KR20190105917A - 플렉시블 oled 셀의 초미세 이물을 검출하는 시스템 - Google Patents
플렉시블 oled 셀의 초미세 이물을 검출하는 시스템 Download PDFInfo
- Publication number
- KR20190105917A KR20190105917A KR1020180026665A KR20180026665A KR20190105917A KR 20190105917 A KR20190105917 A KR 20190105917A KR 1020180026665 A KR1020180026665 A KR 1020180026665A KR 20180026665 A KR20180026665 A KR 20180026665A KR 20190105917 A KR20190105917 A KR 20190105917A
- Authority
- KR
- South Korea
- Prior art keywords
- flexible oled
- oled cell
- ultra
- fine foreign
- line scan
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 239000000126 substance Substances 0.000 title 1
- 238000001514 detection method Methods 0.000 claims abstract description 41
- 238000007689 inspection Methods 0.000 claims abstract description 25
- 238000000034 method Methods 0.000 claims abstract description 14
- 230000008569 process Effects 0.000 claims abstract description 10
- 230000001678 irradiating effect Effects 0.000 claims abstract description 9
- 238000007781 pre-processing Methods 0.000 claims abstract description 7
- 238000005286 illumination Methods 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims description 16
- 239000000758 substrate Substances 0.000 description 6
- 238000006073 displacement reaction Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 239000010408 film Substances 0.000 description 3
- 238000012937 correction Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/70—Testing, e.g. accelerated lifetime tests
-
- H01L51/0031—
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/94—Investigating contamination, e.g. dust
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N2021/1765—Method using an image detector and processing of image signal
- G01N2021/177—Detector of the video camera type
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/94—Investigating contamination, e.g. dust
- G01N2021/945—Liquid or solid deposits of macroscopic size on surfaces, e.g. drops, films, or clustered contaminants
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
Claims (3)
- 플렉시블(Flexible) OLED(Organic Light Emitting Diode) 셀(cell)의 초미세 이물 검출 시스템에 있어서,
플렉시블 OLED 셀이 안착되고 10㎛ 이내의 진동 제한값을 갖는 장착대;
상기 장착대에서의 상기 플렉시블 OLED 셀의 로딩에 대응하는 검사영역을 자동으로 설정하고, 100mm의/s의 속도로 이동하여 상기 플렉시블 OLED 셀을 촬영하는 라인스캔 카메라;
상기 라인스캔 카메라에 장착되는 고해상도 렌즈;
상기 라인스캔 카메라가 촬영하는 상기 플렉시블 OLED 셀을 향하여 빛을 조사하고, 전체 영상에서 그레이(gray) 차이가 10 미만의 값을 갖도록 고휘도 및 고균일도의 빛을 조사하는 조명; 및
상기 촬영된 영상에 대하여 다수의 전처리 프로세스를 순차적으로 수행하고, 영상에 대한 검사 영역을 16장의 영역으로 분할하여 각 영역마다 초미세 이물을 검출하며, 초미세 이물에 대한 검출 의심 영역에 대하여 별도의 정밀 검출 알고리즘을 적용하는 초미세 이물 검출부
를 포함하는 것을 특징으로 하는 플렉시블 OLED 셀의 초미세 이물 검출 시스템. - 제1항에 있어서,
상기 라인스캔 카메라는 상기 플렉시블 OLED 셀의 네 개의 모서리를 검출하고, 상기 검출 모서리를 기준으로 내측영역을 설정하며 상기 검출 모서리를 기준으로 외곽검사영역을 설정하여 촬영하는 것을 특징으로 하는 플렉시블 OLED 셀의 초미세 이물 검출 시스템. - 제1항에 있어서,
상기 플렉시블 OLED 셀의 초미세 이물 검출 시스템은 16K의 해상도를 갖는 상기 라인 스캔 카메라를 통해 4인치 내지 5.5인치의 플레시블 패널 전체를 이미지 스캔하여 50㎛*50㎛의 사이즈를 갖는 이물을 검출하는 것을 특징으로 하는 플렉시블 OLED 셀의 초미세 이물 검출 시스템.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020180026665A KR20190105917A (ko) | 2018-03-07 | 2018-03-07 | 플렉시블 oled 셀의 초미세 이물을 검출하는 시스템 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020180026665A KR20190105917A (ko) | 2018-03-07 | 2018-03-07 | 플렉시블 oled 셀의 초미세 이물을 검출하는 시스템 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20190105917A true KR20190105917A (ko) | 2019-09-18 |
Family
ID=68070836
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020180026665A Ceased KR20190105917A (ko) | 2018-03-07 | 2018-03-07 | 플렉시블 oled 셀의 초미세 이물을 검출하는 시스템 |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR20190105917A (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113281017A (zh) * | 2021-06-09 | 2021-08-20 | 深圳市洲明科技股份有限公司 | 一种显示屏的质量检测方法、终端及存储介质 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101618792B1 (ko) | 2014-11-11 | 2016-05-09 | 주식회사 트윔 | 패널 얼라인 장치 |
-
2018
- 2018-03-07 KR KR1020180026665A patent/KR20190105917A/ko not_active Ceased
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101618792B1 (ko) | 2014-11-11 | 2016-05-09 | 주식회사 트윔 | 패널 얼라인 장치 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113281017A (zh) * | 2021-06-09 | 2021-08-20 | 深圳市洲明科技股份有限公司 | 一种显示屏的质量检测方法、终端及存储介质 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI761880B (zh) | 基板缺陷檢查裝置、方法、電腦可讀記錄介質及電腦程式產品 | |
| US9064922B2 (en) | Substrate inspection apparatus and substrate inspection method | |
| CN100367293C (zh) | 用于显示器的光学检测的方法和装置 | |
| TWI752558B (zh) | 晶粒接合裝置及半導體裝置之製造方法 | |
| US20090067701A1 (en) | System and method for detecting blemishes on surface of object | |
| KR20180103701A (ko) | 다이 본딩 장치 및 반도체 장치의 제조 방법 | |
| JP2002310929A (ja) | 欠陥検査装置 | |
| JP7157580B2 (ja) | 基板検査方法及び基板検査装置 | |
| JP5178781B2 (ja) | センサ出力データの補正装置及びセンサ出力データの補正方法 | |
| CN1469449A (zh) | 标记位置检测装置和标记位置检测方法 | |
| JP2014109436A (ja) | 基板の欠陥検査方法、基板の欠陥検査装置、プログラム及びコンピュータ記憶媒体 | |
| CN103247548A (zh) | 一种晶圆缺陷检测装置及方法 | |
| TWI236562B (en) | A method of detecting a pattern and an apparatus thereof | |
| JP5531883B2 (ja) | 調整方法 | |
| US10727141B2 (en) | Method for inspecting sensor package structure, inspection apparatus, and focus assistant loader of inspection apparatus | |
| JP2013117490A (ja) | 検査システム及びレシピ設定方法 | |
| KR20190105917A (ko) | 플렉시블 oled 셀의 초미세 이물을 검출하는 시스템 | |
| KR102069061B1 (ko) | 플렉시블 oled 셀의 영상 획득 시스템 | |
| TW584708B (en) | Method and apparatus for measuring a line width | |
| JP2007093330A (ja) | 欠陥抽出装置及び欠陥抽出方法 | |
| US20100150430A1 (en) | Visual inspection apparatus and visual inspection method for semiconductor laser chip or semiconductor laser bar | |
| CN112164661B (zh) | 晶圆检测设备 | |
| JP2017003969A (ja) | 複合フィルムの欠陥判別方法 | |
| KR20170122321A (ko) | 표시 패널의 광학 검사 방법 | |
| JP2009063365A (ja) | 検査装置及び検査方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 20180307 |
|
| PA0201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20190820 Patent event code: PE09021S01D |
|
| PG1501 | Laying open of application | ||
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
Patent event date: 20200226 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20190820 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |