KR20030004656A - 광센서를 이용한 평면 도파로형 광회로 칩의 접합 장치 - Google Patents
광센서를 이용한 평면 도파로형 광회로 칩의 접합 장치 Download PDFInfo
- Publication number
- KR20030004656A KR20030004656A KR1020010040255A KR20010040255A KR20030004656A KR 20030004656 A KR20030004656 A KR 20030004656A KR 1020010040255 A KR1020010040255 A KR 1020010040255A KR 20010040255 A KR20010040255 A KR 20010040255A KR 20030004656 A KR20030004656 A KR 20030004656A
- Authority
- KR
- South Korea
- Prior art keywords
- optical
- adhesive
- circuit chip
- ultraviolet
- planar waveguide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/255—Splicing of light guides, e.g. by fusion or bonding
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/30—Optical coupling means for use between fibre and thin-film device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4239—Adhesive bonding; Encapsulation with polymer material
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Optical Couplings Of Light Guides (AREA)
- Optical Integrated Circuits (AREA)
Abstract
Description
Claims (3)
- 평면 도파로형 광회로 칩과 광섬유 블럭간을 정렬하고, 정렬된 상태를 고정하는 접합 장치에 있어서,소정 각도의 연마각이 제공된 연마면을 각각 구비한 평면 도파로형 광회로 칩과 광섬유 블럭의 정렬 후, 그들의 계면들사이에 도포되는 자외선 경화 접착제;상기 자외선 경화 접착제의 상측에 이격되게 배치되어 상기 자외선 경화 접착제를 경화시키는 자외선 광원;상기 접착제의 하측에 이격되게 배치되어 상기 접착제를 투과한 자외선의 파워 변화를 감지하는 광 센서;상기 광 센서로부터 측정된 데이터를 제공받아서 상기 자외선의 파워 변화를 디스플레이하는 광파워 메타; 및상기 광파워 메타로부터 제공된 데이터를 이용하여 완전 경화시간을 파악하는 제어부로 구성되어짐을 특징으로 하는 접합 장치.
- 제1항에 있어서, 상기 자외선 광원은 상기 연마각과 동일한 방향의 상측에 위치하여 접착제를 향하여 조사하는 구성임을 특징으로 하는 접합 장치.
- 제1항에 있어서, 상기 광 센서는 상기 연마각과 동일한 방향의 하측에 위치하여 투과된 자외선의 파워 변화를 측정하는 구성임을 특징으로 하는 접합 장치
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2001-0040255A KR100403739B1 (ko) | 2001-07-06 | 2001-07-06 | 광센서를 이용한 평면 도파로형 광회로 칩의 접합 장치 |
| US10/140,619 US20030007746A1 (en) | 2001-07-06 | 2002-05-07 | PLC chip junction device using an optical sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2001-0040255A KR100403739B1 (ko) | 2001-07-06 | 2001-07-06 | 광센서를 이용한 평면 도파로형 광회로 칩의 접합 장치 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20030004656A true KR20030004656A (ko) | 2003-01-15 |
| KR100403739B1 KR100403739B1 (ko) | 2003-10-30 |
Family
ID=19711828
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR10-2001-0040255A Expired - Fee Related KR100403739B1 (ko) | 2001-07-06 | 2001-07-06 | 광센서를 이용한 평면 도파로형 광회로 칩의 접합 장치 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20030007746A1 (ko) |
| KR (1) | KR100403739B1 (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10833289B2 (en) | 2016-03-22 | 2020-11-10 | Samsung Display Co., Ltd. | Display device and method of manufacturing the same |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6879757B1 (en) * | 2001-12-11 | 2005-04-12 | Phosistor Technologies, Inc. | Connection between a waveguide array and a fiber array |
| US7303339B2 (en) * | 2002-08-28 | 2007-12-04 | Phosistor Technologies, Inc. | Optical beam transformer module for light coupling between a fiber array and a photonic chip and the method of making the same |
| US7426328B2 (en) * | 2002-08-28 | 2008-09-16 | Phosistor Technologies, Inc. | Varying refractive index optical medium using at least two materials with thicknesses less than a wavelength |
| US8538208B2 (en) * | 2002-08-28 | 2013-09-17 | Seng-Tiong Ho | Apparatus for coupling light between input and output waveguides |
| CN119256254A (zh) * | 2022-06-16 | 2025-01-03 | 松下知识产权经营株式会社 | 光波导的连接方法以及光波导连接装置 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4304806A (en) * | 1980-02-01 | 1981-12-08 | Minnesota Mining And Manufacturing Company | Information carrying discs |
| GB8417911D0 (en) * | 1984-07-13 | 1984-08-15 | British Telecomm | Connecting waveguides |
| JPH095565A (ja) * | 1995-06-14 | 1997-01-10 | Furukawa Electric Co Ltd:The | 光部品と光ファイバとの固定方法 |
| JPH1114859A (ja) * | 1997-06-24 | 1999-01-22 | Nippon Telegr & Teleph Corp <Ntt> | 光導波路と光ファイバの接続方法 |
