KR20000076009A - 차폐 하우징의 제조 방법 - Google Patents
차폐 하우징의 제조 방법 Download PDFInfo
- Publication number
- KR20000076009A KR20000076009A KR1019997008095A KR19997008095A KR20000076009A KR 20000076009 A KR20000076009 A KR 20000076009A KR 1019997008095 A KR1019997008095 A KR 1019997008095A KR 19997008095 A KR19997008095 A KR 19997008095A KR 20000076009 A KR20000076009 A KR 20000076009A
- Authority
- KR
- South Korea
- Prior art keywords
- housing
- shielding
- sealing
- application
- channel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 75
- 238000007789 sealing Methods 0.000 claims abstract description 31
- 238000000034 method Methods 0.000 claims abstract description 15
- 230000009471 action Effects 0.000 claims abstract description 9
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- 239000004033 plastic Substances 0.000 claims description 11
- 229920003023 plastic Polymers 0.000 claims description 11
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- 229920001296 polysiloxane Polymers 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000000945 filler Substances 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 2
- 230000001747 exhibiting effect Effects 0.000 claims description 2
- 239000000835 fiber Substances 0.000 claims description 2
- 239000011231 conductive filler Substances 0.000 claims 1
- 230000009974 thixotropic effect Effects 0.000 claims 1
- 239000000203 mixture Substances 0.000 description 9
- 239000004020 conductor Substances 0.000 description 7
- 239000010410 layer Substances 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000013013 elastic material Substances 0.000 description 3
- 230000005670 electromagnetic radiation Effects 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- -1 siloxan Chemical class 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920002430 Fibre-reinforced plastic Polymers 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000011151 fibre-reinforced plastic Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000002991 molded plastic Substances 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0015—Gaskets or seals
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
- Y10T156/1798—Surface bonding means and/or assemblymeans with work feeding or handling means with liquid adhesive or adhesive activator applying means
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Glass Compositions (AREA)
- Cable Accessories (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
- Adornments (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
Claims (10)
- 압력 하에서 도포 바늘 또는 도포 노즐(6; 61 내지 65)을 구비하는 좌표 제어식 도포 장치(5)로부터 나오는 페이스트형 재료를 제1 하우징(1; 1') 상에 직접 도포한 후에 그 곳에서 그에 달라붙은 상태로 지지체를 사용함이 없이 탄성적으로 응고시킴에 의해, 제1 하우징 부분과 그에 인접한 제2 하우징 부분(1, 2; 1')과의 사이의 틈새를 충전시키는 밀봉 및 차폐 외곽부(9; 91 내지 95)를 마련하는 전기 기능 유닛의 기계적 보호 및 전자기 차폐를 위한 차폐 하우징(4)의 제조 방법에 있어서,적어도 제1 및 제2 채널(6a, 6b; 61a, 61b; 62a, 62b; 63a 내지 63c; 64a, 64b; 65a 내지 65c)을 구비하는 도포 바늘 또는 도포 노즐로부터 적어도 우수한 밀봉 작용에 맞춰 조절된 재료 특성을 수반하는 제1 재료(8a) 및 우수한 차폐 작용에 맞춰 조절된 재료 특성을 수반하는 탄성 경화성 제2 재료(8b)를 동시에 도포함에 의해 밀봉 및 차폐 외곽부를 생성하여 제2 재료가 제1 재료에 고정적으로 부착되도록 하는 것을 특징으로 차폐 하우징의 제조 방법.
- 제1항에 있어서, 제2 하우징 부분(2)을 제1 및/또는 제2 재료(8a, 8b)가 실질적으로 완전히 경화된 후에 밀봉 및 차폐 외곽부(9; 91 내지 95)에 접촉시키는 것을 특징으로 차폐 하우징의 제조 방법.
- 제1항 또는 제2항에 있어서, 제1 재료(8a)로서 실온의 공기 중에서 경화되고 특히 요변성의 특성을 보이는 실질적인 비전도성의 플라스틱 재료, 특히 실리콘계 플라스틱 재료를 사용하고, 제2 재료(8b)로서 전기 전도성 함유물에 의해 전도성을 나타내는 제1 재료와의 동종의 플라스틱 재료를 사용하는 것을 특징으로 차폐 하우징의 제조 방법.
- 제3항에 있어서, 전기 전도성 함유물로서 전기 전도성이 높은 금속 또는 합금, 특히 은 또는 은 함유 합금으로 이루어진 입자, 특히 섬유 또는 소형의 판상체를 사용하는 것을 특징으로 차폐 하우징의 제조 방법.
- 제3항에 있어서, 제1 재료(8a)는 비전도성 충전재, 특히 산화물 충전재 또는 세라믹 충전재를 함유하는 것을 특징으로 차폐 하우징의 제조 방법.
- 선행항들 중의 어느 하나의 항에 있어서, 제1 및/또는 제2 재료(8a, 8b)의 도포 시에 특히 그 재료에 혼합되는 점착 매개체를 사용하는 것을 특징으로 차폐 하우징의 제조 방법.
- 선행항들 중의 어느 하나의 항에 있어서, 제1 채널(6a; 61a; 62a; 63a; 64a; 65a)이 적어도 그 둘레의 일부에 걸쳐 제2 채널(6b; 61b; 62; 63b, 63c; 64b; 65b, 65c)에 의해 둘러싸이는 도포 바늘 또는 도포 노즐(6; 61 내지 65)을 밀봉 및 차폐 외곽부(9; 91 내지 95)의 도포에 사용하는 것을 특징으로 차폐 하우징의 제조 방법.
- 제7항에 있어서, 제1 채널(6a; 61a; 62a; 63a; 64a)이 실질적으로 원형의 횡단면으로 형성되고 동심 상으로 적어도 부분적으로 대략 원형 링 절편형 횡단면의 제2 채널(6b; 61b; 62b; 63b, 63c; 64b)에 의해 둘러싸이는 도포 바늘 또는 도포 노즐(6; 61 내지 64)을 밀봉 및 차폐 외곽부의 도포에 사용하는 것을 특징으로 차폐 하우징의 제조 방법.
- 선행항들 중의 어느 하나의 항에 있어서, 제2 재료를 외곽부의 횡단면에서 불균일한 두께로 도포하는 것을 특징으로 차폐 하우징의 제조 방법.
- 제9항에 있어서, 제2 재료를 하우징 부분을 향한 부분 및/또는 하우징의 외측을 향한 쪽에서보다는 하우징의 내측을 향한 쪽에서 더 두꺼운 두께로 도포하는 것을 특징으로 차폐 하우징의 제조 방법.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19713524 | 1997-03-05 | ||
| DE19713524.2 | 1997-03-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20000076009A true KR20000076009A (ko) | 2000-12-26 |
| KR100362827B1 KR100362827B1 (ko) | 2002-12-11 |
Family
ID=7825178
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019997008095A Expired - Lifetime KR100362827B1 (ko) | 1997-03-05 | 1998-03-05 | 차폐 하우징의 제조 방법 |
Country Status (15)
| Country | Link |
|---|---|
| US (2) | US6312550B1 (ko) |
| EP (2) | EP0965255B2 (ko) |
| JP (1) | JP2001504280A (ko) |
| KR (1) | KR100362827B1 (ko) |
| CN (1) | CN1143610C (ko) |
| AT (1) | ATE319284T1 (ko) |
| AU (1) | AU732032B2 (ko) |
| CA (1) | CA2283867A1 (ko) |
| DE (3) | DE19880257B4 (ko) |
| DK (1) | DK0965255T3 (ko) |
| HU (1) | HUP0004103A3 (ko) |
| NO (1) | NO323017B1 (ko) |
| RU (1) | RU2192717C2 (ko) |
| TR (1) | TR199902208T2 (ko) |
| WO (1) | WO1998039957A1 (ko) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3287330B2 (ja) | 1999-04-22 | 2002-06-04 | 日本電気株式会社 | 高周波回路のシールド構造 |
| DE10135038A1 (de) * | 2001-07-18 | 2003-02-06 | Neuhaus Elektronik Gmbh | Elektrisch leitfähige Dichtung |
| WO2003030610A1 (en) | 2001-10-02 | 2003-04-10 | Parker Hannifin Corporation | Emi shielding gasket construction |
| US6902639B1 (en) | 2002-01-26 | 2005-06-07 | Reynolds Metals Company | Seaming plastic film using solvent-based adhesive bead |
| GB0328246D0 (en) * | 2003-12-04 | 2004-06-16 | Qinetiq Ltd | Improvements relating to electronic circuit packages |
| DE502006004231D1 (de) * | 2005-03-03 | 2009-08-27 | Diabetes Online Ag | Mobiltelefon mit eingebautem messgerät |
| US7794147B2 (en) * | 2006-08-25 | 2010-09-14 | Reynolds Packaging Llc | Multiple applications of seaming solutions for heat shrunk bands and labels |
| BRPI0716654A2 (pt) * | 2006-09-11 | 2013-02-05 | 3M Innovative Properties Co | materiais condutores densificados e artigos produzidos a partir dos mesmos |
| JP5176979B2 (ja) * | 2009-01-22 | 2013-04-03 | セイコーエプソン株式会社 | 弾性表面波装置およびその製造方法 |
| DE102010036919A1 (de) | 2010-08-09 | 2012-02-09 | Aksys Gmbh | Elektrisch leitfähige Dichtung |
| DE102013213233A1 (de) * | 2013-07-05 | 2015-01-08 | Bayerische Motoren Werke Aktiengesellschaft | Verfahren zum Herstellen eines Gehäuses mit einer Schirmung vor elektrischer und/oder magnetischer Strahlung und Gehäuse mit Schirmung vor elektrischer und/oder magnetischer Strahlung |
| US10064317B1 (en) * | 2015-10-27 | 2018-08-28 | Anritsu Company | High isolation shield gasket and method of providing a high isolation shield gasket |
