KR20080064430A - 말레익언하이드라이드 유도체와 (메트)아크릴 화합물의중합체 및 이를 포함하는 화학증폭형 포토레지스트 조성물 - Google Patents
말레익언하이드라이드 유도체와 (메트)아크릴 화합물의중합체 및 이를 포함하는 화학증폭형 포토레지스트 조성물 Download PDFInfo
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- KR20080064430A KR20080064430A KR1020070001347A KR20070001347A KR20080064430A KR 20080064430 A KR20080064430 A KR 20080064430A KR 1020070001347 A KR1020070001347 A KR 1020070001347A KR 20070001347 A KR20070001347 A KR 20070001347A KR 20080064430 A KR20080064430 A KR 20080064430A
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- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/04—Acids; Metal salts or ammonium salts thereof
- C08F220/06—Acrylic acid; Methacrylic acid; Metal salts or ammonium salts thereof
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G61/12—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0395—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having a backbone with alicyclic moieties
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
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- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Materials For Photolithography (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
Description
| 중합체(부) | a산 발생제(부) | b염기성 첨가제(부) | 감도 (mJ/cm2) | 해상도 (um) | c수직성 (1~5) | 정제파 현상 | |
| 실시예2 | 화학식7(100) | 2.5 | 0.5 | 13 | 110 | 1 | 양호 |
| 실시예3 | 화학식10(100) | 2.5 | 0.5 | 12 | 120 | 2 | 양호 |
| 실시예4 | 화학식13(100) | 2.5 | 0.5 | 13 | 110 | 3 | 양호 |
| 실시예5 | 화학식7(100) | 3.0 | 0.5 | 12 | 100 | 1 | 양호 |
| 실시예6 | 화학식10(100) | 3.0 | 0.5 | 11 | 110 | 1 | 양호 |
| 실시예7 | 화학식13(100) | 3.0 | 0.5 | 12 | 110 | 3 | 양호 |
| 실시예8 | 화학식7(100) | 3.0 | 0.8 | 15 | 120 | 1 | 양호 |
| 실시예9 | 화학식10(100) | 3.0 | 0.8 | 13 | 130 | 1 | 양호 |
| 실시예10 | 화학식13(100) | 3.0 | 0.8 | 15 | 110 | 2 | 양호 |
| a산발생제 ; Triphenylsulfonium nonaflate b염기성 첨가제 ; Tetramethylammonium hydroxide c수직성 ; 1: 아주양호, 2 : 양호, 3 : 보통, 4 : 불량, 5 : 아주불량 | |||||||
| 중합체(부) | a산 발생제(부) | b염기성 첨가제(부) | 감도 (mJ/cm2) | 해상도 (um) | c수직성 (1~5) | 정제파 현상 | |
| 비교예1 | 화학식11(100) | 2.5 | 0.5 | 16 | 130 | 4 | 불량 |
| 비교예2 | 화학식11(100) | 3.0 | 0.5 | 16 | 110 | 3 | 양호 |
| 비교예3 | 화학식11(100) | 3.0 | 0.8 | 18 | 130 | 4 | 불량 |
| a산발생제 ; Triphenylsulfonium nonaflate b염기성 첨가제 ; Tetramethylammonium hydroxide c수직성 ; 1: 아주양호, 2 : 양호, 3 : 보통, 4 : 불량, 5 : 아주불량 | |||||||
Claims (10)
- 하기 화학식 1로 표시되는 공중합체.화학식 1상기 식에서 R1, R2, R3 및 R4는 서로 독립적인 것으로써, R1와 R2는 수소원자, 에테르기, 에스테르기, 카르보닐기, 아세탈기, 에폭시기, 나이트릴기, 또는 알데하이드기를 포함하거나 포함하지 않은 탄소수 1~30인 의 알킬기를 나타낸다. R3와 R4는 각각 독립적인 것으로써 수소 또는 메틸기이다. 그리고 X는 말레익언하이드라이드 또는 노보넨 디카르복실릭 언하이드라이드로서 화학식은 각각 하기 화학식2와3을 나타낸다. 또한x, y, z는 각각 주쇄내에 반복단위를 나타내는 수로서 x+y+z=1이고 0.1<x/(x+y+z)<0.8, 0.1<y/(x+y+z)<0.8, 0.1≤z/(x+y+z)<0.8의 값을 가진다.화학식2 화학식3
- 제 1항에 있어서, x로 표시되는 반복단위는 전체 단량체 중10 내지 80중량%로 포함되는 것임을 특징으로 하는 공중합체.
