KR20170077665A - Flexible Organic Light Emitting Display Device - Google Patents

Abstract

The present invention relates to a flexible organic light emitting display in which defects such as disconnection and stress at the time of removing a glass substrate are improved by adjusting the position of a routing wiring connected to a touch electrode pad at an application region of an anisotropic conductive film, Is overlapped with the adhesive layer and the anisotropic conductive film to hold the touch routing wiring of the component of the adhesive material even when an external force is applied when removing the upper glass substrate,

Description

[0001] The present invention relates to a flexible organic light emitting display device,

The present invention relates to a display device, and more particularly to a flexible organic light emitting display device in which defects such as disconnection and stress at the time of removing a glass substrate are improved by adjusting the position of a routing wiring connected to a touch electrode pad at an application region of an anisotropic conductive film will be.

Specific examples of the flat panel display include a liquid crystal display (LCD) device, an organic light emitting display device, a plasma display panel (PDP) device, a quantum dot display device ), A field emission display device (FED), and an electrophoretic display device (EPD). The flat display panel, which realizes images in common, is an essential component, The flat panel display panel has a structure in which a pair of transparent insulation substrates are bonded together with inherent light emission, polarization, or other optical material layers interposed therebetween.

In recent years, there has been a demand for a flat display device to be used in a flexible form.

Flexible display devices are being developed in a form in which the thickness gradually becomes thinner and collapsible. Also, in consideration of the convenience of the user, a form in which a touch screen is added on the upper side is also proposed.

Among the flexible display devices to which the touch screen is added, an example in which the display panel is used as the organic light emitting display panel is omnipresent because the light source is omitted and a slimmer and lighter weight configuration is possible and the flexible form can be easily realized.

In general flexible organic light emitting display devices, a thin film transistor array and an organic light emitting diode array are formed on a lower plate glass substrate, a touch sensing array is formed on an upper plate glass substrate, and then an adhesive layer is made to correspond between the two glass substrates.

Here, the thin film transistor array and the organic light emitting diode array have a pad structure on one side of the lower glass substrate protruding from the touch sensing array, and the structure of the driving circuit substrate bonded thereto is easy. On the touch sensing array side, It is difficult to proceed with the bonding process with the separate touch-only driving circuit substrate, so that the touch sensor electrode is provided on one side of the touch sensing array, and the thin film transistor array and the organic light emitting diode array Dummy electrodes are formed on the side of the diode array, and the dummy electrodes are electrically conducted by a conductive ball or the like to receive an electric signal for touch driving from the lower thin film transistor array and the organic light emitting diode array side.

On the other hand, the upper glass substrate and the lower glass substrate are removed in the order mentioned. The upper and lower glass substrates are removed by irradiating a laser to separate the glass substrate from the array.

In the process of removing the upper and lower glass substrates, a physical external force is applied to the array side in order to completely remove the glass substrate in addition to the laser irradiation. In this process, some wirings connected to the array are cracked, . As a result, there is a problem that the operation of the array in which cracks are generated is impossible, and a solution thereof is required.

SUMMARY OF THE INVENTION The present invention has been devised to solve the problems described above, and it is an object of the present invention to provide a flexible organic electroluminescent display which improves the defects such as disconnection and stress when removing a glass substrate by adjusting the position of a routing wiring connected to a touch electrode pad at an application region of an anisotropic conductive film A display device is provided.

According to another aspect of the present invention, there is provided a flexible organic light emitting diode display device including a touch routing wiring, the touch routing wiring being formed by overlapping an adhesive layer and an anisotropic conductive film, So that wiring cracks can be prevented.

The flexible organic light emitting display according to the present invention is a flexible organic light emitting display having a rectangular shape and having a pad portion having a constant width along a first side and a first flexible substrate having an active region spaced apart from the edges of the remaining three sides, A thin film transistor and an organic light emitting diode array provided on the active region of the first flexible substrate; a second flexible substrate overlapped with both ends of the active region and the pad portion along the first side; And a plurality of touch pad electrodes provided on the second flexible substrate at portions overlapping both ends of the pad unit, wherein the touch sensing array includes: a touch sensing array provided facing the active area of the first flexible substrate; An anisotropic conductive film disposed between the touch pad section and the opposite ends of the pad section, An adhesive layer disposed between the lasers and the organic light emitting diode array and the touch sensing array, the adhesive layer being in contact with the anisotropic conductive film and the active layer on the side of the touch pad portion in a direction perpendicular to the first side, And a plurality of touch routing wires connected to the plurality of touch pad electrodes at a side of the touch pad portion which is connected to the touch sensing array and is perpendicular to the first side.

The anisotropic conductive film is preferably spaced apart from the edge of the second flexible substrate by a first distance in the first direction.