| US6130444A (en) * | 1998-02-27 | 2000-10-10 | Nec Corporation | Optical fiber secured with a photosetting resin covered with a UV light-transmissive plate |
| JP2000131556A (ja) * | 1998-10-28 | 2000-05-12 | Kyocera Corp | 光導波路と光ファイバとの接続構造および接続方法 |
| JP3505470B2 (ja) * | 2000-04-06 | 2004-03-08 | 古河電気工業株式会社 | 光ファイバの被覆形成装置 |
| JP3745979B2 (ja) * | 2000-06-22 | 2006-02-15 | 古河電気工業株式会社 | 光ファイバの被覆形成方法および被覆形成装置 |
| US20030026919A1 (en) * | 2001-07-11 | 2003-02-06 | Hidekazu Kojima | Optical fiber resin coating apparatus and optical fiber resin coating method |
-
2001
- 2001-07-06 KR KR10-2001-0040255A patent/KR100403739B1/ko not_active Expired - Fee Related
-
2002
- 2002-05-07 US US10/140,619 patent/US20030007746A1/en not_active Abandoned
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10833289B2 (en) | 2016-03-22 | 2020-11-10 | Samsung Display Co., Ltd. | Display device and method of manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100403739B1 (ko) | 2003-10-30 |
| US20030007746A1 (en) | 2003-01-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6839492B2 (en) | Packaging device for optical waveguide element | |
| US5703973A (en) | Optical integrated circuit having passively aligned fibers and method using same | |
| JP3576093B2 (ja) | 光導波路型spr現象測定装置 | |
| US10487356B2 (en) | Integrated devices and systems for free-space optical coupling | |
| US5499309A (en) | Method of fabricating optical component including first and second optical waveguide chips having opposed inclined surfaces | |
| JP3287773B2 (ja) | 光導波路デバイスの製造方法 | |
| JP6767925B2 (ja) | 光モジュールおよびその作製方法 | |
| KR100403739B1 (ko) | 광센서를 이용한 평면 도파로형 광회로 칩의 접합 장치 | |
| KR100341287B1 (ko) | 정렬마크를가지는광섬유블록및평면광도파로소자와,이광섬유블록과평면광도파로소자의정렬장치및방법 | |
| JPH08313744A (ja) | 光回路部品 | |
| JP4340210B2 (ja) | 光学部品およびその製造方法 | |
| KR100357852B1 (ko) | 부가 도파로를 이용한 광 도파로열 격자 소자의 측정 및정렬 방법 및 그 광 도파로열 격자 소자 | |
| WO2023132785A1 (en) | Apparatus for wafer level testing of semicondcutor device | |
| Zhou et al. | A novel assembling technique for fiber collimator arrays using UV-curable adhesives | |
| KR100416983B1 (ko) | 평면 광도파로 소자 모듈의 정렬 장치 | |
| JP2004045901A (ja) | 光導波路装置及び光導波路装置を用いた通信機器 | |
| KR100333092B1 (ko) | 콜리메이터 정렬장치 | |
| JP2001235661A (ja) | 導波路をデバイスに整列させるための方法および装置 | |
| KR100487216B1 (ko) | 정렬성이 향상된 온도 무의존형 파장분할 다중화/역다중화장치 및 그 정렬방법 | |
| KR101068527B1 (ko) | 파이버 어레이 블럭 구조 및 그의 제조방법 | |
| KR100547756B1 (ko) | 광모듈의 제작 장치 및 방법 | |
| JP2008040029A (ja) | モニタ用光学素子及びその製造方法 | |
| JP2001264574A (ja) | 光ファイバ用v溝基板 | |
| JP2004138736A (ja) | 偏波保持光ファイバ及び偏波保持光ファイバの調軸方法 | |
| WO2022038763A1 (ja) | 光モジュール |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| D13-X000 | Search requested |
St.27 status event code: A-1-2-D10-D13-srh-X000 |
|
| D14-X000 | Search report completed |
St.27 status event code: A-1-2-D10-D14-srh-X000 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U11-oth-PR1002 Fee payment year number: 1 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-5-5-R10-R13-asn-PN2301 St.27 status event code: A-5-5-R10-R11-asn-PN2301 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-5-5-R10-R13-asn-PN2301 St.27 status event code: A-5-5-R10-R11-asn-PN2301 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 4 |
|
| FPAY | Annual fee payment |
Payment date: 20070910 Year of fee payment: 5 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 5 |
|
| LAPS | Lapse due to unpaid annual fee | ||
| PC1903 | Unpaid annual fee |
St.27 status event code: A-4-4-U10-U13-oth-PC1903 Not in force date: 20081018 Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE |
|
| PC1903 | Unpaid annual fee |
St.27 status event code: N-4-6-H10-H13-oth-PC1903 Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE Not in force date: 20081018 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |