KR200303473Y1 - Inside heat dissipation prevention device of electronic communication equipment - Google Patents
Inside heat dissipation prevention device of electronic communication equipment Download PDFInfo
- Publication number
- KR200303473Y1 KR200303473Y1 KR2019970045358U KR19970045358U KR200303473Y1 KR 200303473 Y1 KR200303473 Y1 KR 200303473Y1 KR 2019970045358 U KR2019970045358 U KR 2019970045358U KR 19970045358 U KR19970045358 U KR 19970045358U KR 200303473 Y1 KR200303473 Y1 KR 200303473Y1
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- shelf
- heat
- electronic communication
- communication equipment
- enclosure
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04Q—SELECTING
- H04Q1/00—Details of selecting apparatus or arrangements
- H04Q1/02—Constructional details
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- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
본 고안은 전자통신장비의 함체내부 발산열 역류방지장치에 관한 것으로, 주름진 표면을 가지며 오목하게 굴곡된 형상으로 이루어져 횡으로 배열되는 다수개의 열집적핀(11)과, 이 열집적핀(11)을 함체(5)의 상단부에 고정시켜주는 핀장착수단(12)으로 구성되어 함체내의 상단부로 상승 집적되는 셸프로 부터의 고온의 발산열과 냉각공기가 셸프로 역류되지 않고 배기팬에 의해 외부로 원활하게 배출되도록 하게 됨으로써 셸프내의 전자장치를 열적장애로 부터 보호하게 되는 것이다.The present invention relates to a device for preventing internal heat dissipation backflow of an electronic communication device, comprising a plurality of thermally integrated fins 11 arranged in a concavely curved shape and having a corrugated surface and arranged horizontally. Consisting of pin mounting means (12) for fixing the upper end of the enclosure (5) to the upper end of the enclosure, the heat of dissipation and hot air from the shelf that is integrated into the upper end of the shelf without being flowed back to the shelf to the outside by the exhaust fan By being discharged smoothly, the electronics in the shelf are protected from thermal disturbances.
Description
본 고안은 전자통신장비의 함체내부 발산열 역류방지장치(Device For Inverse Current Prevention Of Emitted Heat In Inside Of Electronic Communication Equipment Cabinet)에 관한 것으로, 보다 상세하게는 함체내의 상단부로 상승 고온의 셸프 냉각공기가 셸프로 역류되는 것을 방지함으로써 셸프내의 전자장치를 열적장애로 부터 보호하게 되는 전자통신장비의 함체내부 발산열 역류방지장치에 관한 것이다.The present invention relates to a device for inverse current prevention of emitted heat in inside of electronic communication equipment cabinet, and more specifically to the upper end of the inside of the shelf high temperature shelf cooling air The present invention relates to a device for preventing heat backflow inside an enclosure of an electronic communication device that protects an electronic device in a shelf from thermal disturbances by preventing backflow to the shelf.
전자통신장비의 일례로서 전화교환기는 여러개의 인쇄회로기판이 셸프라고 하는 내장구에 장착되는데, 이 셸프는 흔히 몇개가 한 조를 이루어 함체내에 수직 배열된다.As an example of telecommunications equipment, telephone exchangers are equipped with a number of printed circuit boards mounted in a built-in called a shelf, which is often arranged vertically within the enclosure in several sets.
그런데, 인쇄회로기판은 항상 통전되고 있는 상태에 있기 때문에 이로 부터 열이 발산되므로 이 발산열에 의한 고온의 공기를 냉각 혹은 배출시킬 필요가 있다.However, since the printed circuit board is always in the energized state, heat is emitted from it, so it is necessary to cool or discharge the hot air by the heat of diverging.
따라서, 외부의 찬 공기를 함체의 내부로 공급하여 상하로 배열되어 있는 셸프를 냉각시키고, 냉각작용에 의해 온도가 상승된 공기는 다시 외부로 배출시키는 것이 일반적이다.Therefore, it is common to supply external cold air to the inside of the enclosure to cool the shelves arranged up and down, and to release the air whose temperature has risen by the cooling action to the outside again.