Further, the anisotropic conductive film is spaced apart from the adhesive layer by a second distance in the direction along the first side.

The touch routing wiring may be non-overlapping with the second gap.

And the second flexible substrate has a shape that is adjacent to the active region between both ends of the pad portion.

The pad portion exposed from the second flexible substrate may include an array pad electrode connected to the thin film transistor and the organic light emitting diode array.

Dummy pad electrodes may be provided on the first flexible substrate in correspondence with the touch pad electrodes.

The touch routing wires may be connected to the touch pad electrodes, respectively.

As another example, in the touch pad portion, the touch pad electrodes are arranged in two rows along the first side, the two rows of touch pad electrodes are connected to each other in a direction crossing the first side, And pad electrodes may be respectively connected to the touch routing wirings.

The flexible organic light emitting display of the present invention has the following effects.

The touch routing wiring connecting the touch pad electrode and the touch sensing array is positioned on the side of the touch pad portion covered by the anisotropic conductive film and overlapped with the adhesive layer so that force is concentrated only on the touch routing wiring even when an external force is applied during removal of the upper glass substrate So that wiring cracks can be prevented. That is, the adhesive routing layer is covered with an adhesive layer, so that the adhesive layer holds the touch routing layer on the upper substrate, and is resistant to an external force and can be protected.

The upper side of the anisotropic conductive film is spaced apart from the second flexible substrate by a predetermined distance so as to prevent a defect in a cutting step for exposing a part of the pad portion and to separate the lower side from the adhesive layer. The bonding layer and the anisotropic conductive film can be prevented from overlapping due to the pressure applied during the bonding process between the diode arrays, thereby preventing defective bonding.

Particularly, in the flexible organic light emitting display of the present invention, even if there is a horizontal separation distance between the anisotropic conductive film and the adhesive layer or a horizontal separation distance between the anisotropic conductive film and the edge portion in order to prevent defects such as defective bonding and cutting process, The touch channel open failure can be prevented by the stress due to the removal of the glass substrate, the contact reliability can be improved, and the yield and reliability of the touch sensing array can be improved.

1 is a flow chart showing a manufacturing process of a flexible organic light emitting display device according to the present invention.
FIGS. 2A to 2D are process cross-sectional views illustrating a manufacturing process of the flexible organic light emitting display device of the present invention
3 is a perspective view showing scribing for each unit panel after removal of the second glass substrate
Fig. 4 is a plan view showing the second substrate cutting of the scribing unit panel of Fig. 3
5 is an enlarged plan view of the left touch pad unit of FIG. 4 according to the first embodiment of the present invention.
6 is a plan view showing an enlarged view of the left touch pad unit of FIG. 4 according to the second embodiment of the present invention.
7A and 7B are plan views showing a correspondence relationship between the adhesive layer and the routing wiring in the comparative example and the first embodiment of the present invention;
8 is a photograph showing a crack in the comparative example of FIG. 7A
FIGS. 9A to 9C are cross-sectional views of the active region of the flexible organic light emitting display device of the present invention, taken along lines I to I 'and II to II'

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. Like reference numerals throughout the specification denote substantially identical components. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In the following description, a detailed description of known technologies or configurations related to the present invention will be omitted when it is determined that the gist of the present invention may be unnecessarily obscured. The component names used in the following description are selected in consideration of easiness of specification, and may be different from the parts names of actual products.

FIG. 1 is a flow chart showing a manufacturing process of a flexible organic light emitting display according to the present invention, and FIGS. 2 (a) to 2 (d) are process sectional views showing a manufacturing process of a flexible organic light emitting display according to the present invention. FIG. 3 is a perspective view showing scribing for each unit panel after the removal of the second glass substrate, and FIG. 4 is a plan view showing a second substrate cutting of the scribing unit panel of FIG.

As shown in FIGS. 1 to 4, the flexible organic light emitting display of the present invention is manufactured in the following order.

First, as shown in FIG. 2A, a first flexible substrate 110 is formed on a first glass substrate 300, and on the first flexible substrate 110, a thin film transistor array 120, Thereby forming a diode array 130 (100S). The thin film transistor array 120 and the organic light emitting diode array 130 are located in the active region of the first flexible substrate 110 and include two arrays 120 and 130 located on the same substrate to form a lower array (Including thin film transistors and organic light emitting diode arrays).

In addition, in the same step of forming the thin film transistor array 120, the thin film transistor array pad electrode 135 and the dummy pad electrode 125 are formed in the active region outer pad portion.

An array pad electrode 135 electrically connected to the thin film transistor array 120 is provided on a pad portion outside the active region when the thin film transistor array 120 is formed. And a dummy pad electrode 125 is provided corresponding to both ends of the pad portion.

