KR20170040366A - 터널 유전체층을 갖는 태양 전지의 제조 방법 - Google Patents
터널 유전체층을 갖는 태양 전지의 제조 방법 Download PDFInfo
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Abstract
Description
도 2는 본 발명의 실시양태에 따른, 터널 유전체층을 갖는 태양 전지의 제조 방법에서의 작업을 나타내는 흐름도를 도시한다.
도 3a는 본 발명의 실시양태에 따른, 터널 유전체층을 포함하는 태양 전지 제조에서의 한 단계의 단면도를 도시한다.
도 3b는 본 발명의 실시양태에 따른, 도 2의 흐름도의 작업 202 및 도 4의 흐름도의 작업 402에 대응하는, 터널 유전체층을 포함하는 태양 전지 제조에서의 한 단계의 단면도를 도시한다.
도 3c는 본 발명의 실시양태에 따른, 도 2의 흐름도의 작업 204 및 도 4의 흐름도의 작업 404에 대응하는, 터널 유전체층을 포함하는 태양 전지 제조에서의 한 단계의 단면도를 도시한다.
도 4는 본 발명의 실시양태에 따른, 터널 유전체층을 갖는 태양 전지의 제조 방법에서의 작업을 나타내는 흐름도를 도시한다.
도 5a는 본 발명의 실시양태에 따른, 조합된 수성 및 열 성장 작업 후의 터널 산화물 두께의 좌표를 도시한다.
도 5b는 본 발명의 실시양태에 따른, 조합된 수성 및 열 성장 작업 후의 산화물 두께의 표준 편차의 좌표를 도시한다.
도 6a는 본 발명의 실시양태에 따른, 터널 유전체층의 수성 필름 성분의 두께의 함수로서 소수 캐리어 수명(minority carrier lifetime)의 좌표를 도시한다.
도 6b는 본 발명의 실시양태에 따른, 수성 가공과 열 가공의 조합으로부터 산화물이 형성된 웨이퍼의 광발광 수명 결과를 도시한다.
Claims (20)
- 태양 전지의 제조 방법이며,
기판에 배치된 표면 산화물층을 제1 온도에서 열적 산화에 의해 형성하는 단계와,
표면 산화물층을 섭씨 500도 미만의 온도로부터 섭씨 500도를 초과하는 제2 온도까지 가열하는 단계를 포함하고,
제1 온도와 제2 온도는 대략 동일한,
태양 전지의 제조 방법. - 제1항에 있어서, 제1 온도 및 제2 온도는 대략 섭씨 565도인, 태양 전지의 제조 방법.
- 제1항에 있어서, 표면 산화물층은 저압 열적 산화 공정에 의해 형성되는, 태양 전지의 제조 방법.
- 제1항에 있어서, 저압 열적 산화 공정은 산소(O2)를 포함하는 분위기에서 수행되는, 태양 전지의 제조 방법.
- 제1항에 있어서, 가열하는 단계 동안에 폴리실리콘층을 형성하는 단계를 더 포함하는, 태양 전지의 제조 방법.
- 제5항에 있어서, 폴리실리콘층 위에 금속 접촉부를 형성하는 단계를 더 포함하는, 태양 전지의 제조 방법.
- 제1항에 있어서, 기판은 규소를 포함하고, 산화물층은 규소 산화물을 포함하는, 태양 전지의 제조 방법.
- 태양 전지의 제조 방법이며,
기판의 표면 산화물층을 제공하기 위해 태양 전지의 기판의 일부를 소모하는 단계와,
표면 산화물층을 섭씨 500도 미만의 온도로부터 섭씨 500도를 초과하는 온도까지 가열하는 단계를 포함하고,
소모하는 단계는 기판을 습윤 화학 용액에 노출시키는 단계를 포함하는,
태양 전지의 제조 방법. - 제8항에 있어서, 표면 산화물층을 섭씨 500도를 초과하는 온도까지 가열하는 단계 다음에 섭씨 500도 미만의 온도까지 다시 냉각하는 단계를 포함하는, 태양 전지의 제조 방법.
- 제8항에 있어서, 표면 산화물층을 섭씨 500도를 초과하는 온도까지 가열하는 단계는 대략 섭씨 565도의 온도까지 가열하는 단계를 포함하는, 태양 전지의 제조 방법.
