KR20130103554A - 실린더의 종축을 중심으로 가공 헤드가 선회되는, 가요성 스트립에 각인하기 위한 방법 및 장치 - Google Patents
실린더의 종축을 중심으로 가공 헤드가 선회되는, 가요성 스트립에 각인하기 위한 방법 및 장치 Download PDFInfo
- Publication number
- KR20130103554A KR20130103554A KR1020137012620A KR20137012620A KR20130103554A KR 20130103554 A KR20130103554 A KR 20130103554A KR 1020137012620 A KR1020137012620 A KR 1020137012620A KR 20137012620 A KR20137012620 A KR 20137012620A KR 20130103554 A KR20130103554 A KR 20130103554A
- Authority
- KR
- South Korea
- Prior art keywords
- cylinder
- strip
- support surface
- longitudinal axis
- machining head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/24—Ablative recording, e.g. by burning marks; Spark recording
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
- B23K26/0676—Dividing the beam into multiple beams, e.g. multi-focusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
- B23K26/0846—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt for moving elongated workpieces longitudinally, e.g. wire or strip material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F17/00—Printing apparatus or machines of special types or for particular purposes, not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F17/00—Printing apparatus or machines of special types or for particular purposes, not otherwise provided for
- B41F17/08—Printing apparatus or machines of special types or for particular purposes, not otherwise provided for for printing on filamentary or elongated articles, or on articles with cylindrical surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
- H10K30/80—Constructional details
- H10K30/81—Electrodes
- H10K30/82—Transparent electrodes, e.g. indium tin oxide [ITO] electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/621—Providing a shape to conductive layers, e.g. patterning or selective deposition
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/16—Bands or sheets of indefinite length
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Electromagnetism (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
도 2는 본 발명에 따른 장치의 정면도이다.
도 3a는 본 발명에 따른 장치로 각인할 수 있는 패턴에 관한 도면이다.
도 3b는 패턴의 상세도이다.
2 실린더
3 지지면
4 스트립
5 가공 헤드
6 공구
7 폭
8 롤러
9 가이드 롤러
10 원주 방향
11 가이드 롤러
12 롤러
13 직경
14 폭
15 종축
16 표면
17 방사 방향
18 종방향
19 미러
20 입사각
21 수직선
22 패턴
23 블록
24 제1 가로 라인
25 제2 가로 라인
26 제3 가로 라인
27 제1 세로 라인
28 제2 세로 라인
29 전진 이송 방향
a - k 지점들
Claims (7)
- 가요성 스트립(4)에 각인하는 방법으로서, 상기 방법에서 스트립(4)은 스트립(4)의 종방향으로 이동하며, 이때 지지면(3)으로서의 실린더(2) 표면 세그먼트 상에서 실린더(2)의 원주 방향(10)으로 안내되고, 가공 헤드(5)로부터 지지면(3)을 향하는 하나 이상의 공구(6)에 의해 각인되는, 가요성 스트립에 각인하는 방법에 있어서,
가공 헤드(5)는 지지면(3) 위쪽에서 실린더(2)의 종축(15)을 중심으로 선회되는 것을 특징으로 하는, 가요성 스트립에 각인하는 방법. - 제1항에 있어서, 하나 이상의 공구(6)는 레이저 빔인 것을 특징으로 하는, 가요성 스트립에 각인하는 방법.
- 제2항에 있어서, 레이저 빔은 먼저 실린더(2)의 종축(15)에서 안내되고, 그 후 방사 방향(17)으로, 그 다음에 실린더(2)의 종방향(18)으로 안내되며, 가공 헤드(5)에서 지지면(3) 쪽으로 편향되는 것을 특징으로 하는, 가요성 스트립에 각인하는 방법.
- 제2항 또는 제3항에 있어서, 복수의 레이저 빔이 가공 헤드(5)에서 분할되어 지지면(3) 상으로 평행하게 배향되는 것을 특징으로 하는, 가요성 스트립에 각인하는 방법.