Further, when the thin film transistor array 120 or the organic light emitting diode array 130 is formed, a lighting inspection pattern 145 spaced apart from the array pad electrode 135 or the dummy pad electrode 125 is further provided outside the active region . This is a kind of test pattern, which can be omitted or changed in some cases.

2B, a second flexible substrate 210 is provided on the second glass substrate 400, and a touch sensing array 210 is formed on the second flexible substrate 210 (110S). Here, the second flexible substrate 210 and the touch sensing array 210 are referred to as an upper array 200.

Next, the adhesive layer 150 is applied to the active region of the second glass substrate 400.

Also, when the sensing array 210 is formed, the touch pad electrodes 225 are formed at positions corresponding to the dummy pad electrodes 125 in the same process. The anisotropic conductive film 250 including the conductive balls 255 is coated on the touch pad electrodes 225, spaced apart from the adhesive layer 150.

The TFT array 120 and the organic light emitting diode array 130 of FIG. 2A or the touch sensing array 210 of FIG. 2B may be reversed in that order. The portions where the thin film transistor array 120 and the organic light emitting diode array 130 or the touch sensing arrays 210 of FIG. 2B are formed are connected to the first flexible substrate 110 and the active region of the second flexible substrate 120, And the pad portion is defined outside the active region.

The first glass substrate 300 and the second glass substrate 400 form arrays in the form of a ledge. Each of the glass substrates 300 and 400 has a plurality of panels, The individual array process is performed. That is, as shown in FIG. 3, the first glass substrate 300 and the second glass substrate 400 are horizontally provided with arrays of a plurality of panels.

Next, as shown in FIG. 2C, the second glass substrate 400 is reversed so that the array-formed surfaces of the lower array 100 and the upper array 200 face each other, Let the arrays 130 and 210 coalesce (120S). In this process, pressure is applied to the first and second glass substrates 300 and 400 in the up and down direction, so that force is uniformly applied to the plane, and adhesion is achieved. The conductive ball 255 in the anisotropic conductive film 250 is broken between the dummy pad electrode 125 and the touch pad electrode 225 by the same pressure when the arrays are bonded together through the adhesive layer 150, Electrical conduction between the two electrodes 125 and 225 is achieved.

2d, a laser beam is irradiated onto the second glass substrate 400 positioned on the upper side of the first and second glass substrates 300 and 400 to form a second glass substrate 400 on the second flexible substrate 210, 2 Glass substrate 400 is removed (130S).

Next, as shown in FIG. 3, a laser beam is irradiated from the back side of the second flexible substrate 210 which has been released from the second glass substrate 400, and scribbled for each unit panel (140S). In the unit panel divided on the basis of the scribed lines, the first glass substrate 300 on the lower side is kept in a state where the pressure is applied to the flexible printed circuit board (FPCB) It is to be resistant to heat.

On the other hand, for the scribed unit panel, as shown in FIG. 4, a part of the second flexible substrate 210 corresponding to the pad portion is cut (150S). The first flexible substrate 110 is protruded from the second flexible substrate 210 and the lighting inspection pattern 145 and the array pad electrode 135 are formed on the protruding portion, Lt; / RTI > In this cutting, the second flexible substrate 210 may be connected to the first flexible substrate 210 so that the dummy pad electrode 125 and the touch pad electrode 225 are electrically connected to each other, The substrate 110 is kept in a superimposed state.

The cutting of the second flexible substrate 210 is performed such that the edges of the first side of the first flexible substrate 110 on which the pad portions are positioned are exposed and the dummy pad electrodes 125 are covered so as to cover both ends of the pad portion , And is disposed between the both ends of the pad portion to be closer to the active region (AA). That is, the second flexible substrate 210 is cut only in the pad portion with respect to the first flexible substrate 110, and maintains the overlap of the first flexible substrate 110 in the active region and its periphery. The lighting inspection pattern 135 and the array pad electrode 145 are exposed from the cut second flexible substrate 210 and the first flexible substrate 110 and the second flexible substrate 210 are exposed at the pad portion, As shown in FIG.

Here, the first flexible substrate 110 and the second flexible substrate 120 may each be a transparent plastic film, a plurality of inorganic films, or both. Each of the first and second flexible substrates 110 and 120 has a thickness of 20 μm or less and a thickness of 1/20 or less of the thickness of the first and second glass substrates 300 and 400, The flexible organic light emitting display fabricated by the bonding of the flexible organic light emitting display device can be maintained in a state where it can be folded or dried.

Next, a flexible printed circuit board (not shown) capable of transmitting signals to the array and touch pad electrodes is connected to the array pad electrodes 145 (160S).

Next, the first glass substrate 300 is removed (170S), and the first flexible substrate 110 is exposed.

In some cases, the exposed first flexible substrate 110 may be further provided with a back cover film having a thickness that is relatively greater than the first flexible substrate 110 for storage in the bezel.

In the above description, the first and second flexible substrates 110 and 210 are respectively a heat-resistant transparent plastic film having flexibility and a transparent plastic film, and the components thereof are a copolymer including a polyester or a polyester, A copolymer comprising a polyimide or a polyimide, an olefin-based copolymer, a copolymer containing polyacrylic acid or polyacrylic acid, a copolymer containing polystyrene or polystyrene, a polysulfate- a copolymer comprising a polysulfate or a polysulfate, a copolymer comprising a polycarbonate or a polycarbonate, a copolymer including a polyamic acid or a polyamic acid, a polyamine and a polyamic acid , Polyvinyl alcohol (polyvinyl alcohol), polyallylamine (polyallylamine) May include one or more high molecular weight compound and has a thickness, the thickness of the plastic film is selected from may be 5㎛ to 100㎛. In some cases, the second flexible substrate 210 may include only a transparent inorganic film. In this case, the transparent inorganic film may be a plurality of layers, and the component thereof may be a nitride film, an oxide film, a nitride oxide film, or a metal oxide film.

Meanwhile, in the flexible organic light emitting display device of the present invention, in the process of removing the second glass substrate 400, an external force for lifting the second glass substrate 400 in addition to laser irradiation is applied. In this process, It is noted that a crack is generated in a portion of the touch routing wiring which is the thinnest portion of the two flexible substrate 210, and the position of the touch routing wiring is changed.

 That is, in consideration of the occurrence of a crack at a portion where the touch routing wiring (see 227 in FIG. 5) does not overlap the adhesive layer 150 or the anisotropic conductive film 250 at the pad portion, the position of the touch routing wiring 227 , And moves along the side in the vertical direction in the touch sensing array 220 to enter the touch pad portion.

4, when a unit panel has a substantially rectangular shape, a pad portion is defined along one side of four sides in the unit panel, and a rectangular active region AA is defined adjacent to the pad portion . The edge of the side having the pad portion relatively is distant from the active region as compared with the edge of the other sides and the interval where the side having the pad portion is separated from the active region AA corresponds to the width of the pad portion.

This will be described with reference to FIGS. 4 and 5. FIG.

5 is an enlarged plan view of the left touch pad unit of FIG. 4 according to the first embodiment of the present invention.

As shown in FIGS. 2A to 4, a common flexible organic light emitting display device has a pad portion having a predetermined width along the first side, adjacent to the pad portion, and spaced apart from the edges of the remaining three sides A thin film transistor and an organic light emitting diode array (120, 130) provided on an active region of the first flexible substrate; a plurality of pads The second flexible substrate 210 overlapped with both ends of the first flexible substrate and the touch sensing array 220 facing the active region of the first flexible substrate on the second flexible substrate will be omitted in the following description.

As shown in FIGS. 4 and 5, the flexible organic light emitting display according to the first embodiment of the present invention has a structure in which the first and second flexible substrates are overlapped with both ends of the pad unit. An anisotropic conductive film 250 having a touch pad portion including a plurality of touch pad electrodes 225 and a conductive ball 255 disposed between the touch pad portion and a layer between both ends of the pad portion; And an adhesive layer 150 disposed between the light emitting diode arrays 120 and 130 and the touch sensing array 220 and in contact with the anisotropic conductive film 250 in a direction perpendicular to the first side, A plurality of touches connected to the plurality of touch pad electrodes 225 and connected to the touch sensing array 220, the touch sensor array 220 being overlapped with the adhesive layer 150 at the outer periphery of the active area on the flexible substrate 210, It includes a routing wiring 227.

5, in the flexible organic light emitting display according to the first embodiment of the present invention, in the touch pad unit, the touch pad electrodes 225 are arranged in two rows along the first side, The touch pad electrodes 225 are connected to each other in a direction intersecting with the first side, and two touch pad electrodes 225 connected to the touch routing electrodes 227 are connected to the touch routing electrodes 227, respectively.

Particularly, in the flexible organic light emitting display according to the present invention, even if there is a space between the adhesive layer 150 and the anisotropic conductive film 250 generated in the horizontal direction, the touch routing wirings 227 are formed on the vertical side with anisotropic conductive film And the adhesive layer 150 in contact with the second flexible substrate 210 so that the adhesive force of the touch routing wirings 227 on the surface of the second flexible substrate 210 is increased and protected. This can prevent the cracks of the touch routing lines 227 and prevent the opening of the touch channel, thereby improving the yield of the entire device.