즉, 첨부된 도면 도 1에 도시된 바와 같이 여러개의 셸프(2)들이 수직으로 배열되어 있는 함체(5)내부의 후방부 하단과 상단에 각각 흡기팬(3)과 배기팬(4)을 장착하게 되는데, 상기 각각의 셸프(2)의 상하단면에는 도시되어 있지는 않지만 수많은 통기공들이 형성되어 있어 상기 흡기팬(3)에 의해 함체(5)의 내부로 송풍된 외부의 찬 공기가 각 셸프(2)의 통기공들을 통과하면서 최하측의 셸프부터 최상측의 셸프까지 냉각시키게 되며, 이 냉각작용에 따라 고온으로 상승된 공기는 상기 배기팬(4)에 의해 외부로 배출되도록 하고 있다.That is, as shown in FIG. 1, the intake fan 3 and the exhaust fan 4 are mounted on the lower end and the upper end of the rear part of the inside of the enclosure 5 in which several shelves 2 are arranged vertically. Although not shown in the upper and lower cross-section of each shelf (2), a number of vent holes are formed so that the external cold air blown into the enclosure (5) by the intake fan (3) each shelf (2) While passing through the vent holes of the cooling to the uppermost shelf to the upper shelf, the air that has risen to a high temperature according to this cooling action is to be discharged to the outside by the exhaust fan (4).
그러나, 도 1에 도시되어 있듯이 흡기팬(3)이 함체(5)의 하단부에 설치되어 있기 때문에 흡기팬(3)에 의해 송풍된 저온의 공기가 각 셸프(2)를 고르게 냉각시킬 수는 없고, 함체(5)의 상단부에 위치한 셸프(2)로 부터의 발산열은 함체(5)상단벽에 집적되게 되며, 더구나 각각의 셸프(2)를 냉각시키면서 함체(5)의 상단부로 상승되어온 고온상태의 공기와 최상단부 셸프(2)로 부터의 발산열이 상기 배기팬(4)에 의해 외부로 배출되기는 하지만, 함체(5)의 상단벽에 부딪힌 일부의 공기는 함체(5)의 상단벽에 집적되어 있던 열기와 더불어 다시 셸프(2)를 향해 역류하게 됨으로써 오히려 셸프(2)에 고온의 열기가 미치게 되는 결과를 초래하는 바, 이에 따라 셸프(2)내의 인쇄회로기판 등 전자장비에 열적장애를 일으키는 문제점이 있다.However, as shown in FIG. 1, since the intake fan 3 is provided at the lower end of the enclosure 5, the low temperature air blown by the intake fan 3 cannot cool each shelf 2 evenly. The heat of dissipation from the shelf (2) located at the upper end of the (5) is accumulated in the upper wall of the enclosure (5), and furthermore, in the high temperature state that has been raised to the upper end of the enclosure (5) while cooling each shelf (2). Although air and the heat of dissipation from the uppermost shelf 2 are discharged to the outside by the exhaust fan 4, some air hitting the upper wall of the enclosure 5 is accumulated on the upper wall of the enclosure 5. As the heat flows back toward the shelf 2, the hot heat is exerted on the shelf 2, which causes thermal disturbances in electronic equipment such as printed circuit boards in the shelf 2. There is a problem that causes.
본 고안은 전술한 바와 같은 문제점을 해소하기 위해 안출된 것으로서, 함체내의 상단부로 상승된 고온의 셸프 냉각공기가 셸프로 역류되는 것을 방지함으로써 셸프내의 전자장치를 열적장애로 부터 보호하게 되는 전자통신장비의 함체내부 발산열 역류방지장치를 제공함에 그 목적이 있다.The present invention was devised to solve the above problems, and prevents the high temperature shelf cooling air raised to the upper end of the enclosure from flowing back to the shelf, thereby protecting the electronic devices in the shelf from thermal disturbances. The purpose is to provide a device for preventing the backflow of heat dissipation inside the enclosure.
상기와 같은 목적을 달성하기 위한 본 고안은 하측의 셸프로 부터 상승되어 온 고온상태 열기의 유속을 감소시키면서 일정시간동안 가두어 둘 수 있도록 주름진 "U"자 형상으로 이루어진 여러개의 열집적핀(fin)이 함체의 상단벽에 장착되는 것을 특징으로 한다.The present invention for achieving the above object is a plurality of heat integrated fins (fin) made of a corrugated "U" shape so that it can be trapped for a certain time while reducing the flow rate of the high temperature state heat that has been raised from the lower shelf It is characterized in that it is mounted on the upper wall of the enclosure.
도 1은 종래의 일반적인 전자통신장비의 함체내부와 열유동을 나타낸 개략적인 측단면도,1 is a schematic side cross-sectional view showing the interior of the housing and heat flow of a conventional general electronic communication equipment,
도2는 본 고안이 적용된 전자통신장비의 함체내부와 열유동을 나타낸 개략적인 측단면도,Figure 2 is a schematic side cross-sectional view showing the inside of the housing and heat flow of the electronic communication equipment to which the present invention is applied,
도 3은 본 고안에 따른 역류방지장치를 나타낸 사시도와 요부단면도이다.Figure 3 is a perspective view and a main cross-sectional view showing a backflow prevention device according to the present invention.
* 도면의 주요부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings
1 : 역류방지장치 2 : 셸프1: Backflow prevention device 2: Shelf
3 : 흡기팬 4 : 배기팬3: intake fan 4: exhaust fan
5 : 함체 11 : 열집적핀5: enclosure 11: heat integrated pin
12 : 핀장착수단 12a : 개구공12: pin mounting means 12a: opening hole
이하 본 고안의 바람직한 실시예를 첨부된 도면을 참조로 상세히 설명하면 다음과 같다.Hereinafter, described in detail with reference to the accompanying drawings a preferred embodiment of the present invention.
도2는 본 고안이 적용된 전자통신장비의 함체내부와 열유동을 나타낸 개략적인 측단면도이고, 도 3은 본 고안에 따른 역류방지장치를 나타낸 사시도와 요부단면도로서 도시된 바와 같이, 전자장치가 수납된 여러개의 셸프(2)들이 내부에 수직으로 배열되어 있고, 내부의 후방부 하단과 상단에 각각 흡기팬(3)과 배기팬(4)이 장착되어 있는 전자통신장비의 함체(5)에 있어서, 본 고안에 의한 역류방지장치(1)는 이 함체(5)의 상단벽에 구비되는 바, 하측의 셸프(2)로 부터 상승되어 오는 고온상태 열기의 유속을 감소시키면서 일정시간동안 가두어 둘 수 있도록 주름진 "U"자 형상으로 이루어진 여러개의 열집적핀(11)과, 상측 내벽이 상기 열집적핀(11)의 상단과 소정거리 이격된 상태에서 열집적핀(11)을 고정시키게 되는 박스형태로 이루어지되 하측면에는 셸프(2)로 부터 상승되어 오는 공기가 각 열집적핀(11)들의 사이로 통과할 수 있도록 열집적핀(11)들 사이에 개구공(12a)이 형성된 핀장착수단(12)으로 구성된다.Figure 2 is a schematic side cross-sectional view showing the interior of the housing and heat flow of the electronic communication equipment to which the present invention is applied, Figure 3 is a perspective view and a main cross-sectional view showing a backflow prevention device according to the present invention, the electronic device is accommodated In the housing (5) of the electronic communication equipment, a plurality of shelves (2) are arranged vertically therein, and an intake fan (3) and an exhaust fan (4) are mounted at the lower end and the upper end of the rear part, respectively. The non-return device 1 according to the present invention is provided on the upper wall of the enclosure 5 so that it can be trapped for a predetermined time while reducing the flow rate of the high temperature state heat rising from the lower shelf 2. A plurality of heat collecting pins 11 having a corrugated "U" shape, and a box shape to fix the heat collecting pins 11 in a state where an upper inner wall is spaced a predetermined distance from an upper end of the heat collecting pins 11. On the lower side of the shelf ( It is composed of a pin mounting means (12) formed with an opening hole (12a) between the heat integration pins 11 so that the air rising from 2) can pass between the respective heat integration pins (11).
