KR20150004355A - 투명 도전성 잉크 및 투명 도전 패턴형성방법 - Google Patents
투명 도전성 잉크 및 투명 도전 패턴형성방법 Download PDFInfo
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- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
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Abstract
(해결 수단) 금속 나노 와이어와 금속 나노 튜브 중 적어도 일방을 분자량의 범위가 150∼500인 유기 화합물을 포함하고, 또한 25℃에 있어서의 점도가 1.0×103∼2.0×106mPa·s인 형상 유지재를 갖는 분산매에 분산시킨 투명 도전성 잉크로 하고, 이 투명 도전성 잉크를 사용해서 기판 상에 임의의 형상의 패턴을 인쇄하고, 가열 처리해서 건조시키고, 건조 후의 패턴에 펄스 광을 조사해서 투명 도전성 패턴을 형성한다.
Description
도 2는 실시예에서 제작한 은 나노 와이어의 SEM상을 나타내는 도면이다.
도 3은 실시예에서 제작한 투명 도전 패턴을 나타내는 도면이다.
Claims (8)
- 금속 나노 와이어와 금속 나노 튜브 중 적어도 일방과, 분자량의 범위가 150∼500인 유기 화합물을 포함하고, 또한 25℃에 있어서의 점도가 1.0×103∼2.0×106mPa·s인 형상 유지재를 갖는 분산매를 포함하는 것을 특징으로 하는 투명 도전성 잉크.
- 제 1 항에 있어서,
상기 형상 유지재에 포함되는 유기 화합물은 단당류, 폴리올, 4급 알킬기 또는 가교 환 골격을 갖는 알킬기 및 수산기를 갖는 화합물 중 어느 하나인 것을 특징으로 하는 투명 도전성 잉크. - 제 2 항에 있어서,
상기 형상 유지재에 포함되는 유기 화합물은 디글리세린, 2,2,4-트리메틸-1.3-펜탄디올모노이소부티레이트, 2,2,4-트리메틸-1.3-펜탄디올디이소부티레이트, 크실로오스, 리불로오스, 보르닐시클로헥산올 또는 보르닐페놀, 이소보르닐시클로헥산올, 이소보르닐페놀 중 어느 하나인 것을 특징으로 하는 투명 도전성 잉크. - 제 1 항 내지 제 3 항 중 어느 한 항에 있어서,
상기 분산매는 형상 유지재의 점도를 조제하는 점도 조정 용매를 더 포함하는 것을 특징으로 하는 투명 도전성 잉크. - 제 4 항에 있어서,
상기 점도 조정 용매는 물, 알콜, 케톤, 에테르, 탄화수소계 용제 및 방향족계 용제 중 어느 하나인 것을 특징으로 하는 투명 도전성 잉크. - 제 5 항에 있어서,
상기 점도 조정 용매는 테르피네올인 것을 특징으로 하는 투명 도전성 잉크. - 제 1 항 내지 제 6 항 중 어느 한 항에 있어서,
투명 도전성 잉크 총질량에 대하여, 금속 나노 와이어 또는 금속 나노 튜브가 0.01∼10질량%의 양이고, 형상 유지재의 함유량이 분산매 총질량에 대하여 10∼90질량%인 것을 특징으로 하는 투명 도전성 잉크. - 제 1 항 내지 제 7 항 중 어느 한 항에 기재된 투명 도전성 잉크에 의해 기판 상에 임의의 형상의 패턴을 인쇄하는 공정과,
상기 패턴을 가열 처리해서 건조시키는 공정과,
상기 건조 후의 패턴에 펄스 광을 조사하는 공정 또는 프레스 공정을 포함하는 것을 특징으로 하는 투명 도전 패턴형성방법.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012101049 | 2012-04-26 | ||
| JPJP-P-2012-101049 | 2012-04-26 | ||
| PCT/JP2013/062387 WO2013161996A2 (ja) | 2012-04-26 | 2013-04-26 | 透明導電性インク及び透明導電パターン形成方法 |
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| Publication Number | Publication Date |
|---|---|
| KR20150004355A true KR20150004355A (ko) | 2015-01-12 |
| KR101570398B1 KR101570398B1 (ko) | 2015-11-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| KR1020147029936A Expired - Fee Related KR101570398B1 (ko) | 2012-04-26 | 2013-04-26 | 투명 도전성 잉크 및 투명 도전 패턴형성방법 |
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| Country | Link |
|---|---|
| US (1) | US9236162B2 (ko) |
| EP (1) | EP2843667B1 (ko) |
| JP (1) | JP5706998B2 (ko) |
| KR (1) | KR101570398B1 (ko) |
| CN (1) | CN104303238B (ko) |
| TW (1) | TWI499647B (ko) |
| WO (1) | WO2013161996A2 (ko) |
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| KR20180121639A (ko) * | 2016-05-31 | 2018-11-07 | 쇼와 덴코 가부시키가이샤 | 투명 도전 패턴의 형성 방법 |
| KR20180121638A (ko) * | 2016-05-31 | 2018-11-07 | 쇼와 덴코 가부시키가이샤 | 투명 도전 패턴의 형성 방법 |
| KR20180122002A (ko) * | 2016-05-02 | 2018-11-09 | 데쿠세리아루즈 가부시키가이샤 | 이방성 도전 필름의 제조 방법 및 이방성 도전 필름 |
| KR20210048602A (ko) * | 2016-05-02 | 2021-05-03 | 데쿠세리아루즈 가부시키가이샤 | 이방성 도전 필름의 제조 방법 및 이방성 도전 필름 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102026165B1 (ko) * | 2013-04-26 | 2019-09-27 | 쇼와 덴코 가부시키가이샤 | 도전 패턴의 제조방법 및 도전 패턴 형성 기판 |