On the other hand, the anisotropic conductive film 250 is separated from the edge in the direction of the first side of the second flexible substrate 210 in the direction of the horizontal line passing through the center of the alignment key in FIG. 5, . This is because when the anisotropic conductive film 250 is left on the cutting line when the second flexible substrate 210 is cut after the second glass substrate 400 is removed, the second flexible substrate 210 is not cut, Because the anisotropic conductive film 250 must be applied to the inside of the edge.

Also, the anisotropic conductive film 250 is spaced apart from the adhesive layer 150 by a second distance d2 in a direction along the first side. In this case, overlapping between the adhesive layer 150 and the anisotropic conductive film 250 in the horizontal direction is prevented, and a specific region is prevented from being lifted during the bonding process. The reason why the second gap d2 in the horizontal direction is required is that when the pressure is applied in the region in the horizontal direction which is wider than the relatively vertical side portion, the spreading of the adhesive layer 150 or the anisotropic conductive film 250 The pressure is applied when the adhesive layer 150 and the anisotropic conductive film 250 are in contact with each other or overlapping each other and the overlap between the adhesive layer 150 and the anisotropic conductive film 250 becomes severe, Because. In order to prevent this, a second gap d2 between the adhesive layer 150 and the anisotropic conductive film 250 is provided in consideration of the pressing of the bonding / press. In this case, even if pressure is applied, the anisotropic conductive film 250 does not contact the adhesive layer 150 in the horizontal direction of the adhesive layer 150, The touch routing wiring 227 is not located and the touch routing wiring 227 does not create a region where the touch routing wiring 227 is not overlapped with the adhesive layer 150 so that the touch routing wiring 227 is cracked even after the second glass substrate 400 is removed The phenomenon can be prevented.

Here, when the adhesive layer 150 and the anisotropic conductive film 250 are coated adjacent to each other at the side of the touch pad portion in the direction perpendicular to the first side, which crosses the longitudinal direction of the pad portion, The adhesive layer 150 and the anisotropic conductive film 250 spread by the pressure do not overlap with each other but spread in the vertical direction so that the adhesive layer 150 and the anisotropic conductive film 250 are bonded to each other at the boundary portion. The touch routing wiring 227 located on the vertical side of the touch pad portion (direction perpendicular to the first side) overlaps with the adhesive layer 150 to prevent the wiring from being exposed at a specific portion, You can.

As described above, regions (the first gap and the second gap) in which the adhesive layer 150 and the anisotropic conductive film 250 are not provided exist in the regions in the horizontal direction (along the first side) And the second spacing d2 may be smaller than the first spacing d1.

The adhesive layer 150 and the anisotropic conductive film 250 are made of different materials so that the first and second glass substrates 300 and 400 can be stretched even when the same planar pressure is applied. In addition, compared to the anisotropic conductive film 250 defined in the local region, the area of the adhesive layer 150 including the active region and extending up to the regions other than the touch pad portion is larger. For example, if the thickness of the adhesive layer 150 is 10 占 퐉, the maximum is 381.6 占 퐉 and the average is 200 占 퐉. When the thickness is 15 占 퐉, the maximum is increased by 445.7 占 퐉, and the average is increased by 250 占 퐉. That is, since the adhesive layer 150 is proportional to the thickness, the first spacing d1 and the second spacing d2 are adjusted in consideration of the elongation and the material of the adhesive layer 150 and the anisotropic conductive film 250 .

In addition, since the touch routing wiring 227 is located in the vertical direction (direction intersecting the first direction), the touch routing wiring 227 is located at the second interval d2 between the ends of the adhesive layer positioned in the horizontal direction with the touch pad portion And may be non-overlapping with the second spacing d2.

The pad portion exposed from the second flexible substrate 210 may include an array pad electrode 145 connected to the thin film transistor and the organic light emitting diode arrays 120 and 130.

The dummy pad electrodes 125 are provided on the first flexible substrate 110 in correspondence to the touch pad electrodes 225 and the anisotropic conductive film 250 disposed between the layers The conductive ball 255 is broken by the pressure and connection between the dummy pad electrode 125 and the touch pad electrode 225 is achieved.

In this case, in the first embodiment of the present invention, the two touch pad electrodes 225 may be connected to one dummy pad electrode 125, and the actual touch related drive signal may be transmitted to the first flexible substrate (Not shown) with the dummy pad electrode 125 through a wiring line and a pad portion on which the array pad electrode 145 is disposed.

6 is an enlarged plan view of the left touch pad unit of FIG. 4 according to the second embodiment of the present invention.