- 제 1항에 있어서, 중량 평균 분자량이2,000 ~ 1,000,000인 것임을 특징으로 하는 공중합체.
- 상기 화학식 1로 표시되는 공중합체 중 선택된 적어도1종 이상의 중합체, 산발생제, 중합개시제 및 유기용매를 포함하는 화학증폭형 포토레지스트 조성물.
- 제 4항에 있어서, 산발생제는 하기 화학식4및 5로 표시되는 화합물 중에서 선택된 1종 이상의 화합물인 것임을 특징으로 하는 화학증폭형 포토레지스트 조성 물.화학식4 화학식 5상기 화학식4및 5에서 R1과 R2는 알킬기, 아릴기, 퍼플루오로알킬기, 벤질기, 또는 알릴기를 나타내며 각각 독립적이고 R3, R4 그리고 R5는 수소, 알킬기, 할로겐기, 알콕시기, 아릴기, 사이오펜옥시기(thiophenoxy), 사이오알콕시기 (thioalkoxy), 또는 알콕시카르보닐메톡시기 (alkoxycarbonylmethoxy)를 나타내며 각각 독립적이고, A는 OSO2CF3, OSO2C4F9, OSO2C8F17, N(SO2CF3)2, N(SO2C2F5)2, N(SO2C4F9)2, C(SO2CF3)2, C(SO2C2F5)2 또는 C(SO2C4F9)2를 나타낸다.
- 제4항에 있어서, 산발생제는 중합체 전체 고형분 함량 100 중량부에 대해 0.3중량부 내지 10 중량부로 포함되는 것임을 특징으로 하는 화학증폭형 포토레지스트 조성물.
- 제 4항에 있어서, 상기 중합 개시제는 아조비스이소부티로니트릴 (AIBN), 벤조일 퍼옥시드 (BPO), 라우릴 퍼옥시드, 아조비스이소카프로니트릴, 아조비스이소발레로니트릴 및 t-부틸 히드로 퍼옥시드로 이루어진 군으로부터 선택된1종 이상의 화합물인 것을 특징으로 하는 화학증폭형 포토레지스트 조성물.
- 제 4항에 있어서, 상기 유기 용매는 포토레지스트 중합체 100중량부에 대해 200내지 2000 중량부로 포함되는 것임을 특징으로 하는 화학증폭형 포토레지스트 조성물.
- 제 4항에 있어서, 상기 유기용매는 에틸렌글리콜 모노메틸 에테르, 에틸렌글리콜 모노에틸 에테르, 에틸렌글리콜 모노프로필 에테르, 메틸셀로솔브 아세테이트, 에틸셀로솔브 아세테이트, 프로필렌글리콜 모노메틸 에테르 아세테이트, 프로필렌글리콜 모노에틸 에테르 아세테이트, 프로필렌글리콜 모노프로필 에테르 아세테이트, 메틸 이소프로필 케톤, 시클로헥사논, 메틸 2-히드록시프로피온네이트, 에틸 2-히드록시프로피온네이트, 2-헵타논, 에틸 락테이트 및 γ-부티로락톤 으로 이루어진 그룹으로부터 선택된1종 이상의 화합물인 것을 특징으로 하는 화학증폭형 포토레지스트 조성물.
- i) 제 4항의 조성물을 기판에 적용하여 코팅을 형성하는 단계;ii) 코팅을 열처리하는 단계; 및iii) KrF 엑시머 레이저, ArF 엑시머 레이저, X-레이 및 e-빔 조사(irradiation) 중에서 선택된 것으로 조사하는 단계를 포함하는 화학증폭형 포토레지스트의 패턴형성방법.
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| KR1020070001347A KR20080064430A (ko) | 2007-01-05 | 2007-01-05 | 말레익언하이드라이드 유도체와 (메트)아크릴 화합물의중합체 및 이를 포함하는 화학증폭형 포토레지스트 조성물 |
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| KR1020070001347A KR20080064430A (ko) | 2007-01-05 | 2007-01-05 | 말레익언하이드라이드 유도체와 (메트)아크릴 화합물의중합체 및 이를 포함하는 화학증폭형 포토레지스트 조성물 |
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| KR20130074831A (ko) * | 2011-12-23 | 2013-07-05 | 금호석유화학 주식회사 | 미세패턴 형성용 수용성 수지 조성물 및 이를 이용한 미세패턴의 형성방법 |
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| KR20130074831A (ko) * | 2011-12-23 | 2013-07-05 | 금호석유화학 주식회사 | 미세패턴 형성용 수용성 수지 조성물 및 이를 이용한 미세패턴의 형성방법 |
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