| DE102017123653B4 (de) | 2017-10-11 | 2022-04-28 | Schaeffler Technologies AG & Co. KG | Temperierbares Dichtungselement und Dichtungsanordnung mit diesem |
| CN109759780B (zh) * | 2017-11-10 | 2022-03-22 | 深圳市欢太科技有限公司 | 制备中框的方法、中框及移动终端 |
| WO2020228900A1 (de) | 2019-05-10 | 2020-11-19 | ATN Hölzel GmbH | Verfahren und applikator zur kontinuierlichen sequenziellen applikation von zwei oder mehr viskosen materialien oder fluiden |
| KR102228724B1 (ko) * | 2019-10-15 | 2021-03-18 | 한국전력공사 | 틈새 매움 부재가 구비된 공가 봉인 밴드 |
| US11017820B1 (en) * | 2020-02-21 | 2021-05-25 | Seagate Technology Llc | Electromagnetic shielding for electronic devices |
| US11276436B1 (en) | 2021-01-05 | 2022-03-15 | Seagate Technology Llc | Corrosive gas reduction for electronic devices |
| DE102023112193A1 (de) | 2023-05-09 | 2024-11-14 | ATN Hölzel GmbH | Applikator und Verfahren zum Betreiben oder Verwenden des erfindungsgemäßen Applikators |
| DE102024207783A1 (de) * | 2024-08-15 | 2026-02-19 | Robert Bosch Gesellschaft mit beschränkter Haftung | Abschirmgehäuse und Verfahren zum Ausbilden eines Abschirmgehäuses |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4098633A (en) | 1977-01-24 | 1978-07-04 | The United States Of America As Represented By The Secretary Of The Navy | Method of making radiation seal |
| JPS60132171A (ja) | 1983-12-19 | 1985-07-15 | Nissan Motor Co Ltd | 液体ガスケツトの塗布方法 |
| JPS61149399A (ja) † | 1984-12-25 | 1986-07-08 | Konishiroku Photo Ind Co Ltd | 印刷用原版 |
| GB8616945D0 (en) | 1986-07-11 | 1986-08-20 | Advanced Adhesives Ltd | Simultaneous dispensing of two substances |
| DE3812943A1 (de) | 1988-04-19 | 1989-11-02 | Maibach Fa Gerd D | Behaelter aus faserverstaerktem kunststoff mit stromleitender innenschicht |
| JPH0787275B2 (ja) | 1988-10-28 | 1995-09-20 | 北川工業株式会社 | 導電性シール材 |
| US4968854A (en) | 1988-11-10 | 1990-11-06 | Vanguard Products Corporation | Dual elastomer gasket shield for electronic equipment |
| US4945633A (en) * | 1989-03-01 | 1990-08-07 | Nokia-Mobira Oy | Method of mounting a printed circuit board and securing the earthing to a casing |
| US4977295A (en) | 1989-07-28 | 1990-12-11 | Raytheon Company | Gasket impervious to electromagnetic energy |
| US5053924A (en) | 1990-03-30 | 1991-10-01 | Motorola, Inc. | Electromagnetic shield for electrical circuit |
| US5447761A (en) | 1991-04-19 | 1995-09-05 | Lafond; Luc | Sealant strip incorporating flexing stress alleviating means |
| FI915242A7 (fi) | 1991-11-06 | 1993-05-07 | Nokia Mobile Phones Ltd | Piirilevyn rf-suojaus |
| CA2080177C (en) | 1992-01-02 | 1997-02-25 | Edward Allan Highum | Electro-magnetic shield and method for making the same |
| AU672499B2 (en) * | 1993-06-14 | 1996-10-03 | Emi-Tec Elektronische Materialien Gmbh | A process for producing a casing providing a screen against electromagnetic radiation |
| DE4319965C3 (de) | 1993-06-14 | 2000-09-14 | Emi Tec Elektronische Material | Verfahren zur Herstellung eines Gehäuses mit elektromagnetischer Abschirmung |
| CA2129073C (en) | 1993-09-10 | 2007-06-05 | John P. Kalinoski | Form-in-place emi gaskets |
| DE4340108C3 (de) | 1993-11-22 | 2003-08-14 | Emi Tec Elektronische Material | Abschirmelement und Verfahren zu dessen Herstellung |
| EP0875130B1 (de) | 1996-01-19 | 2006-06-07 | Bernd Tiburtius | Elektrisch abschirmendes gehäuse |
| DE19733627C1 (de) | 1997-07-29 | 1998-06-18 | Neuhaus Elektronik Gmbh | Elektrisch leitfähige Dichtung und Verfahren zu deren Herstellung |
| US6670545B2 (en) | 1999-10-20 | 2003-12-30 | Chemque, Inc. | Conductive coating on a non-conductive flexible substrate |
| US20050223536A1 (en) | 2000-03-24 | 2005-10-13 | Alexander Botrie | Gasket, method of manufacturing and apparatus for manufacturing same |
| DE10046557B4 (de) | 2000-09-19 | 2006-07-27 | Datron-Electronic Gmbh | Vorrichtung zum dosierten Ausbringen eines aus mehreren unterschiedlich viskosen Medien bestehenden Materialstranges mittels Koextrusion und mehrfunktionale Kombinationsdichtung |
-
1998
- 1998-03-05 EP EP98919059A patent/EP0965255B2/de not_active Expired - Lifetime
- 1998-03-05 DE DE19880257T patent/DE19880257B4/de not_active Expired - Lifetime
- 1998-03-05 EP EP01105941A patent/EP1111981A1/de not_active Withdrawn
- 1998-03-05 KR KR1019997008095A patent/KR100362827B1/ko not_active Expired - Lifetime
- 1998-03-05 HU HU0004103A patent/HUP0004103A3/hu unknown
- 1998-03-05 WO PCT/DE1998/000682 patent/WO1998039957A1/de not_active Ceased
- 1998-03-05 CN CNB988034727A patent/CN1143610C/zh not_active Expired - Lifetime
- 1998-03-05 RU RU99121339/09A patent/RU2192717C2/ru active
- 1998-03-05 TR TR1999/02208T patent/TR199902208T2/xx unknown
- 1998-03-05 CA CA002283867A patent/CA2283867A1/en not_active Abandoned
- 1998-03-05 DE DE29824567U patent/DE29824567U1/de not_active Expired - Lifetime
- 1998-03-05 US US09/380,691 patent/US6312550B1/en not_active Ceased
- 1998-03-05 DE DE59813417T patent/DE59813417D1/de not_active Expired - Lifetime
- 1998-03-05 AT AT98919059T patent/ATE319284T1/de not_active IP Right Cessation
- 1998-03-05 DK DK98919059T patent/DK0965255T3/da active
- 1998-03-05 US US12/111,943 patent/USRE41862E1/en not_active Expired - Lifetime
- 1998-03-05 AU AU72044/98A patent/AU732032B2/en not_active Expired
- 1998-03-05 JP JP53807398A patent/JP2001504280A/ja not_active Ceased
-
1999
- 1999-09-03 NO NO19994289A patent/NO323017B1/no not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TR199902208T2 (xx) | 2000-06-21 |
| HK1026806A1 (en) | 2000-12-22 |
| AU732032B2 (en) | 2001-04-12 |
| DE19880257D2 (de) | 1999-09-02 |
| DK0965255T3 (da) | 2006-04-10 |
| HUP0004103A3 (en) | 2002-05-28 |
| US6312550B1 (en) | 2001-11-06 |
| EP0965255B1 (de) | 2006-03-01 |
| JP2001504280A (ja) | 2001-03-27 |
| DE19880257B4 (de) | 2010-12-23 |
| ATE319284T1 (de) | 2006-03-15 |
| HUP0004103A1 (en) | 2001-03-28 |
| DE29824567U1 (de) | 2001-08-16 |
| CN1143610C (zh) | 2004-03-24 |
| NO994289L (no) | 1999-11-04 |
| RU2192717C2 (ru) | 2002-11-10 |
| EP1111981A1 (de) | 2001-06-27 |
| NO323017B1 (no) | 2006-12-27 |
| CA2283867A1 (en) | 1998-09-11 |
| EP0965255B2 (de) | 2010-10-20 |
| AU7204498A (en) | 1998-09-22 |
| DE59813417D1 (de) | 2006-04-27 |
| USRE41862E1 (en) | 2010-10-26 |
| KR100362827B1 (ko) | 2002-12-11 |
| NO994289D0 (no) | 1999-09-03 |
| EP0965255A1 (de) | 1999-12-22 |
| WO1998039957A1 (de) | 1998-09-11 |
| CN1251254A (zh) | 2000-04-19 |
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