| DE102013104577B3 (de) * | 2013-05-03 | 2014-07-24 | Heraeus Noblelight Gmbh | Vorrichtung zum Trocknen und Sintern metallhaltiger Tinte auf einem Substrat |
| JP6592363B2 (ja) * | 2013-10-31 | 2019-10-16 | 昭和電工株式会社 | 薄膜印刷用導電性組成物及び薄膜導電パターン形成方法 |
| WO2015109464A1 (en) * | 2014-01-22 | 2015-07-30 | Nuovo Film Inc. | Transparent conductive electrodes comprising merged metal nanowires, their structure design, and method of making such structures |
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| KR101595895B1 (ko) * | 2014-08-11 | 2016-02-19 | 주식회사 엔앤비 | 광소결로 접합된 은 나노와이어를 포함하는 투명전극용 필름, 광소결을 이용한 은 나노와이어 접합용 분산액 및 은 나노와이어의 접합 방법 |
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| US20160164171A1 (en) * | 2014-12-04 | 2016-06-09 | Chung-Ping Lai | Wireless antenna made from binder-free conductive carbon inks |
| JP6407014B2 (ja) * | 2014-12-24 | 2018-10-17 | 昭和電工株式会社 | 薄膜印刷用導電性組成物及び薄膜導電パターン形成方法 |
| KR20170130515A (ko) * | 2015-03-25 | 2017-11-28 | 스트라타시스 엘티디. | 전도성 잉크의 인 시츄 소결을 위한 방법 및 시스템 |
| KR102555869B1 (ko) * | 2015-08-06 | 2023-07-13 | 삼성전자주식회사 | 도전체 및 그 제조 방법 |
| US10862062B2 (en) | 2016-05-23 | 2020-12-08 | Konica Minolta Laboratory U.S.A., Inc. | Method of forming transparent correlated metal electrode |
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| WO2018108760A1 (en) * | 2016-12-13 | 2018-06-21 | Merck Patent Gmbh | Formulation of an organic functional material |
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| KR102461794B1 (ko) * | 2020-08-13 | 2022-11-02 | 한국과학기술연구원 | 은 나노와이어 메쉬 전극 및 이의 제조방법 |
| CN111883286A (zh) * | 2020-08-25 | 2020-11-03 | 深圳先进电子材料国际创新研究院 | 一种透明导电膜的制备方法及透明导电膜 |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH077675B2 (ja) | 1986-10-27 | 1995-01-30 | 株式会社荏原製作所 | レドツクスフロ−形電池の水溶液に蓄熱し、該熱を熱源として使用する方法 |
| JPH06139814A (ja) * | 1992-10-26 | 1994-05-20 | Hitachi Ltd | 導体ペースト |
| JP2003100147A (ja) | 2001-09-25 | 2003-04-04 | Nagase & Co Ltd | カーボンナノチューブを含有する導電性材料およびその製造方法 |
| JP4077675B2 (ja) | 2002-07-26 | 2008-04-16 | ナガセケムテックス株式会社 | ポリ(3,4−ジアルコキシチオフェン)とポリ陰イオンとの複合体の水分散体およびその製造方法 |
| US7303854B2 (en) | 2003-02-14 | 2007-12-04 | E.I. Du Pont De Nemours And Company | Electrode-forming composition for field emission type of display device, and method using such a composition |
| JP5108239B2 (ja) | 2005-03-09 | 2012-12-26 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | 黒色導電性組成物、黒色電極、およびその形成方法 |
| US7569165B2 (en) | 2005-03-09 | 2009-08-04 | E. I. Du Pont De Nemours And Company | Black conductive compositions, black electrodes, and methods of forming thereof |
| SG150514A1 (en) | 2005-08-12 | 2009-03-30 | Cambrios Technologies Corp | Nanowires-based transparent conductors |
| TWI397446B (zh) | 2006-06-21 | 2013-06-01 | Cambrios Technologies Corp | 控制奈米結構形成及形狀之方法 |
| CN101589473B (zh) | 2006-10-12 | 2011-10-05 | 凯博瑞奥斯技术公司 | 基于纳米线的透明导体及其应用 |
| TWI556456B (zh) * | 2007-04-20 | 2016-11-01 | 坎畢歐科技公司 | 複合透明導體及形成其之方法 |
| JP2009140788A (ja) | 2007-12-07 | 2009-06-25 | Konica Minolta Holdings Inc | 導電材料、それを用いたインクジェットインク及び透明導電性フィルム |
| ATE524530T1 (de) * | 2008-01-30 | 2011-09-15 | Dow Corning | Verwendung von glasartigen siliconbasierten hartbeschichtungen als trennbeschichtungen für druckbare elektronik |
| KR101225909B1 (ko) | 2008-08-07 | 2013-01-24 | 교토 에렉스 가부시키가이샤 | 태양전지소자의 전극형성용 도전성 페이스트, 태양전지소자 및 그 태양전지소자의 제조방법 |
| JP2010073322A (ja) | 2008-09-16 | 2010-04-02 | Konica Minolta Holdings Inc | 透明電極とその製造方法及びそれを用いた有機エレクトロルミネッセンス素子 |
| JP2010165900A (ja) | 2009-01-16 | 2010-07-29 | Dic Corp | 透明電極の製造方法、透明電極及びそれに用いる導電インキ及び撥液性透明絶縁インキ |
| KR20100109416A (ko) * | 2009-03-31 | 2010-10-08 | 디아이씨 가부시끼가이샤 | 도전성 페이스트 조성물 및 그 제조 방법 |
| JP5507898B2 (ja) | 2009-06-15 | 2014-05-28 | パナソニック株式会社 | 透明導電パターンの製造方法及び透明導電パターン付き基材 |
| JP2011060752A (ja) | 2009-08-12 | 2011-03-24 | Nippon Kineki Kk | 導電性ペースト組成物 |
| JP2011070968A (ja) | 2009-09-25 | 2011-04-07 | Panasonic Electric Works Co Ltd | 導電性ペースト及び導体パターン |
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| JP2012009383A (ja) | 2010-06-28 | 2012-01-12 | Jnc Corp | 塗膜形成用組成物、該組成物から得られるパターニングされた透明導電膜を有する基板の製造方法および該製造物の用途 |
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| TW201339279A (zh) * | 2011-11-24 | 2013-10-01 | Showa Denko Kk | 導電圖型形成方法及藉由光照射或微波加熱的導電圖型形成用組成物 |
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| JPWO2013161997A1 (ja) * | 2012-04-26 | 2015-12-24 | 国立大学法人大阪大学 | 透明導電基板の製造方法、透明導電基板及び静電容量式タッチパネル |
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2013
- 2013-04-26 JP JP2014512709A patent/JP5706998B2/ja not_active Expired - Fee Related
- 2013-04-26 KR KR1020147029936A patent/KR101570398B1/ko not_active Expired - Fee Related
- 2013-04-26 EP EP13782608.7A patent/EP2843667B1/en not_active Not-in-force
- 2013-04-26 TW TW102115035A patent/TWI499647B/zh not_active IP Right Cessation
- 2013-04-26 CN CN201380021843.3A patent/CN104303238B/zh not_active Expired - Fee Related
- 2013-04-26 US US14/396,853 patent/US9236162B2/en active Active
- 2013-04-26 WO PCT/JP2013/062387 patent/WO2013161996A2/ja not_active Ceased
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017159973A3 (ko) * | 2016-03-18 | 2018-03-08 | 한국과학기술원 | 빛을 이용한 박막 제조방법 |
| KR20180122002A (ko) * | 2016-05-02 | 2018-11-09 | 데쿠세리아루즈 가부시키가이샤 | 이방성 도전 필름의 제조 방법 및 이방성 도전 필름 |
| KR20210048602A (ko) * | 2016-05-02 | 2021-05-03 | 데쿠세리아루즈 가부시키가이샤 | 이방성 도전 필름의 제조 방법 및 이방성 도전 필름 |
| KR20180121639A (ko) * | 2016-05-31 | 2018-11-07 | 쇼와 덴코 가부시키가이샤 | 투명 도전 패턴의 형성 방법 |
| KR20180121638A (ko) * | 2016-05-31 | 2018-11-07 | 쇼와 덴코 가부시키가이샤 | 투명 도전 패턴의 형성 방법 |
| CN109074917A (zh) * | 2016-05-31 | 2018-12-21 | 昭和电工株式会社 | 透明导电图案的形成方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2013161996A1 (ja) | 2015-12-24 |
| TW201410801A (zh) | 2014-03-16 |
| CN104303238B (zh) | 2016-11-09 |
| WO2013161996A3 (ja) | 2013-12-19 |
| WO2013161996A2 (ja) | 2013-10-31 |
| JP5706998B2 (ja) | 2015-04-22 |
| EP2843667A2 (en) | 2015-03-04 |
| KR101570398B1 (ko) | 2015-11-19 |
| US20150056382A1 (en) | 2015-02-26 |
| US9236162B2 (en) | 2016-01-12 |
| TWI499647B (zh) | 2015-09-11 |
| CN104303238A (zh) | 2015-01-21 |
| EP2843667B1 (en) | 2017-09-06 |
| EP2843667A4 (en) | 2015-10-21 |
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