KR102711232B1 - Carrier film and method of using same - Google Patents

Abstract

The present invention relates to a carrier film, and more specifically, to a carrier film and a method of using the same, which can improve the handleability of a product during a process and minimize product defects when peeled.

Description

{Carrier film and method of using same}

The present invention relates to a carrier film, and more specifically, to a carrier film and a method of using the same, which can improve the handleability of a product during a process and minimize product defects when peeled.

In general, in the manufacturing process of display devices (e.g. OLED, deco film, POL, LCD, etc.), a carrier film that is laminated to a substrate is used.

In the manufacturing process of a display device, various manufacturing processes are inevitably carried out. For example, when switching from a specific process A to process B, the process is switched while a carrier film, i.e., a transfer protective film, is attached to the surface of the already worked substrate (or product) to protect it and prevent the substrate (or product) from curling.

That is, the carrier film used as a protective film for transporting materials (or products) is required to have the characteristic that there should be no foreign substances such as residual resin on the product after the protective film is removed after the process is completed. In addition, the characteristic that the carrier film should be easily peeled off when separating it after the process is completed is also required.

However, conventionally, when pulling a carrier film (or protective film) to separate the carrier film (or protective film) from a substrate (module or panel, decoration layer), the force applied to the carrier film (or protective film) is also applied to the substrate (module or panel, decoration layer), so that the carrier film (or protective film) and the substrate (module or panel, decoration layer) are pulled together. This has caused problems such as curling of the product, resin residue and bubbles at the edge, and defects in the substrate (module, panel, or decoration layer).

Republic of Korea Patent No. 10-1588600

The present invention is intended to solve the above problems, and to provide a carrier film and a method of using the same, which can improve the handleability of a product during a process and minimize product defects even when peeled.

The above and other objects and advantages of the present invention will become apparent from the following description of preferred embodiments.

The above purpose is, a joint part where the product is joined; a frame part surrounding the joint part; and

A peripheral portion surrounding the above-described rim portion; Including a first adhesive layer formed on a surface to be laminated with the product, the peripheral portion including a second adhesive layer formed on the surface, the first adhesive layer and the second adhesive layer becoming a bottom surface, and the height of the peripheral portion is formed higher than the heights of the laminate portion and the rim portion, so that the peripheral portion forms a three-dimensional groove forming a peripheral portion wall structure surrounding the bottom surface, which can be achieved by a carrier film.

The first adhesive layer and the second adhesive layer are formed to have the same thickness, and the adhesive force of the second adhesive layer is formed to be greater than the adhesive force of the first adhesive layer.

When the product is inserted into the inside of the home, the height of the inserted product is formed higher than the height of the peripheral wall to form a first step, and a first gap is formed between the product and the peripheral wall as long as the length of the edge portion.

The above purpose is a step of preparing a carrier film; a step of inserting a product into the interior of a three-dimensional groove of the carrier film while allowing the product to be laminated to the joint;

A step of forming a resin layer by performing a process of applying resin on the entire surface of the above product;

The method can be achieved by a carrier film usage method, including the steps of: attaching a release film on the front surface of the resin layer; removing the laminated carrier film; removing the attached release film; and separating the product in the form of a resin layer formed on the front surface.

In the step of inserting the above product, the height of the inserted product is formed higher than the height of the peripheral wall to form a first step, and a first gap is formed between the product and the peripheral wall as long as the length of the edge.

In the step of forming the resin layer, residual resin exists on the side of the product, and the residual resin penetrates into the space between the product and the wall structure of the peripheral portion and is applied on the surface of the second adhesive layer of the edge portion.

In the step of removing the above-mentioned laminated carrier film, the first adhesive layer is peeled off while being separated from the lower surface of the product, and the second adhesive layer is bonded to the remaining resin and peeled off together with the remaining resin.

In the step of removing the attached release film, the release film is characterized in that it is separated from the resin layer formed on the front surface of the product and is peeled off.

According to the present invention, by manufacturing a carrier film having structural characteristics including a three-dimensional groove into which a product can be inserted, the handleability of the product during a process can be improved, the removal rate of residues during peeling can be increased, and defects of the desired product can be minimized.

The above carrier film can be used, for example, in a screen printing process, a pattern molding process, etc.

However, the effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description below.

Figure 1 is a plan view of a carrier film according to one embodiment of the present invention.
FIG. 2 is a side view of a carrier film according to one embodiment of the present invention.
FIG. 3 is a side view schematically showing a method of using a carrier film according to one embodiment of the present invention.
Figure 4 is a side view schematically showing a method of using a conventional carrier film.

Hereinafter, the present invention will be described in detail with reference to examples and drawings of the present invention. It will be apparent to those skilled in the art that these examples are presented only as examples to more specifically explain the present invention, and that the scope of the present invention is not limited by these examples.

Additionally, unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs, and in case of conflict, the description in this specification, including definitions, shall prevail.

In order to clearly explain the invention proposed in the drawings, parts that are not related to the description have been omitted, and similar parts have been given similar drawing reference numerals throughout the specification. In addition, when a part is said to "include" a certain component, this does not mean that other components are excluded, but rather that other components can be further included, unless otherwise specifically stated. In addition, a "part" described in the specification means a single unit or block that performs a specific function.

The identification codes (1st, 2nd, etc.) for each step are used for convenience of explanation and do not describe the order of each step. Each step may be performed in a different order than stated unless the context clearly indicates a specific order. That is, each step may be performed in the same order as stated, may be performed substantially simultaneously, or may be performed in the opposite order.

One aspect of the present invention provides a carrier film including a bonding portion on which a product is bonded; a border portion surrounding the bonding portion; and a peripheral portion surrounding the border portion, wherein the bonding portion includes a first adhesive layer formed on a surface bonded to the product, the border portion includes a second adhesive layer formed on the surface, and the first adhesive layer and the second adhesive layer form a bottom surface, and the height of the border portion is formed higher than the heights of the bonding portion and the border portion, so that the peripheral portion forms a three-dimensional groove forming a peripheral portion wall structure surrounding the bottom surface.

Hereinafter, implementation examples and embodiments of the present invention will be described in detail with reference to the attached drawings. However, the present invention may not be limited to these implementation examples and embodiments and drawings.

FIG. 1 is a plan view of a carrier film according to one embodiment of the present invention, and FIG. 2 is a side view of the carrier film.

Referring to FIGS. 1 and 2, the carrier film may have a structure including a joining portion (100) on which a product (10) is joined; a border portion (200) surrounding the joining portion (100); and a peripheral portion (300) surrounding the border portion (200).

The above product (10) may include any structure that has been processed or is in the process of being processed, and may be of any type as long as it requires movement or protection by a carrier film.

For example, the product (10) may be a flexible film or a substrate having a certain thickness and volume or a layered structure in which these are laminated. However, it is not limited thereto, and any material or shape that can be handled using the carrier film may be used.

The material of the above carrier film is not particularly limited, and may be composed of materials according to known techniques commonly used in the relevant field.

The carrier film may be made of various materials, such as PET, PMMA, PC, PCPMMA, SUS or Metal.

The carrier film according to one embodiment of the present invention is characterized by having a specific structural shape.

The carrier film may be formed of a three-dimensional groove into which the product (10) can be inserted, rather than being formed of a single-layer substrate like a conventional carrier film. In addition, an adhesive layer may be further provided on the inner bottom surface of the groove. That is, the carrier film may be formed of a groove having a bottom surface in which two layers are laminated and partitions surrounding the bottom surface.

In other words, the carrier film can be formed in a box shape without a roof, that is, a shape in which the four sides are formed in the shape of walls and an empty space inside, that is, a groove, exists, so that the product (10) can be inserted into the groove.

To explain more specifically, first, the product (10) may be provided with the joining part (100), which is a part that is inserted into the groove space of the carrier film and joined to the bottom surface. The joining part (100) may be in the form of a surface having a certain area, but is not limited thereto, and the shape of the joining part (100) may be modified in any way depending on the type, shape, purpose of use, etc. of the product to be joined.

The above-mentioned joint part (100) may be surrounded by a border part (200) that means a part spaced apart from each corner of the joint part (100) at a certain interval. That is, the border part (200) is in the form of a line extending from each corner of the joint part (100) and may be configured in a shape that surrounds all corners of the joint part (100).

At this time, it is preferable that the thickness of the border portion (200) be formed to be 1 to 5% of the surface length of the joint portion (100).

Since the above-mentioned border portion (200) is a portion extending from each corner of the above-mentioned joining portion (100), the above-mentioned border portion (200) and the above-mentioned joining portion (100) may be formed as layers having a certain area in the length direction when viewed from above, and when viewed from the side, the thicknesses of the above-mentioned border portion (200) and the above-mentioned joining portion (100) in the height direction may be formed to be the same.

Meanwhile, the peripheral portion (300) surrounding the frame portion (200) and having a certain area in the length direction may also have a certain thickness in the height direction.

At this time, the height of the peripheral part (300) is formed higher than the height of the joint part (100) and the frame part (200), so that the peripheral part (300) can form a wall structure surrounding the four sides to form a three-dimensional groove. In other words, the peripheral part (300) can be in a form in which the peripheral walls (310) surround the frame part (200) on all sides.

The above-mentioned bonding portion (100) may have a first adhesive layer (a) formed on the surface to be bonded with the product (10), and a second adhesive layer (b) formed on the surface of the edge portion (200). That is, the product (10) may be bonded with the first adhesive layer (a) of the bonding portion (100). At this time, the product (10) is not positioned on the second adhesive layer (b) of the edge portion (200).

The purpose of the second adhesive layer (b) of the above-mentioned border portion (200) will be described again later.

The first adhesive layer (a) and the second adhesive layer (b) have a layered structure having a constant thickness in the height direction, and it is preferable that the thickness in the height direction be formed the same.

The adhesive strength of the second adhesive layer (b) may be formed to be greater than the adhesive strength of the first adhesive layer (a). The first adhesive layer (a) requires a release force later, and the second adhesive layer (b) is intended to strongly adhere the residue on the outer surface of the product later so that they can be removed together.

The first adhesive layer (a) may include a silicone-based adhesive. Specifically, the first adhesive layer (a) may be an adhesive layer including a silicone-based adhesive and an anti-fingerprint coating solution (AF Coating solution), for example, a fluorine-based material. The adhesive strength of the first adhesive layer (a) may be formed to be, for example, less than 5 Kgf/cm2.

The second adhesive layer (b) may be an adhesive layer containing a silicone-based adhesive. The adhesive strength of the second adhesive layer (b) may be formed to be higher than the adhesive strength of the first adhesive layer (a).

The adhesive strength of the second adhesive layer (b) may be formed to be, for example, 5 kgf/cm2 or more, specifically, 5 to 20 kgf/cm2 or less.

Meanwhile, when the product (10) is inserted into the groove space of the carrier film, the height of the inserted product (10) may be formed higher than the height of the peripheral wall (310) to form a first step (d). In addition, the product (10) and the peripheral wall (310) may be manufactured to have a first gap (c) formed as a lengthwise distance of the edge portion (200).

That is, the size of the first gap (c) is formed to be the same as the thickness of the border portion (200), and specifically, can be formed to be 1% to 5% of the surface length of the joining portion (100).

The above first step (d) can be formed at 10 to 30% of the height of the product (10).

If the first gap (c) and the first step (d) are designed within the above-mentioned range, the product defect rate can be significantly reduced when the carrier film is removed later. This will be described in more detail later in the carrier film usage method described with reference to FIG. 3 below.

Hereinafter, a method of using a carrier film according to one embodiment of the present invention will be described in more detail with reference to FIG. 3.