- 제8항에 있어서, 습윤 화학 용액은 오존(O3) 및 과산화수소(H2O2)로 이루어지는 군으로부터 선택되는 산화제를 포함하는, 태양 전지의 제조 방법.
- 제8항에 있어서, 기판은 규소를 포함하고, 산화물층은 규소 산화물을 포함하는, 태양 전지의 제조 방법.
- 제8항에 있어서, 가열하는 단계 동안에 폴리실리콘층을 형성하는 단계를 더 포함하는, 태양 전지의 제조 방법.
- 제13항에 있어서, 폴리실리콘층 위에 금속 접촉부를 형성하는 단계를 더 포함하는, 태양 전지의 제조 방법.
- 태양 전지의 제조 방법이며,
기판의 표면 산화물층을 제공하기 위해 태양 전지의 기판의 일부를 소모하는 단계와,
표면 산화물층을 섭씨 500도 미만의 온도로부터 섭씨 500도를 초과하는 온도까지 가열하는 단계를 포함하고,
소모하는 단계는 열적 산화 공정을 수행하는 단계를 포함하는,
태양 전지의 제조 방법. - 제15항에 있어서, 표면 산화물층을 섭씨 500도를 초과하는 온도까지 가열하는 단계 다음에 섭씨 500도 미만의 온도까지 다시 냉각하는 단계를 포함하는, 태양 전지의 제조 방법.
- 제15항에 있어서, 표면 산화물층은 저압 열적 산화 공정에 의해 형성되는, 태양 전지의 제조 방법.
- 제15항에 있어서, 저압 열적 산화 공정은 산소(O2)를 포함하는 분위기에서 수행되는, 태양 전지의 제조 방법.
- 제15항에 있어서, 가열하는 단계 동안에 폴리실리콘층을 형성하는 단계를 더 포함하는, 태양 전지의 제조 방법.
- 제19항에 있어서, 폴리실리콘층 위에 금속 접촉부를 형성하는 단계를 더 포함하는, 태양 전지의 제조 방법.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/829,922 | 2010-07-02 | ||
| US12/829,922 US8334161B2 (en) | 2010-07-02 | 2010-07-02 | Method of fabricating a solar cell with a tunnel dielectric layer |
| PCT/US2011/034089 WO2012003038A2 (en) | 2010-07-02 | 2011-04-27 | Method of fabricating a solar cell with a tunnel dielectric layer |
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| Application Number | Title | Priority Date | Filing Date |
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| KR1020127034311A Division KR101758952B1 (ko) | 2010-07-02 | 2011-04-27 | 터널 유전체층을 갖는 태양 전지의 제조 방법 |
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| KR1020187001328A Division KR102100065B1 (ko) | 2010-07-02 | 2011-04-27 | 터널 유전체층을 갖는 태양 전지의 제조 방법 |
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| KR20170040366A true KR20170040366A (ko) | 2017-04-12 |
| KR102007102B1 KR102007102B1 (ko) | 2019-08-02 |
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| KR1020177008710A Active KR102007102B1 (ko) | 2010-07-02 | 2011-04-27 | 터널 유전체층을 갖는 태양 전지의 제조 방법 |
| KR1020187001328A Active KR102100065B1 (ko) | 2010-07-02 | 2011-04-27 | 터널 유전체층을 갖는 태양 전지의 제조 방법 |
| KR1020127034311A Active KR101758952B1 (ko) | 2010-07-02 | 2011-04-27 | 터널 유전체층을 갖는 태양 전지의 제조 방법 |
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| KR1020127034311A Active KR101758952B1 (ko) | 2010-07-02 | 2011-04-27 | 터널 유전체층을 갖는 태양 전지의 제조 방법 |
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| US (4) | US8334161B2 (ko) |
| EP (1) | EP2589087A4 (ko) |
| JP (4) | JP5825692B2 (ko) |
| KR (3) | KR102007102B1 (ko) |
| CN (2) | CN102959731B (ko) |
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| US8334161B2 (en) * | 2010-07-02 | 2012-12-18 | Sunpower Corporation | Method of fabricating a solar cell with a tunnel dielectric layer |
| CN109599450A (zh) | 2013-04-03 | 2019-04-09 | Lg电子株式会社 | 太阳能电池 |
| KR102132740B1 (ko) * | 2013-10-21 | 2020-07-10 | 엘지전자 주식회사 | 태양 전지 및 이의 제조 방법 |
| KR101661948B1 (ko) | 2014-04-08 | 2016-10-04 | 엘지전자 주식회사 | 태양 전지 및 이의 제조 방법 |
| KR101613846B1 (ko) * | 2014-06-10 | 2016-04-20 | 엘지전자 주식회사 | 태양 전지 및 이의 제조 방법 |
| KR102219804B1 (ko) | 2014-11-04 | 2021-02-24 | 엘지전자 주식회사 | 태양 전지 및 그의 제조 방법 |
| US9722104B2 (en) | 2014-11-28 | 2017-08-01 | Lg Electronics Inc. | Solar cell and method for manufacturing the same |
| KR102272433B1 (ko) | 2015-06-30 | 2021-07-05 | 엘지전자 주식회사 | 태양 전지 및 이의 제조 방법 |
| CN106784069A (zh) * | 2015-11-20 | 2017-05-31 | 上海神舟新能源发展有限公司 | 背表面隧道氧化钝化交指式背结背接触电池制作方法 |
| CN107026218B (zh) * | 2016-01-29 | 2019-05-10 | Lg电子株式会社 | 制造太阳能电池的方法 |
| US10367115B2 (en) | 2016-01-29 | 2019-07-30 | Lg Electronics Inc. | Method of manufacturing solar cell |
| NL2017290B1 (en) | 2016-08-04 | 2018-02-14 | Stichting Energieonderzoek Centrum Nederland | Passivated Emitter and Rear Contact Solar Cell |
| USD822890S1 (en) | 2016-09-07 | 2018-07-10 | Felxtronics Ap, Llc | Lighting apparatus |
| DE102016222175A1 (de) | 2016-11-11 | 2018-05-17 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum Aufbringen von Ladungsträger-selektiven Kontakten auf Solarzellen |
| KR101846443B1 (ko) | 2017-02-23 | 2018-04-06 | 엘지전자 주식회사 | 태양전지를 위한 산화막 형성 방법 |
| US10775030B2 (en) | 2017-05-05 | 2020-09-15 | Flex Ltd. | Light fixture device including rotatable light modules |
| USD872319S1 (en) | 2017-08-09 | 2020-01-07 | Flex Ltd. | Lighting module LED light board |
| USD833061S1 (en) | 2017-08-09 | 2018-11-06 | Flex Ltd. | Lighting module locking endcap |
| USD877964S1 (en) | 2017-08-09 | 2020-03-10 | Flex Ltd. | Lighting module |
| USD862777S1 (en) | 2017-08-09 | 2019-10-08 | Flex Ltd. | Lighting module wide distribution lens |
| USD846793S1 (en) | 2017-08-09 | 2019-04-23 | Flex Ltd. | Lighting module locking mechanism |
| USD832494S1 (en) | 2017-08-09 | 2018-10-30 | Flex Ltd. | Lighting module heatsink |
| USD832495S1 (en) | 2017-08-18 | 2018-10-30 | Flex Ltd. | Lighting module locking mechanism |
| USD862778S1 (en) | 2017-08-22 | 2019-10-08 | Flex Ltd | Lighting module lens |
| CN107546281A (zh) * | 2017-08-29 | 2018-01-05 | 浙江晶科能源有限公司 | 一种实现p型perc电池正面钝化接触的方法 |
| USD888323S1 (en) | 2017-09-07 | 2020-06-23 | Flex Ltd | Lighting module wire guard |
| FR3071358B1 (fr) * | 2017-09-15 | 2019-09-13 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Procede de fabrication d'une cellule photovoltaique a homojonction |
| CN117276356A (zh) * | 2023-06-02 | 2023-12-22 | 天合光能股份有限公司 | 太阳能电池及其制作方法、光伏组件及光伏系统 |
| CN117712193A (zh) | 2023-12-28 | 2024-03-15 | 浙江晶科能源有限公司 | 太阳能电池及其制备方法、光伏组件 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005347339A (ja) * | 2004-05-31 | 2005-12-15 | Shin Etsu Handotai Co Ltd | 太陽電池の製造方法及び太陽電池 |
| US7468485B1 (en) * | 2005-08-11 | 2008-12-23 | Sunpower Corporation | Back side contact solar cell with doped polysilicon regions |
| KR20090009224A (ko) * | 2006-05-04 | 2009-01-22 | 선파워 코포레이션 | 도핑된 반도체 이종접합 접촉부를 갖는 태양 전지 |
Family Cites Families (41)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4393095A (en) * | 1982-02-01 | 1983-07-12 | Ppg Industries, Inc. | Chemical vapor deposition of vanadium oxide coatings |