6, the organic light emitting display according to the second embodiment of the present invention is different from the first embodiment in that the touch routing lines 227 are connected to the touch pad electrodes 225 The touch routing wiring 227 and the touch pad electrode 225 are connected in a one-to-one relationship.

The first embodiment and the second embodiment differ only in whether the connection relation between the touch pad electrode 225 and the touch routing wiring 227 is 2: 1 or 1: 1, The same function.

Also in this case, the touch routing wiring 227 is located in the vertical side portion (direction perpendicular to the first side direction) of the touch pad portion.

6, the number of the touch pad electrodes 225 is eight, but the number of the touch pad electrodes 225 may vary according to the number of touch electrodes required to apply a signal to the touch sensing array 220 have. When the number of the touch pad electrodes 225 is increased, the number of the touch routing wirings 227 is increased. In any case, the touch routing wirings 227 are overlapped with the adhesive layer 15 at the side of the touch pad portion So that the stress that the touch routing wiring 227 receives against an external force can be prevented.

7A and 7B are plan views showing a correspondence relationship between the adhesive layer and the routing wiring in the comparative example and the first embodiment of the present invention.

As shown in FIG. 7A, in the comparative example, the touch routing wiring 27 from the touch sensing array is provided so as to pass through the lower portion of the anisotropic conductive film 25. In this case, the touch routing wiring 27 passes through the spacing space between the anisotropic conductive film 25 and the adhesive layer 15, so that the touch routing wiring 27 on the spacing space is vulnerable to the removal of the second glass substrate, There is a problem that a wiring crack is generated in the region. That is, there is a contact area for electrically connecting the touch pad electrode 30 on the second flexible substrate on the upper side and the dummy pad electrode (not shown) on the first flexible substrate on the lower side. When the second glass substrate is removed, 15 and the anisotropic conductive film 25 is generated, the touch routing wiring corresponding to the empty space is vulnerable to stress when the upper glass is removed, so that a wiring crack may occur.

7B, in order to solve such a problem, in the first embodiment of the present invention, a second spacing space between the anisotropic conductive film 250 and the adhesive layer 150 is formed so as not to pass through the touch routing wiring, The entire touch routing wiring 227 is overlapped with the adhesive layer 15 or the anisotropic conductive film 250 so that the touch routing wiring 227 meets the touch pad electrode 225 through the side of the adhesive layer 15, The problem of the comparative example can be solved.

That is, the position of the touch routing line 227 connected to the first and second touch electrodes 221 and 223 of the touch sensing array 220 and the position of the adhesive layer 150 are changed, It is possible to improve the open failure of the touch channel due to the stress during the releasing of the second glass substrate 400 even if a space between the films 250 occurs.

On the other hand, a laser cutting line for cutting the second flexible substrate 210 is positioned on the anisotropic conductive film 250 in a plan view, and an adhesive layer 150 is disposed on a lower side of the anisotropic conductive film 250, The left and right regions are not in direct contact with the laser cut or the active region, their widths are easily controlled, and therefore, the touch routing wiring 227 can be provided.

Touch routing wiring open defect rate Comparative Example In the first embodiment of the present invention Primary 34% 2% Secondary 40% 3% Third 37% One%

On the other hand, in Table 1, open failure of the touch routing wiring was checked through the third example for the comparative example and the first embodiment of the present invention.

That is, in the case of the comparative example, the defects of the touch routing wirings were 34%, 40%, and 37%, respectively, which were more than 34% , All of which showed defects of less than 3%. Therefore, it can be seen that wiring cracks and the open problem of the touch channel can be solved when the first embodiment of the present invention is applied to such a degree that defective of 5% or less does not affect the touch sensing.

FIG. 8 is a photograph showing a crack in the comparative example of FIG. 7A. FIG.

8, a crack is generated in a touch routing wiring located in a space between the anisotropic conductive film and the adhesive layer. That is, as in the comparative example, in the case where the touch routing wiring is directly disposed on the touch pad electrodes arranged in the horizontal direction of the touch pad unit in the touch sensing array, the touch routing electrode is not bonded to the second flexible substrate by any adhesive material It can be seen that the non-touch routing wiring is cracked.

FIGS. 9A to 9C are cross-sectional views of the active region of the flexible organic light emitting display device of the present invention, taken along lines I to I 'and II to II' of FIG. 5, respectively.

9A to 9C, the flexible organic light emitting display device of the present invention includes the thin film transistor array 120 and the organic light emitting diode array 130 on the first flexible substrate 110, The touch sensing array 220 is provided on the flexible substrate 210 and has an active area AA and an outer area at the corresponding positions of the respective arrays. The thin film transistor array 120 includes gate lines and data lines crossing each other and one or more thin film transistors (TFT) for each pixel. And the organic light emitting diode array 130 includes an organic light emitting diode (OLED). The touch electrode array 220 includes a plurality of first touch electrodes 221 and a plurality of second touch electrodes 222 intersecting each other in the active area. The arrangement of the first and second touch electrodes 221 and 222 may correspond to a plurality of pixels but may be arranged independently of the arrangement of pixels.

The touch electrode array 220 includes a touch pad unit connected to a dummy pad electrode 125 provided on a pad portion of the thin film transistor array 120, Respectively. The reason why the touch pad is connected to the pad portion of the thin film transistor array 120 is that it avoids the connection of a separate FPC to the touch electrode array 220 and applies a signal for touch control to the thin film transistor array 120 To receive from the pad part on the same surface. This is to simplify the process and minimize the connection of the FPC.

The thin film transistor (TFT) of the thin film transistor array 120 includes an active layer 122 on the TFT buffer layer 121 and a gate insulating film (not shown) formed on the TFT buffer layer 121 to cover the active layer 122 An interlayer insulating film 124b formed on the gate electrode 123 and the gate insulating film 124a and an interlayer insulating film 124b formed on the gate insulating film 124a, And a source electrode 125 and a drain electrode 126 which are connected to both ends of the active layer 122 through the gate insulating film 124a. Here, the gate electrode 123 may be located on the same layer as the gate line, and the source electrode 125 and the drain electrode 126 may be located on the same layer as the data line.

And a second electrode pad electrode for grounding or applying a predetermined voltage to the pad electrode for the gate line and the data line and the second electrode of the organic light emitting diode array is formed in an outer area of the thin film transistor array, And a dummy electrode pad 125 connected to the touch pad electrode 225 in the anisotropic conductive film 250 on the upper side.

The organic light emitting diode OLED includes a first electrode 131 connected to the drain electrode 116, an organic light emitting layer 133 formed in the bank 132a defining the light emitting region, Two electrodes 134 are formed. The organic light emitting diode OLED covers a thin film transistor TFT through a passivation layer 128 and forms a contact hole in a part of the passivation layer 126 to be connected to the drain electrode 126. And the first electrode 131 is connected to the drain electrode 126.

A spacer 132b having a predetermined height corresponding to a part of the width of the bank 132a may be provided on the bank 132a. In the formation of the organic light emitting layer 133, the spacer 132b performs an organic material deposition process corresponding to the upper side of the first flexible substrate 110 through a predetermined opening through which the organic material is transmitted. In this process, The bank 132a is further provided with the spacers 132b regularly on the banks 132a in order to prevent the bank 132a from collapsing or affecting the inside of the light emitting region. The first electrode 131 is a reflective electrode and the second electrode 134 is a transparent electrode. When external light is incident, the first electrode 131 passes through the organic light emitting diode (OLED) And light proceeds through the second electrode 134 which is transparent at the time of reflection.

An adhesive layer 150 is provided between the organic light emitting diode array 130 and the touch sensing array 220.

The touch sensing array 220 includes a plurality of first and second touch electrodes 221 and 222 crossing each other in an active area and a protective film 226 covering the first and second touch electrodes 221 and 222, A plurality of touch pad electrodes 225 corresponding to the first and second touch electrodes 221 and 222 in the outer area and a plurality of first and second touch electrodes 221 and 222 And a routing wiring 227 for transferring a signal at a node 222,

In the illustrated example, the first and second touch electrodes 221 and 222 and the routing wiring 227 and the touch pad electrode 225 are provided with metal mesh patterns 221a, 222a, 227a, and 225a, respectively, And a transparent electrode 221b, 222b, 227b, and 225b on the upper side, thereby achieving electric field stabilization and low resistance. However, in the organic light emitting diode display of the present invention, the touch electrode array is not limited to the electrode structure including such a metal mesh pattern, and can be realized as a single layer electrode structure.

The first electrode 221 and the second touch electrode 222 are located on the same surface in the illustrated example so that the first electrode 221 is electrically connected to the inside of the protective film 226 The bridge pattern 221c is placed through the contact hole provided so as to be electrically insulated from the second electrode 222 which intersects with the bridge pattern 221c.

The first and second touch electrodes 221 and 222 and the routing wiring 227 and the touch pad electrode 225 are located on the second flexible substrate 210 as shown in FIG. Further, the second flexible substrate 210 may be a single substrate of an organic film such as polyimide, or a laminated substrate of an organic film and a plurality of inorganic films. The uppermost layer of the inorganic films may be formed on the formation surface of the touch sensing array 220 Or may include only a plurality of inorganic films by omitting the material of the organic film such as polyimide. In any case, the second flexible substrate 210 is a transparent substrate and the second flexible substrate 210 is used as a display surface.

9B, the adhesive layer 150 is brought into contact with the anisotropic conductive film 250 with respect to the vertical portion of the touch pad portion, and the touch routing wiring (not shown) is positioned so as to be located on the vertical side of the touch pad portion. 227 so that the entire upper surface of the touch routing wiring 227 covers the adhesive layer 150 and strengthens the adhesion of the touch routing wiring 227 to the second flexible substrate 210. As a result, wiring cracking can be prevented.

The anisotropic conductive films 250 of the touch pad portion are spaced apart from each other by the second spacing distance d2 with respect to the lower portion along the horizontal direction of the touch pad portion as shown in FIG. Since the touch routing wiring 227 is not provided in the interval, cracks of the touch channel of the touch sensing array can be prevented and the yield can be improved.

Meanwhile, although the touch routing wiring 227 and the touch pad electrode 225 shown in FIGS. 9B and 9C are shown as a double layer, the present invention is not limited thereto, and may be a single layer or a triple layer.

The flexible organic light emitting display device of the present invention can secure the contact reliability of the touch pad portion when manufacturing an organic light emitting panel of an in-cell type touch, The position of the routing wiring is located on the side of the vertical side of the touch pad portion, so that disconnection of the touch routing wiring can be reduced and the defect rate can be minimized.

The Insel-touch organic luminescent panel has a structure in which an upper touch screen substrate and a lower TFT substrate are bonded together. At this time, a contact area for electrically connecting the upper touch screen substrate and the lower TFT substrate is present. When a space is formed between the adhesive layer and the conductive adhesive member during the removal of the upper glass, a wiring crack occurs due to the stress of removing the upper glass do.

In order to solve such a problem, the present invention has been made to solve the above problem by changing the wiring position and the adhesive layer punching position connected to the touch screen channel electrode, Thereby improving the reliability of the product and reducing the defect rate.

While the present invention has been described in connection with what is presently considered to be the most practical and preferred embodiment, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. Will be apparent to those of ordinary skill in the art.

100: lower array 110: first flexible substrate
120: thin film transistor array 125: dummy pad electrode
130: organic light emitting diode array 135: array pad electrode
145: ON test pattern 150: Adhesive layer
200: upper array 210: second flexible substrate
220: touch sensing array 225: touch pad electrode
227: Touch routing wiring 250: Anisotropic conductive film
255: conductive ball 300: first glass substrate
400: second glass substrate

Claims (9)

A first flexible substrate having a pad portion having a predetermined width along a first side and adjacent to the pad portion and having an active region spaced apart from edges of the remaining three sides by a predetermined distance;
A thin film transistor and an organic light emitting diode array provided on an active region of the first flexible substrate;
A second flexible substrate overlapping the active region and both ends of the pad portion along the first side;
A touch sensing array provided on the second flexible substrate so as to face the active area of the first flexible substrate;
A touch pad unit including a plurality of touch pad electrodes provided on a portion of the second flexible substrate overlapped with both ends of the pad unit;
An anisotropic conductive film disposed between the touch pad portion and a layer between both ends of the pad portion;
An adhesive layer disposed between the thin film transistor and the organic light emitting diode array and the touch sensing array and contacting the anisotropic conductive film at a side of a touch pad portion in a direction perpendicular to the first side; And
A plurality of touch electrodes connected to the plurality of touch pad electrodes, the plurality of touch pad electrodes being connected to the touch sensing array at a side of the touch pad unit in a direction perpendicular to the first side, overlapping the adhesive layer at an outer periphery of the active area on the second flexible substrate, Flexible organic light emitting display including touch routing wiring. The method according to claim 1,
Wherein the anisotropic conductive film is spaced apart from the edge of the second flexible substrate by a first interval in the first direction. 3. The method of claim 2,
Wherein the anisotropic conductive film is spaced apart from the adhesive layer by a second interval in a direction along the first side. The method of claim 3,
And the touch routing wiring is not overlapped with the second gap. The method according to claim 1,
Wherein the second flexible substrate has a shape that is adjacent to the active region between both ends of the pad portion. 6. The method of claim 5,
And an array pad electrode connected to the thin film transistor and the organic light emitting diode array in the pad portion exposed from the second flexible substrate. The method according to claim 1,
Wherein the dummy pad electrodes are provided on the first flexible substrate in correspondence with the touch pad electrodes. The method according to claim 1,
And the touch routing wires are connected to the touch pad electrodes. The method according to claim 1,
In the touch pad portion, the touch pad electrodes are arranged in two rows along the first side, the two rows of touch pad electrodes are connected to each other in a direction crossing the first side, And each of the first and second electrodes is connected to the touch routing wirings.

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