KR102709497B1 - 반도체 소자 패키지 - Google Patents

반도체 소자 패키지 Download PDF

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Publication number
KR102709497B1
KR102709497B1 KR1020160141323A KR20160141323A KR102709497B1 KR 102709497 B1 KR102709497 B1 KR 102709497B1 KR 1020160141323 A KR1020160141323 A KR 1020160141323A KR 20160141323 A KR20160141323 A KR 20160141323A KR 102709497 B1 KR102709497 B1 KR 102709497B1
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South Korea
Prior art keywords
light
substrate
emitting element
semiconductor device
device package
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KR1020160141323A
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English (en)
Korean (ko)
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KR20180046274A (ko
Inventor
공성민
Original Assignee
쑤저우 레킨 세미컨덕터 컴퍼니 리미티드
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Priority to KR1020160141323A priority Critical patent/KR102709497B1/ko
Priority to US16/345,186 priority patent/US10686108B2/en
Priority to EP17864168.4A priority patent/EP3534413B1/fr
Priority to CN201780066917.3A priority patent/CN109923684A/zh
Priority to PCT/KR2017/011979 priority patent/WO2018080224A1/fr
Publication of KR20180046274A publication Critical patent/KR20180046274A/ko
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Publication of KR102709497B1 publication Critical patent/KR102709497B1/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H01L33/48—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H01L33/10—
    • H01L33/50—
    • H01L33/58—
    • H01L33/62—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/814—Bodies having reflecting means, e.g. semiconductor Bragg reflectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H01L2924/12041—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/832—Electrodes characterised by their material
    • H10H20/835—Reflective materials

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  • Led Device Packages (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
KR1020160141323A 2016-10-27 2016-10-27 반도체 소자 패키지 Active KR102709497B1 (ko)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020160141323A KR102709497B1 (ko) 2016-10-27 2016-10-27 반도체 소자 패키지
US16/345,186 US10686108B2 (en) 2016-10-27 2017-10-27 Semiconductor device package
EP17864168.4A EP3534413B1 (fr) 2016-10-27 2017-10-27 Boîtier de dispositif à semi-conducteur
CN201780066917.3A CN109923684A (zh) 2016-10-27 2017-10-27 半导体器件封装
PCT/KR2017/011979 WO2018080224A1 (fr) 2016-10-27 2017-10-27 Boîtier de dispositif à semi-conducteur

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020160141323A KR102709497B1 (ko) 2016-10-27 2016-10-27 반도체 소자 패키지

Publications (2)

Publication Number Publication Date
KR20180046274A KR20180046274A (ko) 2018-05-08
KR102709497B1 true KR102709497B1 (ko) 2024-09-26

Family

ID=62025195

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160141323A Active KR102709497B1 (ko) 2016-10-27 2016-10-27 반도체 소자 패키지

Country Status (5)

Country Link
US (1) US10686108B2 (fr)
EP (1) EP3534413B1 (fr)
KR (1) KR102709497B1 (fr)
CN (1) CN109923684A (fr)
WO (1) WO2018080224A1 (fr)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
HUE025477T2 (en) 2008-04-30 2016-02-29 Xyleco Inc Biomass processing
US7867358B2 (en) 2008-04-30 2011-01-11 Xyleco, Inc. Paper products and methods and systems for manufacturing such products
US8236535B2 (en) 2008-04-30 2012-08-07 Xyleco, Inc. Processing biomass
US8212087B2 (en) 2008-04-30 2012-07-03 Xyleco, Inc. Processing biomass
US9266053B2 (en) 2012-06-18 2016-02-23 Invacare Corporation System and method for concentrating gas
US9061238B2 (en) 2013-03-15 2015-06-23 Invacare Corporation Gas concentrator
KR102408974B1 (ko) 2017-11-23 2022-06-15 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법
JP7054005B2 (ja) * 2018-09-28 2022-04-13 日亜化学工業株式会社 発光装置
CN109585633A (zh) * 2018-10-12 2019-04-05 华中科技大学鄂州工业技术研究院 一种led封装结构及led器件
KR102827371B1 (ko) * 2019-10-01 2025-07-01 엘지전자 주식회사 마이크로 led를 이용한 디스플레이 장치 및 이의 제조 방법
US11950438B2 (en) * 2019-12-17 2024-04-02 Lg Display Co., Ltd. Inorganic light emitting diode and inorganic light emitting device including the same
DE102021124691A1 (de) * 2021-09-23 2023-03-23 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur herstellung von optischen elementen, verfahren zur herstellung von strahlungsemittierenden halbleiterbauteilen, optisches element und strahlungsemittierendes halbleiterbauteil
CN114122241B (zh) * 2022-01-28 2022-05-13 江西鸿利光电有限公司 发光器件及其制备方法
US20240120452A1 (en) * 2022-10-11 2024-04-11 Creeled, Inc. Reflectors for support structures in light-emitting diode packages
US20240363815A1 (en) * 2023-04-25 2024-10-31 Seoul Semiconductor Co., Ltd. Light emitting device

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030075724A1 (en) * 2001-10-19 2003-04-24 Bily Wang Wing-shaped surface mount package for light emitting diodes
US20050189626A1 (en) * 2004-01-29 2005-09-01 Tan Xiaochun Semiconductor device support structures
WO2006016398A1 (fr) * 2004-08-10 2006-02-16 Renesas Technology Corp. Dispositif électroluminescent et procédé pour fabriquer celui-ci
DE112006000694B4 (de) 2005-03-24 2013-10-17 Kyocera Corp. Gehäuse für Lichtemissionsvorrichtung, lichtemittierende Vorrichtung und Beleuchtungsvorrichtung
US20070290220A1 (en) * 2006-06-20 2007-12-20 Bily Wang Package for a light emitting diode and a process for fabricating the same
KR20080060114A (ko) 2006-12-26 2008-07-01 엘지이노텍 주식회사 발광 다이오드 패키지 및 그 제조방법, 면 발광 장치
KR101406787B1 (ko) 2008-06-24 2014-06-12 삼성전자주식회사 Ｌｅｄ 패키지
EP3547380B1 (fr) * 2010-02-09 2023-12-20 Nichia Corporation Dispositif électroluminescent
JP6038443B2 (ja) 2011-11-21 2016-12-07 スタンレー電気株式会社 半導体発光装置および半導体発光装置の製造方法
KR101973613B1 (ko) * 2012-09-13 2019-04-29 엘지이노텍 주식회사 발광 소자 및 이를 구비한 조명 시스템
KR20140102563A (ko) * 2013-02-14 2014-08-22 삼성전자주식회사 발광 소자 패키지
JP6484396B2 (ja) 2013-06-28 2019-03-13 日亜化学工業株式会社 発光装置用パッケージ及びそれを用いた発光装置
WO2015068072A1 (fr) * 2013-11-07 2015-05-14 Koninklijke Philips N.V. Substrat pour del avec couche de réflexion interne totale entourant la del
KR102122361B1 (ko) * 2013-12-27 2020-06-15 삼성전자주식회사 플립칩 엘이디 패키지 기판 및 플립칩 엘이디 패키지 구조

Also Published As

Publication number Publication date
KR20180046274A (ko) 2018-05-08
US10686108B2 (en) 2020-06-16
CN109923684A (zh) 2019-06-21
US20190288168A1 (en) 2019-09-19
EP3534413A4 (fr) 2020-06-24
EP3534413B1 (fr) 2023-12-13
WO2018080224A1 (fr) 2018-05-03
EP3534413A1 (fr) 2019-09-04

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