FIG. 3 is a side view schematically showing a method of using a carrier film according to one embodiment of the present invention, and FIG. 4 is a side view schematically showing a method of using a conventional carrier film.

Referring to Fig. 3, first, a carrier film can be prepared. Since the specific structure of the carrier film follows the above-described content, redundant description can be omitted, and from now on, the description will focus on the content for explaining the method of using the carrier film.

The product (10) can be inserted into the three-dimensional groove of the carrier film while being joined to the joint portion (100). At this time, the product (10) may be a structure whose process has been completed, or an intermediate structure on which the next process is to be performed.

In one embodiment of the present invention, the following process is described as an intermediate structure to be performed, but is not limited thereto.

For example, the product (10) may be a structure prior to performing a process of forming a resin layer by applying a resin composition on a surface.

When the above product (10) is inserted into the groove of the carrier film, the height of the inserted product (10) is formed higher than the height of the peripheral wall (310) to form a first step (d), and a first gap (c) formed as a gap in the length direction of the edge portion (200) can be formed between the product (10) and the peripheral wall (310).

Next, a process of applying resin on the front surface of the product (10) may be performed to form a resin layer (20). In other words, after the product (10) is inserted into the groove of the carrier film and is fixed, a process of applying resin on the front surface of the product (10) may be performed.

There is no particular limitation on the type of the above resin, and it can be widely applied from thermosetting resin to photocuring resin. For example, the above resin can include, but is not limited to, silicone-based, urethane-based, acrylic-epoxy-based, and butadiene-based resins.

When the above resin is applied, the resin flows to the side of the product (10), so that residual resin (21) inevitably exists on the side. At this time, according to the carrier film according to one embodiment of the present invention, the residual resin (21) is placed by penetrating into the space between the product (10) and the peripheral wall (310), so that the residual resin (21) has a shape in which the space is confined. Accordingly, the residual resin (21) has a form applied on the second adhesive layer (b) of the edge portion (200).

That is, the product (10) can be attached to the surface of the first adhesive layer (a) of the joint portion (100), and the residual resin (21) can be applied to the surface of the second adhesive layer (b) of the edge portion (200).

At this time, if the first gap (c) is greater than 5% of the surface length of the bonding portion (100), the consumption of the resin increases, and the modulus influence of the resin increases, so that the possibility of residual resin (21) remaining may increase. If the first gap (c) is less than 1% of the surface length of the bonding portion (100), the contact area between the resin and the second adhesive layer (b) decreases, so that the possibility of residual resin (21) remaining may increase.

In addition, if the first step (d) is greater than 30% of the height of the product (10), the load transmitted to the product (10) increases, causing a problem in that the thickness of the resin at the edge of the product decreases, thereby increasing the deviation in the total thickness of the resin layer, and if the first step (d) is less than 10% of the height of the product (10), the load at the edge of the product decreases, thereby increasing the influence of the surface tension of the resin, thereby increasing the cohesive force of the resin too much, thereby lowering the quality of the product.

Meanwhile, referring to FIG. 4 together, the conventional carrier film is in the form of a single-layer film (100') without a groove structure. Accordingly, when a product (10') is laminated on the film (100') and a resin process is performed, the resin flows to the side of the product (10') and residual resin (21') is generated. However, since the residual resin (21') is not confined, it flows more to the side.

Referring again to FIG. 3, a release film (400) may be attached to the front surface of the resin layer (20). The release film (400) may be a commonly used release glass, and may be in the form of a release paper (release glass or release film) that protects the surface of the resin layer (20), has adhesiveness, has appropriate surface finish and wettability, and can be removed later.

The above-mentioned release film (400) may be a commonly used release-treated substrate, for example, a plate-shaped release-treated glass or a release-treated PET, PC, PMMA material film. However, it is not limited thereto.

Next, when the handling period of the above product (10) is completed and the product (10) is to be separated, the combined carrier film can be removed first.

At this time, the first adhesive layer (a) is separated from the product (10) and peeled off, and the second adhesive layer (b) is strongly adhered to the residual resin (210) and can be peeled off together with the residual resin (210).

That is, the residual resin (210) is a defective element that occurs during the process and must be removed, so that it can be cleanly peeled off by the strong adhesive force of the second adhesive layer (b), and the first adhesive layer (a) is separated from the lower surface of the product (10) and is cleanly peeled off, so that only the product (10), which is the desired structure, can be separated.

In this way, the respective characteristics of the first adhesive layer (a) and the second adhesive layer (b) of the carrier film can increase the peeling performance and defect rate reduction effect of the carrier film.

Next, the attached release film (400) can be removed. After the carrier film is removed, the lower surface and side surfaces of the product are cleanly separated without any residual resin or other impurities. Afterwards, when the release film (400) is removed, the resin layer (20) that was being protected can be exposed.

That is, if both the above-mentioned heteromorphic film (400) and the carrier film (300) are removed, the desired product according to one embodiment can be neatly separated into a “product with a resin layer formed on the front surface.”

In other words, by using the carrier film according to one embodiment of the present invention, when the product is separated, a product can be obtained in which all residual resin or other impurities are cleanly removed from the lower surface and side surfaces of the product.

On the other hand, referring again to Fig. 4, the conventional carrier film is in the form of a single-layer film, so even if the release film (400') is removed later, residual resin still remains on the side of the product. This significantly increases the probability of product defects, resulting in a decrease in quality.

The best embodiments have been disclosed in the drawings and the specification. Although specific terms have been used herein, they have been used only for the purpose of describing the present invention and have not been used to limit the meaning or the scope of the present invention described in the claims. Therefore, those skilled in the art will understand that various modifications and equivalent other embodiments are possible from this. Therefore, the true technical protection scope of the present invention should be determined by the technical idea of the appended claims.

100, 100': Joint a: First adhesive layer
200: border b: second adhesive layer
300, 300': Perimeter 310: Perimeter wall (wall structure)
C: 1st gap d: 1st step
10, 10' : Product 20, 20' : Resin
21, 21' : Residual resin
400, 400': Heteromorphic film

Claims (8)

delete delete delete delete delete delete A step for preparing a carrier film including a bonding portion on which a product is bonded, a frame portion surrounding the bonding portion, and a peripheral portion surrounding the frame portion, wherein the bonding portion includes a first adhesive layer formed on a surface bonded to the product, and the frame portion includes a second adhesive layer formed on the surface, wherein the first adhesive layer and the second adhesive layer form a bottom surface, and the height of the peripheral portion is formed higher than the height of the bonding portion and the frame portion, so that a three-dimensional groove is formed in the peripheral portion forming a peripheral portion wall structure surrounding the bottom surface;
A step of inserting a product into the interior of a three-dimensional groove of the carrier film while allowing the product to be laminated to the joint portion;
A step of forming a resin layer by performing a process of applying resin on the entire surface of the above product;
A step of attaching a release film on the entire surface of the above resin layer;
Step of removing the laminated carrier film;
Step of removing the attached heteromorphic film; and
A step of separating into a product form in which a resin layer is formed on the front surface;
At the step of inserting the above product,
The height of the inserted product is formed higher than the height of the peripheral wall to form the first step,
A first gap is formed between the above product and the peripheral wall, the gap being the length of the edge portion.
In the step of forming the above resin layer,
There is residual resin on the side of the above product,
The residual resin penetrates into the space between the product and the wall structure of the peripheral portion and is applied on the surface of the second adhesive layer of the edge portion.
In the step of removing the above-mentioned combined carrier film,
The above first adhesive layer is separated from the lower surface of the product and is peeled off,
A method of using a carrier film, characterized in that the second adhesive layer adheres to the residual resin and is peeled off together with the residual resin. In Article 7,
In the step of removing the above attached heteromorphic film,
A method of using a carrier film, characterized in that the above-mentioned release film is separated from the resin layer formed on the front surface of the product and is peeled off.