KR20170132665A - 커터 휠 - Google Patents
커터 휠 Download PDFInfo
- Publication number
- KR20170132665A KR20170132665A KR1020170059282A KR20170059282A KR20170132665A KR 20170132665 A KR20170132665 A KR 20170132665A KR 1020170059282 A KR1020170059282 A KR 1020170059282A KR 20170059282 A KR20170059282 A KR 20170059282A KR 20170132665 A KR20170132665 A KR 20170132665A
- Authority
- KR
- South Korea
- Prior art keywords
- cutter wheel
- bearing hole
- less
- scribe line
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 13
- 239000010432 diamond Substances 0.000 claims abstract description 13
- 238000005520 cutting process Methods 0.000 claims abstract description 11
- 230000003746 surface roughness Effects 0.000 claims abstract description 9
- 239000013078 crystal Substances 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims description 5
- 239000000758 substrate Substances 0.000 description 18
- 239000000463 material Substances 0.000 description 11
- 238000003754 machining Methods 0.000 description 7
- 238000005336 cracking Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 229910017052 cobalt Inorganic materials 0.000 description 3
- 239000010941 cobalt Substances 0.000 description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000010979 ruby Substances 0.000 description 2
- 229910001750 ruby Inorganic materials 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- SWPMTVXRLXPNDP-UHFFFAOYSA-N 4-hydroxy-2,6,6-trimethylcyclohexene-1-carbaldehyde Chemical compound CC1=C(C=O)C(C)(C)CC(O)C1 SWPMTVXRLXPNDP-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000003776 cleavage reaction Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 230000007017 scission Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000008207 working material Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Dicing (AREA)
Abstract
(해결 수단) 단결정 다이아몬드로 이루어지는 원판상으로 외주면에 좌우의 사면 (3a) 으로 이루어지는 날끝부 (3) 를 가짐과 함께 중심부에 장착용의 베어링공 (2) 을 구비하고, 베어링공 (2) 은, 내경이 0.3 ∼ 1.1 ㎜, 진원도가 0.5 ㎛ 이하, 원통도가 1 ㎛ 이하, 표면 조도가 산술 평균 조도로 0.01 ㎛ 이하가 되도록 한다.
Description
도 2 는 본 발명의 커터 휠의 제조 공정을 나타내는 도면이다.
도 3 은 본 발명의 커터 휠에 있어서의 베어링공의 진원도와 원통도의 측정 수단을 나타내는 설명도이다.
도 4 는 본 발명의 커터 휠에 있어서의 베어링공과 휠 측면의 직각도의 측정 수단을 나타내는 설명도이다.
도 5 는 본 발명의 커터 휠에 있어서의 베어링공의 표면 조도의 측정 수단을 나타내는 설명도이다.
1 : 보디
2 : 베어링공
3 : 날끝부
3a : 사면
Claims (3)
- 외주면에 좌우의 사면으로 이루어지는 날끝부를 갖고, 중심부에 장착용의 베어링공을 구비한 원판상의 커터 휠이 단결정 다이아몬드로 형성되고,
상기 베어링공의 내경이 0.3 ∼ 1.1 ㎜ 로서, 그 진원도가 0.5 ㎛ 이하이고, 원통도가 1 ㎛ 이하이고, 표면 조도가 산술 평균 조도로 0.01 ㎛ 이하인 커터 휠. - 제 1 항에 있어서,
상기 베어링공과 커터 휠 측면의 직각도가 0.2°이하인 커터 휠. - 제 1 항 또는 제 2 항에 있어서,
상기 날끝부의 좌우 사면의 표면 조도가 산술 평균 조도로 0.01 ㎛ 이하이고, 상기 좌우 사면이 교차하는 날끝 각도가 80 ∼ 160°인 커터 휠.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2016-102903 | 2016-05-24 | ||
| JP2016102903A JP6746128B2 (ja) | 2016-05-24 | 2016-05-24 | カッターホイール |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20170132665A true KR20170132665A (ko) | 2017-12-04 |
| KR102380301B1 KR102380301B1 (ko) | 2022-03-29 |
Family
ID=60424964
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020170059282A Active KR102380301B1 (ko) | 2016-05-24 | 2017-05-12 | 커터 휠 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6746128B2 (ko) |
| KR (1) | KR102380301B1 (ko) |
| CN (1) | CN107415065B (ko) |
| TW (1) | TWI732864B (ko) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6936485B2 (ja) * | 2017-12-27 | 2021-09-15 | 三星ダイヤモンド工業株式会社 | スクライブ装置およびホルダユニット |
| CN108911495A (zh) * | 2018-07-11 | 2018-11-30 | 东莞市银泰丰光学科技有限公司 | 一种玻璃导光板切割工艺 |
| CN110154252B (zh) * | 2019-04-04 | 2021-12-03 | 深圳市威雄精机有限公司 | 金刚石刀轮制作方法 |
| JP7417976B2 (ja) * | 2019-08-30 | 2024-01-19 | 三星ダイヤモンド工業株式会社 | スクライビングホイールセット、ホルダユニット、スクライビングホイールのピン、および、スクライビングホイール |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3787489B2 (ja) | 2000-10-02 | 2006-06-21 | 三星ダイヤモンド工業株式会社 | 脆性基板のブレイク方法及び装置 |
| KR20090116749A (ko) * | 2007-01-19 | 2009-11-11 | 더치 다이아몬드 테크놀로지스 비.브이. | 절단선을 형성하기 위한 컷팅 디스크 |
| JP2011093189A (ja) | 2009-10-29 | 2011-05-12 | Mitsuboshi Diamond Industrial Co Ltd | スクライビングホイール及びその製造方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5888182A (ja) * | 1981-11-18 | 1983-05-26 | 住友電気工業株式会社 | 工具用複合硬質焼結体 |
| JP2002266865A (ja) * | 2001-03-08 | 2002-09-18 | Ngk Spark Plug Co Ltd | セラミック動圧軸受、軸受付きモータ、ハードディスク装置及びポリゴンスキャナ |
| JP2006077867A (ja) * | 2004-09-08 | 2006-03-23 | Citizen Fine Tech Co Ltd | 軸受スリーブ及びその製造方法 |
| DE202007013306U1 (de) * | 2007-09-22 | 2008-04-24 | Bohle Ag | Schneidrädchen |
| EP2239228B1 (en) * | 2008-02-06 | 2020-06-24 | Sumitomo Electric Industries, Ltd. | Polycrystalline diamond |
| DE102010017625A1 (de) * | 2010-06-28 | 2011-12-29 | Bohle Ag | Schneidwerkzeug, insbesondere Schneidrädchen und Verfahren zu dessen Herstellung |
| JP5966564B2 (ja) * | 2011-06-08 | 2016-08-10 | 三星ダイヤモンド工業株式会社 | スクライビングホイール及びスクライブ方法 |
| WO2013161849A1 (ja) * | 2012-04-24 | 2013-10-31 | 株式会社東京精密 | ダイシングブレード |
| JP5956855B2 (ja) * | 2012-07-04 | 2016-07-27 | 日本航空電子工業株式会社 | 切れ刃エッジの加工方法及び器具の製造方法 |
| JP6357746B2 (ja) * | 2013-09-24 | 2018-07-18 | 三星ダイヤモンド工業株式会社 | スクライビングホイール、ホルダユニット、スクライブ装置、スクライビングホイールの製造方法及びスクライブ方法 |
| JP2016007739A (ja) * | 2014-06-24 | 2016-01-18 | 三星ダイヤモンド工業株式会社 | スクライビングホイール及びその製造方法 |
-
2016
- 2016-05-24 JP JP2016102903A patent/JP6746128B2/ja active Active
-
2017
- 2017-05-01 TW TW106114396A patent/TWI732864B/zh active
- 2017-05-11 CN CN201710332286.7A patent/CN107415065B/zh active Active
- 2017-05-12 KR KR1020170059282A patent/KR102380301B1/ko active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3787489B2 (ja) | 2000-10-02 | 2006-06-21 | 三星ダイヤモンド工業株式会社 | 脆性基板のブレイク方法及び装置 |
| KR20090116749A (ko) * | 2007-01-19 | 2009-11-11 | 더치 다이아몬드 테크놀로지스 비.브이. | 절단선을 형성하기 위한 컷팅 디스크 |
| JP2011093189A (ja) | 2009-10-29 | 2011-05-12 | Mitsuboshi Diamond Industrial Co Ltd | スクライビングホイール及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107415065A (zh) | 2017-12-01 |
| TW201808569A (zh) | 2018-03-16 |
| JP2017209816A (ja) | 2017-11-30 |
| JP6746128B2 (ja) | 2020-08-26 |
| KR102380301B1 (ko) | 2022-03-29 |
| CN107415065B (zh) | 2020-12-29 |
| TWI732864B (zh) | 2021-07-11 |
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