KR20180004111A - 와이어소 장치 - Google Patents
와이어소 장치 Download PDFInfo
- Publication number
- KR20180004111A KR20180004111A KR1020177028728A KR20177028728A KR20180004111A KR 20180004111 A KR20180004111 A KR 20180004111A KR 1020177028728 A KR1020177028728 A KR 1020177028728A KR 20177028728 A KR20177028728 A KR 20177028728A KR 20180004111 A KR20180004111 A KR 20180004111A
- Authority
- KR
- South Korea
- Prior art keywords
- wire
- slurry
- coolant
- nozzle
- row
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0633—Grinders for cutting-off using a cutting wire
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/007—Use, recovery or regeneration of abrasive mediums
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/042—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with blades or wires mounted in a reciprocating frame
-
- H01L21/304—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Abstract
Description
도 2는 본 발명의 와이어소 장치에 배치되는 방풍판의 일례를 나타낸 개략도이다.
도 3은 종래의 일반적인 와이어소 장치를 나타낸 개략도이다.
Claims (3)
- 복수의 와이어가이드에 권회되고, 축방향으로 왕복주행하는 와이어에 의해 형성된 와이어열과, 상기 와이어에 쿨런트 또는 슬러리를 공급하는 노즐과, 유지한 워크를 상기 와이어열에 압압하는 워크이송기구를 구비하고, 상기 노즐로부터 상기 와이어에 상기 쿨런트 또는 상기 슬러리를 공급하면서, 상기 워크이송기구에 의해 유지된 상기 워크를 상기 와이어열에 압압하여 절입 이송함으로써, 상기 워크를 웨이퍼상으로 절단하는 와이어소 장치로서,
상기 노즐은 상기 와이어열의 상방에, 이 와이어열과 직행하도록 배치되고, 이 배치된 노즐의 축방향에서 본 좌우 양방에 방풍판이 배치된 것을 특징으로 하는,
와이어소 장치.
- 제1항에 있어서,
상기 방풍판은,
상기 노즐의 하면에 마련된 슬릿의 중심과의 거리가 5mm 이상 40mm 이하의 범위가 되도록 배치된 것을 특징으로 하는,
와이어소 장치.
- 제1항 또는 제2항에 있어서,
상기 방풍판은,
이 방풍판의 하면과 상기 와이어열의 거리가 1mm 이상 10mm 이하의 범위가 되도록 배치된 것을 특징으로 하는,
와이어소 장치.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2015-094358 | 2015-05-01 | ||
| JP2015094358A JP6304118B2 (ja) | 2015-05-01 | 2015-05-01 | ワイヤソー装置 |
| PCT/JP2016/001146 WO2016178297A1 (ja) | 2015-05-01 | 2016-03-03 | ワイヤソー装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20180004111A true KR20180004111A (ko) | 2018-01-10 |
| KR102568196B1 KR102568196B1 (ko) | 2023-08-18 |
Family
ID=57217580
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020177028728A Active KR102568196B1 (ko) | 2015-05-01 | 2016-03-03 | 와이어소 장치 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US10589446B2 (ko) |
| JP (1) | JP6304118B2 (ko) |
| KR (1) | KR102568196B1 (ko) |
| CN (1) | CN107427986B (ko) |
| DE (1) | DE112016001209T5 (ko) |
| SG (2) | SG10201807320WA (ko) |
| TW (1) | TWI692394B (ko) |
| WO (1) | WO2016178297A1 (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20210113204A (ko) * | 2019-01-15 | 2021-09-15 | 신에쯔 한도타이 가부시키가이샤 | 워크의 절단방법 및 와이어소 |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110962248A (zh) * | 2018-09-28 | 2020-04-07 | 胜高股份有限公司 | 线锯用加工液供给喷嘴及向线锯供给加工液的方法 |
| CN110039673A (zh) * | 2019-04-26 | 2019-07-23 | 西安奕斯伟硅片技术有限公司 | 一种切割装置和方法 |
| JP7372097B2 (ja) * | 2019-09-20 | 2023-10-31 | コマツNtc株式会社 | ワイヤソー及びワイヤソーのワークの搬入出方法 |
| CN111361030B (zh) * | 2020-04-24 | 2021-11-23 | 西安奕斯伟材料科技有限公司 | 多线切割装置及多线切割方法 |
| CN113601741B (zh) * | 2021-08-09 | 2023-06-23 | 西安奕斯伟硅片技术有限公司 | 为切割硅棒的多条切割线供应砂浆的装置及硅棒切割设备 |
| CN115816664B (zh) * | 2022-12-28 | 2024-11-12 | 泉州市品河精密科技有限公司 | 石材切割方法 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1148119A (ja) * | 1997-06-05 | 1999-02-23 | Nippei Toyama Corp | ワイヤソー |
| JP2000218615A (ja) * | 1999-01-29 | 2000-08-08 | Nippei Toyama Corp | ワイヤソー及びワークの脱着方法 |
| JP2009113173A (ja) | 2007-11-08 | 2009-05-28 | Shin Etsu Handotai Co Ltd | ワイヤソー装置 |
| JP2010023208A (ja) | 2008-07-23 | 2010-02-04 | Shin Etsu Handotai Co Ltd | ワークの切断方法及びワイヤソー |
| JP2012179712A (ja) | 2008-02-19 | 2012-09-20 | Shin Etsu Handotai Co Ltd | ワイヤソーおよびワークの切断方法 |
| JP2013010152A (ja) * | 2011-06-28 | 2013-01-17 | Komatsu Ntc Ltd | ワイヤソーの加工液ノズル |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US2899781A (en) * | 1959-08-18 | williams | ||
| US3148488A (en) * | 1961-12-11 | 1964-09-15 | Sun Tool And Machine Company | Coolant splash shield and support |
| US3325949A (en) * | 1964-11-24 | 1967-06-20 | Cincinnati Milling Machine Co | Workpiece cooling apparatus for grinding machines |
| FR1600356A (ko) * | 1968-01-09 | 1970-07-20 | ||
| US5709593A (en) * | 1995-10-27 | 1998-01-20 | Applied Materials, Inc. | Apparatus and method for distribution of slurry in a chemical mechanical polishing system |
| TW383249B (en) * | 1998-09-01 | 2000-03-01 | Sumitomo Spec Metals | Cutting method for rare earth alloy by annular saw and manufacturing for rare earth alloy board |
| JP2000153460A (ja) | 1998-11-16 | 2000-06-06 | Tokyo Seiko Co Ltd | 液体供給装置 |
| US6468134B1 (en) * | 2000-06-30 | 2002-10-22 | Lam Research Corporation | Method and apparatus for slurry distribution |
| JP3967969B2 (ja) * | 2002-06-27 | 2007-08-29 | 京セラ株式会社 | ワイヤーソー |
| JP2004195555A (ja) * | 2002-12-16 | 2004-07-15 | Komatsu Electronic Metals Co Ltd | ワイヤソー用スラリーノズル |
| JP4083152B2 (ja) | 2004-07-29 | 2008-04-30 | 日本碍子株式会社 | ワイヤーソー装置 |
| JP5072204B2 (ja) * | 2005-08-31 | 2012-11-14 | 信越半導体株式会社 | ウエーハの表面のナノトポグラフィを改善する方法及びワイヤソー装置 |
| JP5080769B2 (ja) * | 2006-09-15 | 2012-11-21 | 株式会社東京精密 | 研磨方法及び研磨装置 |
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-
2015
- 2015-05-01 JP JP2015094358A patent/JP6304118B2/ja active Active
-
2016
- 2016-03-03 US US15/558,833 patent/US10589446B2/en active Active
- 2016-03-03 SG SG10201807320WA patent/SG10201807320WA/en unknown
- 2016-03-03 DE DE112016001209.8T patent/DE112016001209T5/de active Pending
- 2016-03-03 CN CN201680016080.7A patent/CN107427986B/zh active Active
- 2016-03-03 WO PCT/JP2016/001146 patent/WO2016178297A1/ja not_active Ceased
- 2016-03-03 KR KR1020177028728A patent/KR102568196B1/ko active Active
- 2016-03-03 SG SG11201707726YA patent/SG11201707726YA/en unknown
- 2016-03-07 TW TW105106853A patent/TWI692394B/zh active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1148119A (ja) * | 1997-06-05 | 1999-02-23 | Nippei Toyama Corp | ワイヤソー |
| JP2000218615A (ja) * | 1999-01-29 | 2000-08-08 | Nippei Toyama Corp | ワイヤソー及びワークの脱着方法 |
| JP2009113173A (ja) | 2007-11-08 | 2009-05-28 | Shin Etsu Handotai Co Ltd | ワイヤソー装置 |
| KR20100085031A (ko) * | 2007-11-08 | 2010-07-28 | 신에쯔 한도타이 가부시키가이샤 | 와이어 쏘 장치 |
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| JP2012179712A (ja) | 2008-02-19 | 2012-09-20 | Shin Etsu Handotai Co Ltd | ワイヤソーおよびワークの切断方法 |
| JP2010023208A (ja) | 2008-07-23 | 2010-02-04 | Shin Etsu Handotai Co Ltd | ワークの切断方法及びワイヤソー |
| JP2013010152A (ja) * | 2011-06-28 | 2013-01-17 | Komatsu Ntc Ltd | ワイヤソーの加工液ノズル |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20210113204A (ko) * | 2019-01-15 | 2021-09-15 | 신에쯔 한도타이 가부시키가이샤 | 워크의 절단방법 및 와이어소 |
Also Published As
| Publication number | Publication date |
|---|---|
| SG11201707726YA (en) | 2017-10-30 |
| TWI692394B (zh) | 2020-05-01 |
| US10589446B2 (en) | 2020-03-17 |
| CN107427986A (zh) | 2017-12-01 |
| CN107427986B (zh) | 2019-07-09 |
| KR102568196B1 (ko) | 2023-08-18 |
| JP6304118B2 (ja) | 2018-04-04 |
| SG10201807320WA (en) | 2018-09-27 |
| TW201639680A (zh) | 2016-11-16 |
| WO2016178297A1 (ja) | 2016-11-10 |
| JP2016209947A (ja) | 2016-12-15 |
| US20180079108A1 (en) | 2018-03-22 |
| DE112016001209T5 (de) | 2017-12-07 |
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