KR20200033874A - 멀티 와이어 배선판의 제조 방법, 및 멀티 와이어 배선판 - Google Patents
멀티 와이어 배선판의 제조 방법, 및 멀티 와이어 배선판 Download PDFInfo
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- KR20200033874A KR20200033874A KR1020207003548A KR20207003548A KR20200033874A KR 20200033874 A KR20200033874 A KR 20200033874A KR 1020207003548 A KR1020207003548 A KR 1020207003548A KR 20207003548 A KR20207003548 A KR 20207003548A KR 20200033874 A KR20200033874 A KR 20200033874A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4685—Manufacturing of cross-over conductors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
- H01B3/305—Polyamides or polyesteramides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
- H01B3/306—Polyimides or polyesterimides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
- H01B3/443—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from vinylhalogenides or other halogenoethylenic compounds
- H01B3/445—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from vinylhalogenides or other halogenoethylenic compounds from vinylfluorides or other fluoroethylenic compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
- H01P3/081—Microstriplines
- H01P3/082—Multilayer dielectric
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
- H01P3/088—Stacked transmission lines
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10356—Cables
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- Production Of Multi-Layered Print Wiring Board (AREA)
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Abstract
Description
도 2는, 도 1에 나타낸 멀티 와이어 배선판을 제조하기 위한 방법을 순차적으로 나타내는 단면도이다.
도 3은, 도 2에 나타낸 포선공정에서 절연 피복 와이어를 접착층에 포선하는 작업을 모식적으로 나타낸 도면이다.
도 4는, 도 1에 나타낸 멀티 와이어 배선판을 1유닛으로 하고, 3유닛 적층한 다층 멀티 와이어 배선판을 나타내는 단면도이다.
Claims (12)
- 더미(dummy) 기판 위에 제1 금속박을 배치하는 공정,
상기 제1 금속박 위에 접착층을 설치하는 공정,
상기 접착층 상에 절연 피복 와이어를 소정 패턴으로 되도록 포선(wiring)하는 공정,
상기 절연 피복 와이어를 포선한 후에 상기 접착층 위에 절연층을 형성하는 공정,
상기 절연층 위에 제2 금속박을 배치하는 공정, 및
상기 제1 금속박으로부터 상기 더미 기판을 제거하는 공정
을 포함하는, 멀티 와이어 배선판의 제조 방법. - 제1항에 있어서,
상기 제1 금속박을 배치하는 공정에 있어서, 제3 금속박을 통하여 상기 더미 기판 위에 상기 제1 금속박을 배치하고,
상기 더미 기판을 제거하는 공정에 있어서, 상기 제1 금속박으로부터 상기 제3 금속박을 박리하는, 멀티 와이어 배선판의 제조 방법. - 제2항에 있어서,
상기 절연 피복 와이어의 선 직경이 140㎛ 이하이며, 상기 제3 금속박의 두께가 50㎛ 이상인, 멀티 와이어 배선판의 제조 방법. - 제2항 또는 제3항에 있어서,
상기 제3 금속박의 두께가 상기 제1 금속박보다 두꺼운, 멀티 와이어 배선판의 제조 방법. - 제2항 내지 제4항 중 어느 한 항에 있어서,
상기 제1 금속박을 배치하는 공정에 있어서, 상기 제1 금속박과 상기 제3 금속박이 일체화하고 또한 서로 박리 가능한 금속박을 상기 더미 기판 위에 배치하는, 멀티 와이어 배선판의 제조 방법. - 제1항 내지 제5항 중 어느 한 항에 있어서,
상기 더미 기판은 그 표면적이 상기 제1 금속박보다 크고,
상기 제1 금속박을 배치하는 공정에 있어서, 상기 제1 금속박을 덮도록 절연 프리프레그를 적층하고 상기 절연 프리프레그를 상기 더미 기판의 에지에 접착시키고, 이로써 상기 제1 금속박을 상기 더미 기판 상에 가고정하고,
상기 접착층을 설치하는 공정에서는, 상기 절연 프리프레그를 사이에 두고 상기 제1 금속박 위에 상기 접착층을 적층하는, 멀티 와이어 배선판의 제조 방법. - 제1항 내지 제6항 중 어느 한 항에 있어서,
상기 포선하는 공정에 있어서, 상기 절연 피복 와이어를 초음파 접착에 의해 상기 접착층 상에 포선하는, 멀티 와이어 배선판의 제조 방법. - 제1항 내지 제7항 중 어느 한 항에 있어서,
상기 접착층은, 열경화성 또는 광경화성의 접착 재료를 포함하는 접착 시트로 형성되어 있고,
상기 포선하는 공정에 있어서, 상기 절연 피복 와이어를 포선한 후에 상기 접착 시트를 열경화 또는 광경화하여, 상기 절연 피복 와이어 중 적어도 일부가 상기 접착 시트에 매립된 상태로 상기 절연 피복 와이어가 상기 접착 시트에 고정되는, 멀티 와이어 배선판의 제조 방법. - 제1항 내지 제8항 중 어느 한 항에 기재된 멀티 와이어 배선판의 제조 방법에 의해 제조된 멀티 와이어 배선판을 1유닛으로 하고, 짝수 유닛 또는 홀수 유닛을 중첩하여 다층 유닛의 배선판을 형성하는, 다층 멀티 와이어 배선판의 제조 방법.
- 소정 패턴으로 포선되는 절연 피복 와이어,
상기 절연 피복 와이어 중 적어도 일부가 매립되고, 상기 절연 피복 와이어를 접착제에 의해 고정시키는 접착 고정층,
상기 접착 고정층 위에 적층되고, 상기 접착 고정층과 함께 상기 절연 피복 와이어를 덮는 절연층, 및
상기 접착 고정층과 상기 절연층을 포함하는 적층체의 양면에 설치되는 제1 도체층 및 제2 도체층
을 포함하고,
상기 제1 도체층 및 상기 제2 도체층이 모두 독립된 금속박으로 구성되어 있는, 멀티 와이어 배선판. - 제10항에 있어서,
상기 제1 도체층 또는 상기 제2 도체층 중 적어도 한쪽은, 그 두께가 10㎛ 이하인, 멀티 와이어 배선판. - 제10항 또는 제11항에 기재된 멀티 와이어 배선판을 1유닛으로 하고, 짝수 유닛 또는 홀수 유닛을 중첩하여 다층 유닛의 배선판으로서 구성되는, 다층 멀티 와이어 배선판.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2017/028784 WO2019030825A1 (ja) | 2017-08-08 | 2017-08-08 | マルチワイヤ配線板の製造方法、及びマルチワイヤ配線板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20200033874A true KR20200033874A (ko) | 2020-03-30 |
| KR102404116B1 KR102404116B1 (ko) | 2022-05-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020207003548A Active KR102404116B1 (ko) | 2017-08-08 | 2017-08-08 | 멀티 와이어 배선판의 제조 방법, 및 멀티 와이어 배선판 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6935817B2 (ko) |
| KR (1) | KR102404116B1 (ko) |
| WO (1) | WO2019030825A1 (ko) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63195B2 (ko) * | 1982-08-19 | 1988-01-06 | Tore Kk | |
| JPH06209150A (ja) * | 1993-01-08 | 1994-07-26 | Hitachi Chem Co Ltd | 配線板の製造方法 |
| JP2005026548A (ja) * | 2003-07-04 | 2005-01-27 | Hitachi Chem Co Ltd | マルチワイヤ配線板の製造方法 |
| JP2011155045A (ja) | 2010-01-26 | 2011-08-11 | Hitachi Chem Co Ltd | マルチワイヤ配線板及びその製造方法 |
| JP2015179833A (ja) | 2014-02-27 | 2015-10-08 | 日立化成株式会社 | マルチワイヤ配線板 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63195A (ja) * | 1986-06-19 | 1988-01-05 | 日立化成工業株式会社 | 配線板の製造法 |
-
2017
- 2017-08-08 JP JP2019535478A patent/JP6935817B2/ja active Active
- 2017-08-08 KR KR1020207003548A patent/KR102404116B1/ko active Active
- 2017-08-08 WO PCT/JP2017/028784 patent/WO2019030825A1/ja not_active Ceased
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63195B2 (ko) * | 1982-08-19 | 1988-01-06 | Tore Kk | |
| JPH06209150A (ja) * | 1993-01-08 | 1994-07-26 | Hitachi Chem Co Ltd | 配線板の製造方法 |
| JP2005026548A (ja) * | 2003-07-04 | 2005-01-27 | Hitachi Chem Co Ltd | マルチワイヤ配線板の製造方法 |
| JP2011155045A (ja) | 2010-01-26 | 2011-08-11 | Hitachi Chem Co Ltd | マルチワイヤ配線板及びその製造方法 |
| JP2015179833A (ja) | 2014-02-27 | 2015-10-08 | 日立化成株式会社 | マルチワイヤ配線板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6935817B2 (ja) | 2021-09-15 |
| KR102404116B1 (ko) | 2022-05-30 |
| JPWO2019030825A1 (ja) | 2020-08-13 |
| WO2019030825A1 (ja) | 2019-02-14 |
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