KR20070104531A - 프로브 카드 - Google Patents
프로브 카드 Download PDFInfo
- Publication number
- KR20070104531A KR20070104531A KR1020077014131A KR20077014131A KR20070104531A KR 20070104531 A KR20070104531 A KR 20070104531A KR 1020077014131 A KR1020077014131 A KR 1020077014131A KR 20077014131 A KR20077014131 A KR 20077014131A KR 20070104531 A KR20070104531 A KR 20070104531A
- Authority
- KR
- South Korea
- Prior art keywords
- contactor
- elasticity
- probe
- probe card
- elastic sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
Description
Claims (4)
- 피검사체의 전기적 특성을 검사하기 위한 프로브 카드로서,프로브를 피검사체측의 하나의 면에 지지하는 콘택터와,상기 콘택터의 다른 면에 대향하며, 상기 콘택터와 전기적으로 접속되는 회로 기판과,상기 콘택터의 다른 면과 상기 회로 기판 사이에 개재되어 상기 콘택터와 상기 회로 기판을 전기적으로 접속하며, 탄성을 갖는 접속체를 포함하고, 상기 접속체는 상기 콘택터의 외주측보다도 중앙측에 가까운 부분의 탄성이 작아지도록 형성되어 있는 것인, 프로브 카드.
- 제1항에 있어서,상기 접속체는, 상기 콘택터의 다른 면에 접촉하는 시트형으로 형성되며,상기 접속체는, 상기 콘택터의 외주측으로부터 중앙측에 근접함에 따라 단계적으로 탄성이 작아지도록 형성되어 있는 것인, 프로브 카드.
- 제2항에 있어서,상기 접속체에는, 평면에서 보아 상기 콘택터의 중심을 원심으로 하는 동심원 형으로 탄성이 상이한 영역이 형성되어 있는 것인, 프로브 카드.
- 제1항에 있어서,상기 접속체는, 상기 콘택터의 다른 면 내에 배치된 복수의 접속핀이며,상기 콘택터의 다른 면의 중앙측에는, 외주측의 접속핀보다 탄성이 작은 접속핀이 배치되어 있는 것인, 프로브 카드.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2005-00203285 | 2005-07-12 | ||
| JP2005203285A JP4472593B2 (ja) | 2005-07-12 | 2005-07-12 | プローブカード |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20070104531A true KR20070104531A (ko) | 2007-10-26 |
| KR100915179B1 KR100915179B1 (ko) | 2009-09-02 |
Family
ID=37636940
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020077014131A Expired - Fee Related KR100915179B1 (ko) | 2005-07-12 | 2006-06-27 | 프로브 카드 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7541820B2 (ko) |
| JP (1) | JP4472593B2 (ko) |
| KR (1) | KR100915179B1 (ko) |
| TW (1) | TW200716987A (ko) |
| WO (1) | WO2007007544A1 (ko) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8319511B2 (en) | 2007-11-30 | 2012-11-27 | Tokyo Electron Limited | Probe device having a structure for being prevented from deforming |
| US8779792B2 (en) | 2009-08-07 | 2014-07-15 | Samsung Electronics Co., Ltd. | Tester and semiconductor device test apparatus having the same |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200525675A (en) * | 2004-01-20 | 2005-08-01 | Tokyo Electron Ltd | Probe guard |
| TW200704937A (en) * | 2005-03-08 | 2007-02-01 | Tokyo Electron Ltd | Method of forming connection pin, probe, connection pin, probe card, and method of producing probe card |
| KR100851392B1 (ko) * | 2007-03-16 | 2008-08-11 | (주)엠투엔 | 평탄화 수단을 구비한 프로브 카드 |
| KR101402144B1 (ko) * | 2007-03-30 | 2014-06-03 | 주식회사 아이에스시 | 이방 도전성 커넥터, 프로브 부재 및 웨이퍼 검사 장치 |
| JP5015671B2 (ja) * | 2007-06-21 | 2012-08-29 | 日本電子材料株式会社 | プローブカード |
| JP5188161B2 (ja) * | 2007-11-30 | 2013-04-24 | 東京エレクトロン株式会社 | プローブカード |
| JP2009204393A (ja) * | 2008-02-27 | 2009-09-10 | Renesas Technology Corp | プローブカード、プローブカードの製造方法、半導体検査装置および半導体装置の製造方法 |
| JP2009301859A (ja) * | 2008-06-12 | 2009-12-24 | Japan Electronic Materials Corp | Icピンフレームおよびicピンを用いたプローブカード |
| DE202009014987U1 (de) * | 2009-10-28 | 2010-02-18 | Feinmetall Gmbh | Prüfvorrichtung zur elektrischen Prüfung von elektrischen Prüflingen |
| US8643394B2 (en) * | 2010-04-16 | 2014-02-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Non-reflow probe card structure |
| US20130265073A1 (en) * | 2011-01-16 | 2013-10-10 | Japan Electronic Materials Corporation | Probe Card And Manufacturing Method Therefor |
| US9891273B2 (en) * | 2011-06-29 | 2018-02-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Test structures and testing methods for semiconductor devices |
| JP7075725B2 (ja) * | 2017-05-30 | 2022-05-26 | 株式会社日本マイクロニクス | 電気的接続装置 |
| JP7590820B2 (ja) * | 2020-06-17 | 2024-11-27 | 株式会社ヨコオ | プローブカード |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5854534A (en) * | 1992-08-05 | 1998-12-29 | Fujitsu Limited | Controlled impedence interposer substrate |
| WO1996016440A1 (en) | 1994-11-15 | 1996-05-30 | Formfactor, Inc. | Interconnection elements for microelectronic components |
| US6483328B1 (en) * | 1995-11-09 | 2002-11-19 | Formfactor, Inc. | Probe card for probing wafers with raised contact elements |
| US5828226A (en) * | 1996-11-06 | 1998-10-27 | Cerprobe Corporation | Probe card assembly for high density integrated circuits |
| WO2002065588A1 (en) * | 2001-02-09 | 2002-08-22 | Jsr Corporation | Anisotropic conductive connector, its manufacture method and probe member |
| US7396236B2 (en) * | 2001-03-16 | 2008-07-08 | Formfactor, Inc. | Wafer level interposer |
| JP3891798B2 (ja) * | 2001-06-19 | 2007-03-14 | 松下電器産業株式会社 | プローブ装置 |
| US6677771B2 (en) * | 2001-06-20 | 2004-01-13 | Advantest Corp. | Probe contact system having planarity adjustment mechanism |
| TW525273B (en) * | 2002-02-07 | 2003-03-21 | Via Tech Inc | Elastomer interposer for fixing package onto printed circuit board and fabrication method thereof |
| JP3621938B2 (ja) | 2002-08-09 | 2005-02-23 | 日本電子材料株式会社 | プローブカード |
| US7372286B2 (en) * | 2006-01-03 | 2008-05-13 | Chipmos Technologies (Bermuda) Ltd. | Modular probe card |
-
2005
- 2005-07-12 JP JP2005203285A patent/JP4472593B2/ja not_active Expired - Fee Related
-
2006
- 2006-06-27 KR KR1020077014131A patent/KR100915179B1/ko not_active Expired - Fee Related
- 2006-06-27 WO PCT/JP2006/312790 patent/WO2007007544A1/ja not_active Ceased
- 2006-06-27 US US11/883,885 patent/US7541820B2/en not_active Expired - Fee Related
- 2006-06-28 TW TW095123260A patent/TW200716987A/zh not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8319511B2 (en) | 2007-11-30 | 2012-11-27 | Tokyo Electron Limited | Probe device having a structure for being prevented from deforming |
| US8779792B2 (en) | 2009-08-07 | 2014-07-15 | Samsung Electronics Co., Ltd. | Tester and semiconductor device test apparatus having the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4472593B2 (ja) | 2010-06-02 |
| TWI293120B (ko) | 2008-02-01 |
| US20080150558A1 (en) | 2008-06-26 |
| TW200716987A (en) | 2007-05-01 |
| US7541820B2 (en) | 2009-06-02 |
| WO2007007544A1 (ja) | 2007-01-18 |
| KR100915179B1 (ko) | 2009-09-02 |
| JP2007024533A (ja) | 2007-02-01 |
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