| JP2811723B2 (ja) * | 1989-03-20 | 1998-10-15 | 株式会社デンソー | 半導体装置の製造方法 |
| US5057439A (en) * | 1990-02-12 | 1991-10-15 | Electric Power Research Institute | Method of fabricating polysilicon emitters for solar cells |
| US5057463A (en) | 1990-02-28 | 1991-10-15 | Sgs-Thomson Microelectronics, Inc. | Thin oxide structure and method |
| JPH04226084A (ja) * | 1990-05-23 | 1992-08-14 | Mitsubishi Electric Corp | 太陽電池およびその製造方法 |
| JP2858920B2 (ja) * | 1990-06-22 | 1999-02-17 | 三洋電機株式会社 | 光起電力素子の製造方法 |
| JP2855903B2 (ja) * | 1990-08-30 | 1999-02-10 | 日本電気株式会社 | 半導体装置の製造方法 |
| JPH0529293A (ja) * | 1991-07-18 | 1993-02-05 | Fujitsu Ltd | 半導体基板の前処理方法 |
| JP3006396B2 (ja) * | 1993-03-02 | 2000-02-07 | 日本電気株式会社 | 半導体薄膜の形成方法 |
| JPH0794431A (ja) * | 1993-04-23 | 1995-04-07 | Canon Inc | アモルファス半導体用基板、該基板を有するアモルファス半導体基板、及び該アモルファス半導体基板の製造方法 |
| JP3094730B2 (ja) * | 1993-04-27 | 2000-10-03 | トヨタ自動車株式会社 | 太陽電池素子 |
| JPH0786271A (ja) | 1993-09-17 | 1995-03-31 | Fujitsu Ltd | シリコン酸化膜の作製方法 |
| US5828080A (en) * | 1994-08-17 | 1998-10-27 | Tdk Corporation | Oxide thin film, electronic device substrate and electronic device |
| US5516730A (en) * | 1994-08-26 | 1996-05-14 | Memc Electronic Materials, Inc. | Pre-thermal treatment cleaning process of wafers |
| JP3096640B2 (ja) * | 1995-08-04 | 2000-10-10 | 三洋電機株式会社 | 半導体装置及び表示装置 |
| TW466772B (en) | 1997-12-26 | 2001-12-01 | Seiko Epson Corp | Method for producing silicon oxide film, method for making semiconductor device, semiconductor device, display, and infrared irradiating device |
| JPH11340483A (ja) * | 1998-05-26 | 1999-12-10 | Hiroshi Komiyama | 太陽電池用薄膜の製造方法 |
| WO2001026161A1 (en) * | 1999-10-05 | 2001-04-12 | Matsushita Battery Industrial Co., Ltd. | Compound semiconductor solar cell and method of manufacture thereof |
| JP2002064093A (ja) * | 2000-08-21 | 2002-02-28 | Japan Science & Technology Corp | 半導体基板表面の酸化膜形成方法および半導体装置の製造方法 |
| CN1144272C (zh) * | 2000-09-04 | 2004-03-31 | 中国科学院半导体研究所 | 采用teos源pecvd生长氧化硅厚膜的方法 |
| CN1190828C (zh) * | 2001-11-07 | 2005-02-23 | 旺宏电子股份有限公司 | 隧道氧化层的制造方法 |
| JP2003152205A (ja) * | 2001-11-12 | 2003-05-23 | Sharp Corp | 光電変換素子及びその製造方法 |
| US6916717B2 (en) * | 2002-05-03 | 2005-07-12 | Motorola, Inc. | Method for growing a monocrystalline oxide layer and for fabricating a semiconductor device on a monocrystalline substrate |
| JP3604018B2 (ja) | 2002-05-24 | 2004-12-22 | 独立行政法人科学技術振興機構 | シリコン基材表面の二酸化シリコン膜形成方法、半導体基材表面の酸化膜形成方法、及び半導体装置の製造方法 |
| JP2004056057A (ja) * | 2002-07-24 | 2004-02-19 | Sharp Corp | 太陽電池の製造方法 |
| US7176528B2 (en) * | 2003-02-18 | 2007-02-13 | Corning Incorporated | Glass-based SOI structures |
| US7323423B2 (en) * | 2004-06-30 | 2008-01-29 | Intel Corporation | Forming high-k dielectric layers on smooth substrates |
| DE102004050269A1 (de) | 2004-10-14 | 2006-04-20 | Institut Für Solarenergieforschung Gmbh | Verfahren zur Kontakttrennung elektrisch leitfähiger Schichten auf rückkontaktierten Solarzellen und Solarzelle |
| JP4586585B2 (ja) * | 2005-03-15 | 2010-11-24 | 日立電線株式会社 | 薄膜半導体装置の製造方法 |
| NL1029647C2 (nl) * | 2005-07-29 | 2007-01-30 | Otb Group Bv | Werkwijze voor het passiveren van ten minste een deel van een substraatoppervlak. |
| US7718888B2 (en) | 2005-12-30 | 2010-05-18 | Sunpower Corporation | Solar cell having polymer heterojunction contacts |
| CN101060166A (zh) * | 2006-04-20 | 2007-10-24 | 北京大学 | 一种透光电极及其制备方法 |
| NL2000248C2 (nl) * | 2006-09-25 | 2008-03-26 | Ecn Energieonderzoek Ct Nederl | Werkwijze voor het vervaardigen van kristallijn-silicium zonnecellen met een verbeterde oppervlaktepassivering. |
| US7705237B2 (en) | 2006-11-27 | 2010-04-27 | Sunpower Corporation | Solar cell having silicon nano-particle emitter |
| US8222516B2 (en) * | 2008-02-20 | 2012-07-17 | Sunpower Corporation | Front contact solar cell with formed emitter |
| US7799670B2 (en) * | 2008-03-31 | 2010-09-21 | Cypress Semiconductor Corporation | Plasma oxidation of a memory layer to form a blocking layer in non-volatile charge trap memory devices |
| TW201019482A (en) | 2008-04-09 | 2010-05-16 | Applied Materials Inc | Simplified back contact for polysilicon emitter solar cells |
| KR20100131524A (ko) * | 2008-04-09 | 2010-12-15 | 어플라이드 머티어리얼스, 인코포레이티드 | 태양전지용의 니트라이드화된 배리어 층 |
| DE102008055515A1 (de) * | 2008-12-12 | 2010-07-15 | Schott Solar Ag | Verfahren zum Ausbilden eines Dotierstoffprofils |
| US8334161B2 (en) * | 2010-07-02 | 2012-12-18 | Sunpower Corporation | Method of fabricating a solar cell with a tunnel dielectric layer |
| JP2012049156A (ja) * | 2010-08-24 | 2012-03-08 | Osaka Univ | 太陽電池およびその製造方法 |
-
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- 2010-07-02 US US12/829,922 patent/US8334161B2/en active Active
-
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005347339A (ja) * | 2004-05-31 | 2005-12-15 | Shin Etsu Handotai Co Ltd | 太陽電池の製造方法及び太陽電池 |
| US7468485B1 (en) * | 2005-08-11 | 2008-12-23 | Sunpower Corporation | Back side contact solar cell with doped polysilicon regions |
| KR20090009224A (ko) * | 2006-05-04 | 2009-01-22 | 선파워 코포레이션 | 도핑된 반도체 이종접합 접촉부를 갖는 태양 전지 |
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| EP2589087A4 (en) | 2017-07-26 |
| KR102007102B1 (ko) | 2019-08-02 |
| US20150263200A1 (en) | 2015-09-17 |
| KR20180014831A (ko) | 2018-02-09 |
| US8709851B2 (en) | 2014-04-29 |
| CN102959731A (zh) | 2013-03-06 |
| KR101758952B1 (ko) | 2017-07-17 |
| CN106847937A (zh) | 2017-06-13 |
| JP5825692B2 (ja) | 2015-12-02 |
| JP2019091919A (ja) | 2019-06-13 |
| EP2589087A2 (en) | 2013-05-08 |
| US9537030B2 (en) | 2017-01-03 |
| JP2013529857A (ja) | 2013-07-22 |
| CN102959731B (zh) | 2016-10-19 |
| KR102100065B1 (ko) | 2020-04-10 |
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