- 스트립(4)의 종방향으로 스트립(4)을 이동시키는 전진 이송 장치와, 지지면(3)으로서의 실린더(2) 표면 세그먼트 상에서 실린더(2)의 원주 방향(10)으로 스트립(4)을 안내하는 안내 장치와, 지지면(3)을 향하는 하나 이상의 공구(6)를 이용하여 스트립(4)에 각인하기 위한, 지지면(3)을 향하는 가공 헤드(5)와, 가공 헤드(5)를 움직이기 위한 구동 장치를 포함하는, 가요성 스트립에 각인하는 장치(1)에 있어서,
가공 헤드(5)는 구동 장치에 의해 실린더(2)의 종축(15)을 중심으로 선회될 수 있는 것을 특징으로 하는, 가요성 스트립에 각인하는 장치. - 제5항에 있어서, 실린더(2)는 장치(1)에서 실린더(2)의 종축(15)을 중심으로 회전가능하게 지지되는 것을 특징으로 하는, 가요성 스트립에 각인하는 장치.
- 제5항 또는 제6항에 있어서, 하나 이상의 공구(6)는 지지면(3)으로의 수직선(21)에 대해 30 내지 60°의 입사각(20)만큼 스트립(4)의 전진 이송 방향 반대 방향으로 정렬되는 것을 특징으로 하는, 가요성 스트립에 각인하는 장치.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102010038259A DE102010038259B4 (de) | 2010-10-19 | 2010-10-19 | Verfahren und Vorrichtung zum Gravieren eines flexiblen Bands |
| DE102010038259.0 | 2010-10-19 | ||
| PCT/EP2011/066325 WO2012052241A1 (de) | 2010-10-19 | 2011-09-20 | Verfahren und vorrichtung zum gravieren eines flexiblen bands mit schwenkung des bearbeitungskopfes um eine längsachse eines zylinders |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20130103554A true KR20130103554A (ko) | 2013-09-23 |
Family
ID=44653338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020137012620A Ceased KR20130103554A (ko) | 2010-10-19 | 2011-09-20 | 실린더의 종축을 중심으로 가공 헤드가 선회되는, 가요성 스트립에 각인하기 위한 방법 및 장치 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9132509B2 (ko) |
| JP (1) | JP5763201B2 (ko) |
| KR (1) | KR20130103554A (ko) |
| CN (1) | CN103228395B (ko) |
| DE (1) | DE102010038259B4 (ko) |
| WO (1) | WO2012052241A1 (ko) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104669909B (zh) * | 2014-12-31 | 2017-01-11 | 山东晨灿机械设备股份有限公司 | 雕刻摇摆头 |
| WO2016116168A1 (en) * | 2015-01-23 | 2016-07-28 | Hewlett-Packard Indigo B.V. | A roller arrangement, forming a pattern, and printing a pattern |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| LU80792A1 (fr) * | 1979-01-15 | 1980-08-08 | Ntre De Rech Metallurg Ct Voor | Dispsitif et procede pour effectuer des perforations a la surface des cylindres de laminoirs |
| JPS60177985A (ja) * | 1984-02-24 | 1985-09-11 | Agency Of Ind Science & Technol | レ−ザ加工装置 |
| US5967394A (en) * | 1994-11-04 | 1999-10-19 | Roll Systems, Inc. | Method and apparatus for pinless feeding of web to a utilization device |
| JP3210251B2 (ja) * | 1996-07-09 | 2001-09-17 | シャープ株式会社 | レーザーパターニング装置 |
| JP2001265414A (ja) * | 2000-03-15 | 2001-09-28 | Yamanashi Prefecture | 球形状等立体形状物の加工方法及び加工装置 |
| CN1140376C (zh) * | 2001-02-28 | 2004-03-03 | 广州市镭密加激光科技有限公司 | Yag激光雕刻陶瓷网纹辊的方法 |
| JP3956200B2 (ja) * | 2002-05-17 | 2007-08-08 | 富士電機ホールディングス株式会社 | 薄膜のレーザ加工方法および装置 |
| US6794604B2 (en) * | 2003-02-19 | 2004-09-21 | Preco Laser Systems, Llc | Web securing system for laser processing |
| JP4288091B2 (ja) * | 2003-03-27 | 2009-07-01 | 株式会社アマダ | 板材加工装置及び板材加工方法 |
| TWI310326B (en) * | 2005-10-11 | 2009-06-01 | Gsi Group Corp | Optical metrological scale and laser-based manufacturing method therefor |
| JP5202876B2 (ja) * | 2007-06-06 | 2013-06-05 | 日東電工株式会社 | レーザー加工方法及びレーザー加工品 |
| DE102007034644A1 (de) * | 2007-07-23 | 2009-01-29 | Thüringisches Institut für Textil- und Kunststoff-Forschung e.V. | Verfahren und Vorrichtung zur Laserstrukturierung von Solarzellen |
| US8420979B2 (en) * | 2007-07-24 | 2013-04-16 | Flisom Ag | Method and apparatus for laser beam processing of an element with total transmission for light of a t least 10-5 |
| JP2010165879A (ja) * | 2009-01-16 | 2010-07-29 | Fujifilm Corp | スクライブ加工装置、及びスクライブ加工方法 |
| GB2467296B (en) * | 2009-01-22 | 2012-06-20 | Cav Advanced Technologies Ltd | Apparatus and method for perforating material |
| GB2482868A (en) | 2010-08-16 | 2012-02-22 | Franciscus Wilhelmus Henricus Maria Merkus | A testosterone liquid spray formulation for oromucosal administration |
-
2010
- 2010-10-19 DE DE102010038259A patent/DE102010038259B4/de not_active Expired - Fee Related
-
2011
- 2011-09-20 WO PCT/EP2011/066325 patent/WO2012052241A1/de not_active Ceased
- 2011-09-20 JP JP2013534228A patent/JP5763201B2/ja not_active Expired - Fee Related
- 2011-09-20 CN CN201180050324.0A patent/CN103228395B/zh not_active Expired - Fee Related
- 2011-09-20 KR KR1020137012620A patent/KR20130103554A/ko not_active Ceased
-
2013
- 2013-04-18 US US13/865,263 patent/US9132509B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| DE102010038259B4 (de) | 2013-02-07 |
| DE102010038259A1 (de) | 2012-04-19 |
| CN103228395A (zh) | 2013-07-31 |
| CN103228395B (zh) | 2017-07-07 |
| JP2013541421A (ja) | 2013-11-14 |
| JP5763201B2 (ja) | 2015-08-12 |
| WO2012052241A1 (de) | 2012-04-26 |
| US20140144894A1 (en) | 2014-05-29 |
| US9132509B2 (en) | 2015-09-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5439593B2 (ja) | 弾性的に変形可能なガラス板を製造する方法及び装置 | |
| US12509384B2 (en) | Substrate processing station for laser-based machining of sheet-like glass substrates | |
| US9029731B2 (en) | Methods and systems for laser processing continuously moving sheet material | |
| EP3405306B1 (en) | Laser texturing of steel strip | |
| US20180118602A1 (en) | Glass sheet transfer apparatuses for laser-based machining of sheet-like glass substrates | |
| JP5748780B2 (ja) | ストリップ及び/又はシートを連続的に溶接するための装置及び方法 | |
| US6794604B2 (en) | Web securing system for laser processing | |
| CN101990480A (zh) | 激光刻划平台与杂合书写策略 | |
| WO2010042810A2 (en) | Laser machining systems and methods with vision correction and/or tracking | |
| TWI456780B (zh) | 對準太陽板刻劃之雷射光束之方法與裝置 | |
| WO2007125799A1 (ja) | レーザ加工方法及び装置 | |
| US20160158885A1 (en) | Laser-Based Marking Method and Apparatus | |
| JP2010075995A (ja) | ビーム加工装置、ビーム加工方法およびビーム加工基板 | |
| US8129658B2 (en) | Systems for thin film laser scribing devices | |
| KR20130103554A (ko) | 실린더의 종축을 중심으로 가공 헤드가 선회되는, 가요성 스트립에 각인하기 위한 방법 및 장치 | |
| JP2010155278A (ja) | ビーム加工装置、ビーム加工方法およびビーム加工基板 | |
| Abbott et al. | New techniques for laser micromachining MEMS devices | |
| KR20190041133A (ko) | 레이저와 분말을 이용한 3차원 형상 제조방법 | |
| Yang et al. | Batch patterning micro circuits and sensors with excimer laser machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| A201 | Request for examination | ||
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
St.27 status event code: N-2-6-B10-B15-exm-PE0601 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |
|
| R18 | Changes to party contact information recorded |
Free format text: ST27 STATUS EVENT CODE: A-3-3-R10-R18-OTH-X000 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |