as shown in Patent Document 1, it is difficult to form a metal film on the surface of a semiconductor device with high accuracy in a method of attaching a semiconductor device to a holder using an adhesive and performing sputtering. This problem is not limited to the semiconductor device but can also occur when a metal film (shield film) is formed by sputtering after attaching a circuit module to a holder using an adhesive.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and it is an object of the present invention to provide a method of manufacturing a circuit module which forms a shielding metal film on a circuit module with high accuracy.

According to an aspect of the present invention, there is provided a method of manufacturing a circuit module for forming a metal film as a shield on a circuit module having a mounting surface, a top surface, and a side surface, A step of forming a covering material layer for forming a covering material layer on a scene; a step of holding the circuit module in a state in which the covering material layer formed on the circuit module is brought into contact with the adhesive portion of the holder having the adhesive portion, A metal film forming step of forming the metal film on the upper surface and the side surface by performing film formation from the upper surface side of the circuit module; and a separating step of separating the covering material layer from the circuit module.

According to this, the metal film to be shielded in the circuit module can be formed with high accuracy.

The method may further include a step of reducing the adhesion between the circuit module and the covering material between the metal film forming step and the separating step.

By lowering the adhesion, the circuit module and the covering material layer can be easily separated, and the metal film formed on the side surfaces of the circuit module and the side of the covering material layer can be precisely divided. This makes it possible to form a metal film on the circuit module with high accuracy.

The method may further include a step of softening the covering material layer between the metal film forming step and the separating step.

By softening the covering material layer in this way, the circuit module and the covering material layer can be easily separated, and the metal film formed on the sides of the circuit module and on the side of the covering material layer can be precisely divided. This makes it possible to form a metal film on the circuit module with high accuracy.

The method may further include a step of changing the volume of the covering material layer between the metal film forming step and the separation step.

By changing the volume of the covering material layer in this manner, the metal film formed on the side surfaces of the circuit module and the side surface of the covering material layer can be accurately segmented. This makes it possible to form a metal film on the circuit module with high accuracy.

The method may further include a step of removing the circuit module having the covering material layer from the adhesive portion of the holder between the metal film forming step and the separating step.

Thus, the separation process can be easily performed by removing the circuit module having the covering material layer before the separation process. As a result, the metal film can be easily cut by the separation step, and the metal film can be formed with high accuracy.

The adhesive portion is constituted by a double-sided adhesive sheet having a first adhesive portion on one surface and a second adhesive portion on the other surface, the double-sided adhesive sheet is attached to the holder through the second adhesive portion, The covering material layer may be attached to the first adhesive portion exposed to the first adhesive portion.

According to this, the circuit module having the covering material layer can be accurately held, and the metal film can be formed on the circuit module with high accuracy.

The double-sided pressure-sensitive adhesive sheet may be a sheet in which the adhesive force of the first pressure-sensitive adhesive portion is reduced by heating, and the circuit module having the covering material layer may be detached from the first pressure-sensitive adhesive portion by heating the double-

According to this, the circuit module having the covering material layer can be easily held and removed, and damage to the circuit module can be reduced.

The holder may have a planar main surface, and the double-sided pressure-sensitive adhesive sheet may be attached to the holder so as to cover the entire main surface of the holder with a larger area than the main surface of the holder.

According to this, formation of the metal film on the main surface of the holder can be suppressed. Therefore, deterioration of the holder due to use can be suppressed. Further, the double-sided pressure-sensitive adhesive sheet can be easily peeled off from the holder.

In the circuit module, the external terminal is exposed, the ground electrode is exposed on the side surface of the circuit module, and the metal film is not formed on the mounting surface but connected to the ground electrode exposed on the side surface May be formed.

According to this, the shielding effect of the circuit module can be improved.

Further, the coating material layer forming step is a step of forming the covering material layer on a parent substrate (parent substrate) which is an aggregate of a plurality of the circuit modules, and the parent substrate is divided into pieces between the covering material layer forming step and the holding step And forming a plurality of the circuit modules each having the covering material layer thereon.

According to this, the production efficiency of the circuit module can be improved.

The method may further include a step of deforming the covering material layer between the separating step and the holding step.

By thus deforming the covering material layer before the holding step, portions which are likely to be previously divided by the metal film are formed, and the metal film can be accurately divided. This makes it possible to form a metal film on the circuit module with high accuracy.

According to another aspect of the present invention, there is provided a film forming apparatus for forming a metal film to be wound on a circuit module having a mounting surface, a top surface, and a side surface, the film forming apparatus including a chamber, a metal material for film formation formed in the chamber, And a holder for holding the circuit module so that the upper surface of the circuit module is opposed to the film forming metal material portion, wherein a coating material layer is formed on the mounting surface of the circuit module, And the circuit module is held in a state in which the covering material layer is in contact with the adhesive portion.

By using this film forming apparatus, a metal film can be formed on the circuit module with high accuracy.

(Effects of the Invention)

The present invention can form a metal film to be shielded on a circuit module with high accuracy.

1 is a cross-sectional view schematically showing a circuit module manufactured by the manufacturing method according to the first embodiment.
2 is a view showing a method of manufacturing a circuit module in a comparative example.
Fig. 3A is a view showing an example of a problem of a manufacturing method of a circuit module in a comparative example. Fig.
Fig. 3B is a diagram showing another problem of the method of manufacturing the circuit module in the comparative example.
Fig. 3C is a view showing another problem of the method of manufacturing the circuit module in the comparative example.
4 is a flowchart showing a method for manufacturing a circuit module according to the first embodiment.
5A is a view showing a step of forming a covering material layer in the method of manufacturing a circuit module according to the first embodiment.
Fig. 5B is a view showing an individualizing step in the method of manufacturing a circuit module according to the first embodiment. Fig.
Fig. 5C is a view showing a circuit module holding step in the method for manufacturing a circuit module according to the first embodiment. Fig. FIG. 5C is a partially enlarged view of (a). FIG.
5D is a view showing a metal film forming process in the method of manufacturing a circuit module according to the first embodiment.
6 is a diagram schematically showing a film forming apparatus used in the metal film forming step of the first embodiment.
7A is a diagram showing a circuit module holding and releasing step in the method of manufacturing a circuit module according to the first embodiment.
Fig. 7B is a view showing a covering material layer separating step in the method of manufacturing a circuit module according to the first embodiment. Fig. (a) is a preparation step before separation, (b) is a drawing showing a separation step, and (c) is a partial enlarged view of (b).
Fig. 7C is a diagram showing a state in which the circuit module is detached from the first peeling sheet, which is the next step of Fig. 7B. Fig.
8 is a view showing a heat shrinking process performed between a metal film forming process and a covering material layer separating process according to a modification of the first embodiment.
9A is a view showing an example of a deformation process of a covering material layer carried out between a discretization process and a circuit module holding process according to a second embodiment of the present invention.
Fig. 9B is a view showing a circuit module holding step in the method for manufacturing a circuit module according to the second embodiment. Fig.
9C is a view showing a metal film forming step in the method of manufacturing a circuit module according to the second embodiment. FIG. 9C is a partially enlarged view of (a).
Fig. 9D is a view showing a circuit module holding and releasing step in the method of manufacturing a circuit module according to the second embodiment. Fig.
FIG. 9E is a view showing a covering material layer separating step in the method of manufacturing a circuit module according to the second embodiment. FIG.
10A is a view showing a step of deforming the covering material layer according to the first modification of the second embodiment.
10B is a view showing a deformation process of the covering material layer according to the second modification of the second embodiment.
10C is a view showing a deformation process of the covering material layer according to the third modification of the second embodiment.
11 is a cross-sectional view schematically showing another form of a circuit module.

(Embodiment 1)

[1-1. Configuration of Circuit Module]

First, the configuration of the circuit module 10 manufactured by the manufacturing method according to the first embodiment will be described. 1 is a cross-sectional view schematically showing a circuit module 10.

The circuit module 10 is, for example, a high frequency module embedded in a mobile communication terminal. The circuit module 10 includes a substrate 11, a plurality of electronic components 12 mounted on the main surface 11m of the substrate 11, and a plurality of electronic components 12 mounted on the main surface And a sealing portion 17 formed on the base portion 11m. The circuit module 10 has, for example, a rectangular parallelepiped shape and has a mounting surface 10a, an upper surface 10b, and a side surface 10c. The metal film 18 is not formed on the mounting surface 10a of the circuit module 10 and the metal film 18 to be shielded on the upper surface 10b and the side surface 10c is formed.

The mounting surface 10a of the circuit module 10 is a surface facing the main surface of the printed wiring board when the circuit module 10 is mounted on the main surface of the printed wiring board through solder or the like.

As the substrate 11 of the circuit module 10, a ceramic substrate, a glass epoxy substrate, or the like is used. The substrate 11 is a multilayer substrate formed of a plurality of base layers, and the thickness thereof is, for example, 1 mm. A conductor pattern 14 connected to each of the plurality of electronic components 12 is formed in the main surface 11m or inside of the substrate 11. [ As the material of the conductor pattern 14, for example, Cu or the like is used. Examples of the plurality of electronic components 12 include elastic wave elements, IC elements, chip-shaped capacitors, chip-shaped inductors, and the like. The sealing portion 17 includes a thermosetting resin material such as an epoxy resin, and a filler dispersed in the resin material. The thickness of the sealing portion 17 is, for example, 1 mm. The metal film 18 is a shield film formed by sputtering or the like, and its thickness is, for example, 0.01 mm. As the material of the metal film 18, for example, Cu, Ag, Ni or the like is used. The metal film 18 may be formed by laminating a plurality of kinds of metal films.

External terminals 13a and 13b are provided on the mounting surface 10a of the circuit module 10. [ The external terminals 13a and 13b are solder bumps or conductive resin, and their thickness (height dimension) is, for example, 0.1 mm. One of the external terminals 13a is connected to the conductor pattern 14 of the main surface 11m of the substrate 11 via the via conductor 16. And the other external terminal 13b is connected to the ground electrode 15 via the via conductor 16. The ground electrode 15 is exposed on the side surface 10c of the circuit module 10 and connected to the metal film 18. [ The grounding of the metal film 18 through the ground electrode 15 makes it possible to suppress electromagnetic wave interference between the circuit module 10 and external equipment. The external terminals 13a and 13b may be electrodes such as an LGA (Land Grid Array).

[1-2. Problems of Manufacturing Method of Circuit Module in Comparative Example]

Next, the problems of the method of manufacturing the circuit module in the comparative example will be described. Fig. 2 is a view showing a manufacturing method of the circuit module 110 in the comparative example.

The circuit module 110 in the comparative example includes a substrate 111, a plurality of electronic components 112, and a sealing portion 117. In addition, the circuit module 110 has a mounting surface 110a, an upper surface 110b, and a side surface 110c.

In the manufacturing method in the comparative example, the circuit module 110 is held using the holder 121 coated with the adhesive 122 as shown in Fig. 2 (a). More specifically, the mounting surface 110a of the circuit module 110 is brought into contact with the adhesive 122 applied to the surface of the holder 121, and the circuit module 110 is attached.

Then, a metal film 118 is formed on the upper surface 110b and the side surface 110c of the circuit module 110 as shown in FIG. 2 (b). The metal film 118 is formed by sputtering or the like. The metal film 118 is also formed on the adhesive 122 other than the area where the circuit module 110 is disposed when the metal film 118 is formed.

Then, the circuit module 110 is removed from the adhesive 122 of the holder 121 as shown in Fig. 2 (c). The circuit module 110 having the metal film 118 to be shielded is formed on the upper surface 110b and the side surface 110c by these processes.

However, in the manufacturing method of the circuit module 110 according to the comparative example as described above, the following problems may occur.

3A, when the lateral direction force is applied to the circuit module 110 when the circuit module 110 is removed from the holder 121, the side surface 110c of the circuit module 110, The metal film 118 may be further divided from the outside. As a result, the metal film 118 of the circuit module 110 may have a burr 118a formed therein, which may result in defective appearance.

When fixing the circuit module 110 to the holder 121, the posture of the circuit module 110 may be inclined as shown in Fig. 3B, and the end of the mounting surface 110a may be held in a floating state. If the film formation is performed in this state, the metal film 118 may be formed at the end of the mounting surface 110a to contact the signal external terminal of the circuit module 110, resulting in a short failure.

When the circuit module 110 is strongly pressed against the adhesive 122 when the circuit module 110 is fixed to the holder 121, a part of the adhesive 122 is adhered to the side surface 110c of the circuit module 110 And the like. If the film formation is performed in this state, the metal film 118 is not formed on the side surface 110c of the region where the adhesive 122 is adhered, and the shielding effect may be reduced.

In this way, in the method of forming the metal film 118 according to the comparative example, the metal film 118 may be formed with the burr 118a, the metal film 118 may be formed on the mounting surface 110a, It is difficult to form the metal film 118 on the circuit module 110 with high precision because the film 118 is not formed.

The method of manufacturing a circuit module of the present invention includes the following steps, so that a metal film (shield film) can be formed on a circuit module with high accuracy.

[1-3. Method of manufacturing circuit module]

Hereinafter, a method of manufacturing a circuit module according to an embodiment of the present invention will be described in detail with reference to the drawings. In addition, all of the embodiments described below represent one preferred embodiment of the present invention. The numerical values, shapes, materials, constituent elements, arrangement positions and connection forms of the constituent elements, steps, and steps shown in the following embodiments are merely examples and do not limit the present invention. In addition, among the constituent elements in the following embodiments, constituent elements which are not described in the independent claims that represent the highest concept of the present invention are described as arbitrary constituent elements constituting a more preferable form.

Fig. 4 is a flowchart showing a method of manufacturing the circuit module 10. Fig.

The method of manufacturing the circuit module 10 according to the first embodiment includes a covering material layer forming step S11 for forming a covering material layer 25 on the circuit module 10, a discretization step S12, a holding step S13, A metal film forming step (S14) for forming a metal film (18) on the circuit module (10), a holding releasing step (S15), and a separating step (S16) for separating the covering material layer (25).

Figs. 5A to 5D, Figs. 6 and 7A to 7C are diagrams showing respective steps and the like in the method of manufacturing the circuit module 10. Fig. In some drawings, the description of the conductor pattern 14, the ground electrode 15, the via conductor 16, and the external terminals 13a and 13b of the circuit module 10 is omitted.

First, as shown in Fig. 5A, a cover material layer 25 is formed on a mounting surface 10a of a plurality of circuit modules 10 (S11).

In the step S11, the plurality of circuit modules 10 are in a state before being separated, that is, a parent substrate MB which is an aggregate of the plurality of circuit modules 10. [

The covering material layer 25 is a flexible resin and its thickness is thicker than the thickness of the external terminals 13a and 13b and thinner than the thickness of the circuit module (the total thickness of the substrate 11 and the sealing portion 17). As the covering material layer 25, for example, a gel resin may be used. Alternatively, a thermoplastic resin softened by heat treatment or the like or a resin sheet (for example, a thermosensitive pressure-sensitive adhesive sheet manufactured by NITTA Corporation) whose adhesiveness is lowered by heat treatment or the like may be used as the covering material layer 25 . Alternatively, a sheet whose adhesion is lowered by irradiating ultraviolet rays may be used.

Further, it is preferable that the covering material layer 25 is formed of a material having a high thermal conductivity to improve heat dissipation property of the heat received when forming the metal film. A metal filler may be mixed into the material for forming the covering material layer 25 in order to increase the thermal conductivity.

Subsequently, as shown in Fig. 5B, the parent substrate MB is cut into dicing blades 31 and separated. Thereby, a plurality of circuit modules 10 having the covering material layer 25 are formed (S12).

When cutting, the upper surface 10b of the circuit module 10 (the surface opposite to the coating material layer forming surface of the parent substrate MB) is cut at the top with the dicer tape attached. The dicing is not limited to this, and the substrate MB may be cut by laser irradiation or the like. A plurality of cutting methods may be used in combination. In the case of laser irradiation, the planar shape of the circuit module 10 is not limited to a square or rectangular shape but may be a left-right asymmetric figure including a curved line.

Next, as shown in FIG. 5C, each of the plurality of circuit modules 10 having the covering material layer 25 is held using the holder 21 (S13).

The holder 21 is a metal plate such as a stainless steel plate having a planar main surface 21a. The holder 21 is provided with an adhesive portion 22 for attaching and holding the individual circuit module 10.

Each of the circuit modules 10 is held in the holder 21 in a state in which the covering layer 25 is in contact with the adhesive 22 and the upper surface 10b and the side surface 10c are exposed. Each of the circuit modules 10 is disposed spaced apart from the thickness dimension of the circuit module 10 such that a metal film 18 having a sufficient thickness is formed on the side surface 10c in the metal film forming step S14 .

The adhesive portion 22 is specifically a double-faced adhesive sheet attached to the main surface 21a of the holder 21. [ The adhesive portion 22 (double-sided adhesive sheet 22) includes a base sheet, a first adhesive portion 22a formed on one side of the base sheet, and a second adhesive portion 22b formed on the other side of the base sheet ). The adhesive portion (double-sided adhesive sheet) 22 is attached to the holder 21 through the second adhesive portion 22b. The first adhesive portion 22a of the adhesive portion (double-faced adhesive sheet) 22 is exposed on the surface, and the covering material layer 25 formed on the circuit module 10 is attached. Thereby, the circuit module 10 is fixed to the holder 21 through the adhesive portion 22. Hereinafter, the adhesive portion 22 may be referred to as a double-sided adhesive sheet 22 in some cases.

The double-sided pressure-sensitive adhesive sheet 22 is, for example, a sheet (heat-release sheet: manufactured by NITTO DENKO CORPORATION) whose adhesive force is decreased by heating. The lowering of the adhesive strength of the first adhesive section 22a and the second adhesive section 22b is higher than the temperature of forming the metal film and the lowering of the adhesive force of the first adhesive section 22a is the temperature of the second adhesive section 22b It is lower than the adhesive strength lowering temperature. In addition, the temperature at which the adhesive force of the first adhesive portion 22a is lowered is the temperature at which the circuit module 10 can not be held by the first adhesive portion 22a. The temperature of the second adhesive portion 22b is the temperature at which the second adhesive portion 22b does not adhere to the holder 21.

The double-sided adhesive sheet 22 is attached to the holder 21 so as to cover the entire main surface 21a of the holder 21. Specifically, the area of the double-sided adhesive sheet 22 is larger than the area of the main surface 21a of the holder 21, and the outer peripheral end of the double-sided adhesive sheet 22 is pushed out of the outer peripheral end of the holder 21.

Further, the double-sided pressure-sensitive adhesive sheet 22 is preferably formed of a material having a high thermal conductivity to improve the heat dissipation property of the heat received when forming the metal film. The metal filler may be mixed into the material for forming the double-sided pressure-sensitive adhesive sheet 22 in order to increase the thermal conductivity.

Next, a metal film 18 is formed on the upper surface 10b and the side surface 10c of the circuit module 10 (S14).

Specifically, a metal film 18 is formed on each of the plurality of circuit modules 10 by using a film forming apparatus such as a sputtering apparatus.

6 is a schematic view showing the film forming apparatus 50. Fig. The film forming apparatus 50 includes a chamber 51, a metal material portion 52 for forming a film formed in the chamber 51, and a holder 21 for holding the circuit module 10.

The inside of the chamber 51 is evacuated by a depressurization pump (not shown), and is maintained at a vacuum degree of, for example, about 10 ^-4 Pa. An inert gas such as argon gas is introduced into the chamber 51.

The film-forming metal material portion 52 is a target containing a metal material such as Cu, Ag or Ni. An electrode plate (53) is provided below the metal material for film formation (52). The metal material for film formation 52 is detachably attached to the electrode plate 53.

On the upper part of the chamber 51, a holder 21 holding the circuit module 10 is disposed. On the upper side of the holder 21, a holder attaching portion 54 is provided. The holder 21 is held in the holder attaching portion 54 so that the upper surface 10b of the circuit module 10 is opposed to the metal material portion 52 for film formation. The holder 21 is detachable from the holder attaching portion 54.

A power supply 55 is provided between the holder 21 and the electrode plate 53. The power source 55 is connected so that the electrode plate 53 and the metallic material portion 52 for film formation are cathodes. The holder 21 side is an anode and is grounded.

By applying a high voltage between the holder 21 and the electrode plate 53, ions in the plasma collide with the metal film forming material (target) 52, which becomes the cathode side, and the atoms of the metal forming material 52 are separated . The metal layer 18 is formed by attaching to the upper surface 10b and the side surface 10c of the valence circuit module 10 which is separated by this. The metal film 18 is connected to the ground electrode 15 exposed on the side surface 10c. The metal film 18 is also formed in the adhesive portion 22 other than the region where the circuit module 10 is disposed.

After the metal film forming step S14 is completed, the holding of the circuit module 10 by the holder 21 is released and the circuit module 10 having the covering material layer 25 is removed (S15).

Specifically, the circuit module 10 having the covering material layer 25 is removed from the double-faced pressure-sensitive adhesive sheet 22. In the case of using the double-sided pressure-sensitive adhesive sheet whose adhesive strength is lowered by heating as the adhesive portion 22, the adhesive strength of the first adhesive portion 22a is lowered by performing heat treatment (for example, 100 deg. The circuit module 10 is removed from the double-sided adhesive sheet 22 by this heat treatment. The adhesive strength of the second adhesive portion 22b is lowered and the adhesive sheet 22 is peeled from the holder 21 by performing a heat treatment at a higher temperature (for example, 120 DEG C).

Then, the cover material layer 25 is separated from the circuit module 10. First, as a preparation for separating the covering material layer 25, a first peeling sheet 27 is attached to the upper surface 10b side of the circuit module 10 as shown in Fig. 7B (a), and the covering material layer 25 The second peeling sheet 28 is attached. The first peeling sheet 27 and the second peeling sheet 28 each have an adhesive surface.

As the first peelable sheet 27 which is the bottom side sheet, for example, a heat peelable sheet whose adhesive strength is lowered by heating can be used. A general single-sided adhesive tape can be used for the second peeling sheet 28 as the top side sheet. The adhesive force between the first peeling sheet 27 and the second peeling sheet 28 is such that the adhesive strength between the first peeling sheet 27 and the circuit module 10 is lower than the adhesive force between the second peeling sheet 28 and the covering material layer 28. [ (25). The adhesion between the second peeling sheet 28 and the covering material layer 25 is appropriately selected so as to be greater than the adhesion between the covering material layer 25 and the circuit module 10. [

Subsequently, as shown in Fig. 7B (b), the second peeling sheet 28 is peeled off from the end portion in a state in which the first peeling sheet 27 is fixed. Thereby, the circuit module 10 and the covering material layer 25 are separated (S16).

The metal film 18 formed on the circuit module 10 is in close contact with the side surface 10c and the metal film 18 formed on the covering material layer 25 is in close contact with the side surface of the covering material layer 25 The metal film 18 is divided along the interface between the covering material layer 25 and the circuit module 10 as shown in Fig. 7B (c).

When a thermoplastic resin softened by heat treatment or the like is used as the coating material layer 25 as described above, the coating material layer 25 is formed before the covering material layer separation step (S16) (between the step (S14) and the step (S16) The adhesive force between the circuit module 10 and the covering material layer 25 may be lowered by subjecting the insulating layer 25 to heat treatment. When a resin sheet whose adhesion strength is lowered by heat treatment or ultraviolet ray irradiation is used as the covering material layer 25, the covering material layer (before the covering material layer separation step (S16)) (between the steps S14 and S16) 25 may be subjected to heat treatment or may be irradiated with ultraviolet rays to lower the adhesion between the circuit module 10 and the covering material layer 25. [ By applying these heat treatment or ultraviolet ray irradiation to modify the covering material layer 25, the covering material layer 25 can be easily peeled off.

Next, as shown in FIG. 7C, the first peeling sheet 27, which is the bottom side sheet, is subjected to heat treatment or the like to lower the adhesion to the circuit module 10, and the circuit module 10 is peeled off from the first peeling sheet (27). By these steps, the circuit module 10 having the metal film 18 to be shielded can be manufactured.

[1-4. Effect, etc.]

The method of manufacturing the circuit module 10 according to the present embodiment is a method of forming a shielding metal film 18 on the circuit module 10 having the mounting surface 10a, the top surface 10b and the side surface 10c A covering material layer forming step S11 for forming a covering material layer 25 on the mounting surface 10a of the circuit module 10 and a step for forming a covering material layer 25 on the adhesive portion 22 of the holder 21 having the adhesive portion 22, A holding step S13 for holding the circuit module 10 in a state in which the covering layer 25 formed on the module 10 is contacted and the top face 10b and the side face 10c are exposed; A metal film forming step S14 for forming a metal film 18 on the upper surface 10b and the side surface 10c by performing film formation from the upper surface 10b side of the circuit module 10, (S16).

As a result, the metal film 18 to be shielded can be formed on the circuit module 10 with high accuracy.

For example, in the present embodiment, since the circuit module 10 is attached to the holder 21 via the covering material layer 25, the circuit module 10 is detached from the holder 21, It is possible to remove burrs generated by separating the covering material layer 25 from the circuit module 10 even in the case of forming the additional part. As a result, formation of burrs of the metal film 18 in the circuit module 10 can be suppressed.

In addition, since the circuit module 10 is attached to the holder 21 through the covering material layer 25, lifting of the circuit module 10 and the covering material layer 25 relative to the holder 21 can be suppressed. It is possible to effectively dissipate the heat that is received during the formation of the metal film by suppressing lifting and bringing the cover material layer 25 and the holder 21 (the adhesive portion 22) into close contact with each other. In addition, since the metal film 18 is formed on the bottom surface of the covering material layer 25 even when lifting occurs, formation of the metal film 18 on the mounting surface 10a of the circuit module 10 can be suppressed.

Even when a part of the adhesive portion 22 is raised by pressing the circuit module 10 against the adhesive portion 22, a part of the adhesive portion 22 is attached to the side surface of the covering material layer 25, 10). As a result, the metal film 18 can be formed on the entire surface of the side surface 10c of the circuit module 10.

The covering material layer forming step S11 according to the present embodiment is a step of forming a covering material layer 25 on a parent substrate MB which is an aggregate of a plurality of circuit modules 10 and a covering material layer forming step S11, And an individualizing step (S12) of forming a plurality of circuit modules having the covering material layer (25) by separating the parent substrate (MB) between the holding step (S13) and the holding step (S13).

Thus, the production efficiency of the circuit module 10 can be improved.

The film forming apparatus 50 according to the present embodiment includes a chamber 51, a metallic material portion 52 for forming a film formed in the chamber 51, And a holder 21 for holding the circuit module 10 so as to face the metallic material portion 52 for film formation so that a cover material layer 25 is formed on the mounting surface 10a of the circuit module 10 The holder 21 has an adhesive portion 22 and holds the circuit module 10 in a state in which the cover material layer 25 is in contact with the adhesive portion 22. [

By using the film forming apparatus 50, the metal film 18 can be formed on the circuit module 10 with high accuracy.

[1-5. Modifications]

Next, a manufacturing method of the circuit module 10 according to the modification of the first embodiment will be described.

The method of manufacturing the circuit module 10 according to the modification includes a step of changing the volume of the covering material layer 25 before (step S14) and step (S16) before the covering material layer separation step S16. In the manufacturing method according to the modified example, the metal film 18 formed on the side surface of the covering material layer 25 is removed by changing the volume of the covering material layer 25.

8 is a view showing a heat shrinking process as an example of a process of changing the volume.

First, in this modified example, a material that shrinks by heating is used as a material of the covering material layer 25 in the covering material layer forming step (S11). 8 (a), after the discretization step (S12) to the metal film forming step (S14) and the circuit module holding releasing step (S15), the circuit module 10 having the covering material layer 25 Is loaded on a heater (hot plate) 32 and heated. The direction of the circuit module 10 may be either up or down direction. In this modification, the cover material layer 25 is brought into contact with the heater 32 so that heat is easily transmitted to the cover material layer 25.

The heated covering material layer 25 shrinks in the direction (horizontal direction) along the interface between the circuit module 10 and the covering material layer 25 as shown in Fig. 8 (b). The metal film removing portion 18b on the side of the covering material layer 25 stretched in the shrinking direction has a side wall 10c of the circuit module 10 because the thermal deformation amount of the circuit module 10 itself is smaller than the shrinkage amount of the covering material layer 25. [ ) And the ridgeline of the mount 10a are separated from each other by a predetermined angle and removed from the circuit module 10.

In the above modification, the cover material layer 25 is shrunk, but the present invention is not limited thereto. It is also possible to remove the metal film 18 on the side surface of the cover material layer 25 by expanding the cover material layer 25 .

The method of manufacturing the circuit module 10 according to the modification includes a step of changing the volume of the covering material layer 25 between the metal film forming step S14 and the covering material layer separating step S16. The metal film 18 on the side surfaces of the circuit module 10 and the covering material layer 25 can be divided along the interface between the circuit module 10 and the covering material layer 25, The film 18 can be formed with high precision.

(Embodiment 2)

[2-1. Method of manufacturing circuit module]

The manufacturing method of the circuit module 10 according to the second embodiment is a modification of the method for deforming the covering material layer 25 before the circuit module holding step S13 (between the separating step S12 and the circuit module holding step S13) Process. In the manufacturing method according to the second embodiment, the covering material layer 25 is deformed before the film formation to form a portion which is likely to be divided by the metal film 18 after the film formation.

9A is a diagram showing an example of a deformation process of the covering material layer 25. Fig.

First, in this modified example, a material that shrinks by heating is used as a material of the covering material layer 25 in the covering material layer forming step (S11). 9A, after the covering material layer forming step S11 and the separating step S12 are completed, the circuit module 10 having the covering material layer 25 is heated by a heater (hot plate) 42 ). The heated covering material layer 25 shrinks in the direction (horizontal direction) along the interface between the circuit module 10 and the covering material layer 25 as shown in Fig. 9A (b). As a result, the side surface of the covering material layer 25 is positioned inside the side surface 10c of the circuit module 10, and a step may be generated.

Next, as shown in Fig. 9B, each of the circuit modules 10 having the covering material layer 25 is held by the holder 21 (S13).

Next, as shown in Fig. 9C, a metal film 18 is formed on the upper surface 10b and the side surface 10c of the circuit module 10 (S14). At this time, since the area of the covering material layer 25 close to the side enhancement circuit module 10 is the sound of the circuit module 10, the metal film 18 is formed thinly in this negative area. As a result, the metal film 18 which is likely to be divided in the region of the covering material layer 25 close to the circuit module 10 is formed.

Then, the holding of the circuit module 10 is released as shown in Fig. 9D (S15). Thereby, the circuit module 10 and the covering material layer 25 are separated from the holder 21.

Next, as a preparation for separating the covering material layer 25, a first peeling sheet 27 is attached to the upper surface 10b of the circuit module 10 as shown in Fig. 9 (a) The second peeling sheet 28 is adhered to the second peeling sheet 28. Then, as shown in FIG. 9 (b), the second peeling sheet 28 is peeled off from the end portion while the first peeling sheet 27 is fixed. Thereby, the circuit module 10 and the covering material layer 25 are separated (S16). In this embodiment, the metal film 18 can be precisely segmented and the metal film 18 can be formed with high precision because a portion that is easily divided by the metal film 18 is formed in advance.

Then, the first peeling sheet 27 is subjected to heat treatment or the like to lower the adhesion to the circuit module 10, and the circuit module 10 is detached from the first peeling sheet 27. The circuit module 10 in which the metal film 18 is formed can be manufactured by these processes.

[2-2. Modifications]

Next, a manufacturing method of the circuit module 10 according to Modifications 1, 2 and 3 of the second embodiment will be described. In the manufacturing method according to Modifications 1, 2 and 3, the deformation shape of the covering material layer 25 in the deformation step of the covering material layer 25 in the second embodiment is different.

In Modification Example 1, a coating material layer 25 having a higher heat shrinkage ratio at the upper and lower ends than the central portion in the thickness direction is used. As a result, as shown in Fig. 10A, the cross-sectional shape of the covering material layer 25 after shrinkage deformation becomes a rounded shape at the upper and lower ends.

In the modified example 2, a coating material layer 25 having a higher heat shrinkage rate at the central portion than the upper and lower ends in the thickness direction is used. As a result, as shown in Fig. 10B, the cross-sectional shape of the covering material layer 25 after shrinkage deformation becomes a shape in which the central portion is constricted.

In the modified example 3, the covering material layer 25 has a multilayer structure (a two-layer structure in the modified example 3), and the upper layer 25a has a higher heat shrinkage rate than the lower layer part 25b. As a result, as shown in Fig. 10C, the cross-sectional shape of the covering material layer 25 after shrinkage deformation becomes a shape having step differences.

In these Modification Examples 1, 2 and 3, since the portions easily previously divided by the metal film 18 are formed, the metal film 18 can be precisely divided and the metal film 18 can be formed with high accuracy .

(Other forms)

The method of manufacturing the circuit module 10 according to the present invention has been described above with reference to the first, second, and modified embodiments. However, the present invention is not limited to these first, second, and modified embodiments. It is to be understood that various changes and modifications may be made without departing from the spirit of the present invention as set forth in the appended claims and any variations thereof, Are included within the scope of the present invention.

For example, another form of the circuit module 10A may be the one shown in Fig. The circuit module 10A includes a substrate 11, a plurality of electronic components 12 mounted on the main surfaces 11m and 11n of the substrate 11, and a plurality of electronic components 12, And a sealing portion 17 formed on each of the main surfaces 11m and 11n. The metal film 18 is not formed on the mounting surface 10a of the circuit module 10A (the sealing portion 17 on the side of the main surface 11n), but on the top surface 10b and the side surface 10c, A film 18 is formed.

A conductor pattern 14 connected to each of the plurality of electronic components 12 is formed on the main surfaces 11m and 11n of the substrate 11 or inside thereof. External terminals 13a and 13b are provided on the mounting surface 10a of the circuit module 10A. One of the external terminals 13a is connected to the conductor pattern 14 of the main surfaces 11m and 11n of the substrate 11 via the via conductor 16. And the other external terminal 13b is connected to the ground electrode 15 via the via conductor 16. The ground electrode 15 is exposed on the side surface 10c of the circuit module 10A and is connected to the metal film 18. [ Even in the case of manufacturing such a circuit module 10A, the same effects as those of the embodiment can be obtained by using the above manufacturing method.

In the first embodiment, the circuit module 10 having the double-sided adhesive sheet 22 and the covering material layer 25 is removed from the holder 21 in the circuit module holding and releasing step (S15) The layer 25 and the circuit module 10 are separated, but it is not limited thereto. For example, in the state of Fig. 5D after the formation of the metal film, the double-sided adhesive sheet 22 is removed from the holder 21, and then the covering material layer 25 and the double- 22 may be peeled at the same time to perform the coating material layer separation step (S16). 5D after the metal film is formed, the cover material layer 25 and the circuit module 10 may be separated from each other.

The adhesive portion 22 is not limited to the double-sided adhesive sheet but may be formed by applying an adhesive to the holder 21. Even in the case where the adhesive portion 22 is formed of an adhesive agent, since the covering material layer 25 is formed on the mounting surface 10a of the circuit module 10 in this embodiment, it is possible to suppress the occurrence of the problems in the comparative example . That is, a burr may be formed on the metal film 18 at the time of separation, a metal film 18 may be formed at the mounting surface 10a at the time of metal film formation, or a metal film 18 may be formed at the side surface 10c of the circuit module 10 18 can be prevented from being formed. In this case, as the adhesive, a material whose adhesive force is lowered by heat treatment or ultraviolet ray irradiation may be used.

The film forming apparatus 50 may be a sputtering device such as a bipolar sputtering device, a magnetron sputtering device, a high frequency sputtering device, or a reactive sputtering device, or may be a vapor deposition device having a metal material for vapor deposition.

The method of manufacturing a circuit module of the present invention can be used, for example, in manufacturing a circuit module constituting a communication module of a mobile communication terminal. Further, the film forming apparatus of the present invention can be used as a film forming apparatus for forming a metal film shielded by a circuit module.

10, 10A circuit module 10a room scene
10b Top surface 10c side
11 Substrate 11m, 11n The main surface of the substrate
12 Electronic component 13a, 13b External terminal
14 conductor pattern 15 ground electrode
16 via conductor 17 sealing part
18 metal film (shield film) 18a burr
18b Metal membrane removal 21 holder
21a Main surface of holder 22 Adhesive part (double-faced adhesive sheet)
22a first adhesive portion 22b second adhesive portion
25 Cover material layer 27 First peel sheet
28 second peeling sheet 31 dicing blade
32, 42 Heater 50 Deposition device
51 chamber 52 Metal material part for film formation
53 Electrode plate 54 Holder attaching part
55 Power MB substrate

Claims (12)

A method of manufacturing a circuit module for forming a shielding metal film on a circuit module having a mounting surface, a top surface, and a side surface,
A covering material layer forming step of forming a covering material layer on the mounting surface of the circuit module;
A holding step of holding the circuit module in a state in which the covering material layer formed on the circuit module is brought into contact with the adhesive portion of the holder having the adhesive portion and the upper surface and the side surface are exposed;
A metal film forming step of forming the metal film on the upper surface and the side surface by performing film formation from the upper surface side of the circuit module;
And a separating step of separating the covering material layer from the circuit module,
Wherein the covering material layer forming step is a step of forming the covering material layer on a parent substrate which is an aggregate of a plurality of the circuit modules,
Further comprising an individualizing step of forming a plurality of the circuit modules having the covering material layer by separating the parent substrate between the covering material layer forming step and the holding step. The method according to claim 1,
And a step of lowering the adhesion between the circuit module and the covering material layer between the metal film forming step and the separating step. 3. The method according to claim 1 or 2,
And softening the covering material layer between the metal film forming step and the separating step. 3. The method according to claim 1 or 2,
And changing the volume of the covering material layer between the metal film forming step and the separating step. 3. The method according to claim 1 or 2,
And separating the circuit module having the covering material layer from the adhesive portion of the holder between the metal film forming step and the separating step. 3. The method according to claim 1 or 2,
Wherein the adhesive portion comprises a double-sided adhesive sheet having a first adhesive portion on one side and a second adhesive portion on the other side,
Wherein the double-sided adhesive sheet is attached to the holder through the second adhesive portion,
Wherein the covering layer is attached to the first adhesive portion exposed on the surface. The method according to claim 6,
Wherein the double-sided pressure-sensitive adhesive sheet is a sheet in which the adhesive force of the first pressure-sensitive adhesive portion is lowered by heating,
Wherein the circuit module having the covering material layer is detached from the first adhesive portion by heating the double-faced adhesive sheet. The method according to claim 6,
Wherein the holder has a planar main surface,
Wherein the double-sided pressure-sensitive adhesive sheet is adhered to the holder so as to cover the entire main surface of the holder with an area larger than the major surface of the holder. 3. The method according to claim 1 or 2,
The external terminal is exposed on the mounting surface of the circuit module, the ground electrode is exposed on the side surface of the circuit module,
Wherein the metal film is formed so as not to be formed on the mounting surface but to be connected to the ground electrode exposed on the side surface. delete The method according to claim 1,
And deforming the covering material layer between the separating step and the holding step. delete

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