이와 같이 이루어진 본 고안에 따른 전자통신장비의 함체내부 발산열 역류방지장치는 다음과 같은 작용을 한다.The internal heat dissipation backflow preventing device of the electronic communication device according to the present invention made as described above functions as follows.
흡기팬(3)에 의해 외부의 찬 공기가 함체(5)내로 송풍이 됨에 따라 송풍된 공기는 각각의 셸프(2)들을 통과하면서 셸프(2)내의 전자장치로 부터 발산되는 열을 흡수함으로써 고온의 열기로 된 상태로 함체(5)의 상단부에 모이게 되는 바, 이때 핀장착수단(12)의 개구공(12a)을 지나면서 열집적핀(11)의 표면주름에 의해 유속이 감소되고, 이어서 핀장착수단(12)의 상단벽에 부딪히고는 열집적핀(11)의 오목한 내부로 집적되는데, 이때의 이 고온의 열기는 유속이 상당히 감소된 상태이므로 함체(5)의 하부로 역류되지 않고 배기팬(4)으로 유도되어 이 배기팬(4)에 의해 외부로 신속히 배출되게 된다.As the outside cold air is blown into the enclosure 5 by the intake fan 3, the blown air passes through the respective shelves 2 and absorbs heat emitted from the electronic devices in the shelf 2. The heat is collected in the upper end of the housing 5 in this state, the flow rate is reduced by the surface wrinkle of the heat integration pin 11 passing through the opening hole 12a of the pin mounting means 12, and then the pin The hot wall hits the top wall of the mounting means 12 and is integrated into the concave interior of the heat integration fin 11, where the high temperature heat is exhausted without being flowed back to the bottom of the enclosure 5 since the flow velocity is significantly reduced. Guided to the fan (4) is quickly discharged to the outside by the exhaust fan (4).
이상에서 설명한 바와 같이 본 고안에 따른 전자통신장비의 함체내부 발산열 역류방지장치에 의하면, 함체내의 상단부로 상승 집적되는 셸프로 부터의 고온의 발산열과 냉각공기가 셸프로 역류되지 않고 배기팬에 의해 외부로 원활하게 배출되도록 하게 됨으로써 셸프내의 전자장치를 열적장애로 부터 보호할 수가 있다.As described above, according to the present invention, an internal heat dissipation backflow prevention device of an electronic communication device includes a heat dissipation heat and cooling air from a shelf that rises and accumulates to an upper end portion of an electronic communication device in an exhaust fan without being flowed back to the shelf. By being discharged to the outside smoothly by the outside it is possible to protect the electronic devices in the shelf from thermal disturbances.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019970045358U KR200303473Y1 (en) | 1997-12-31 | 1997-12-31 | Inside heat dissipation prevention device of electronic communication equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019970045358U KR200303473Y1 (en) | 1997-12-31 | 1997-12-31 | Inside heat dissipation prevention device of electronic communication equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR19990032597U KR19990032597U (en) | 1999-07-26 |
| KR200303473Y1 true KR200303473Y1 (en) | 2003-03-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019970045358U Expired - Fee Related KR200303473Y1 (en) | 1997-12-31 | 1997-12-31 | Inside heat dissipation prevention device of electronic communication equipment |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR200303473Y1 (en) |
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1997
- 1997-12-31 KR KR2019970045358U patent/KR200303473Y1/en not_active Expired - Fee Related
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| Publication number | Publication date |
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| KR19990032597U (en) | 1999-07-26 |
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