KR20200052836A - 카세트 배치 기구 - Google Patents
카세트 배치 기구 Download PDFInfo
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- KR20200052836A KR20200052836A KR1020190137284A KR20190137284A KR20200052836A KR 20200052836 A KR20200052836 A KR 20200052836A KR 1020190137284 A KR1020190137284 A KR 1020190137284A KR 20190137284 A KR20190137284 A KR 20190137284A KR 20200052836 A KR20200052836 A KR 20200052836A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
- H10P72/3218—Conveying cassettes, containers or carriers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3406—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door or cover
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- H01L21/6773—
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- H01L21/67346—
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- H01L21/67369—
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- H01L21/67379—
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- H01L21/67757—
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- H01L21/67766—
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- H01L21/67772—
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- H01L21/68—
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/14—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/18—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] characterised by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
- H10P72/1911—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by materials, roughness, coatings or the like
- H10P72/1912—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by materials, roughness, coatings or the like characterised by shock absorbing elements, e.g. retainers or cushions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
- H10P72/1918—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
- H10P72/3312—Vertical transfer of a batch of workpieces
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3402—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3404—Storage means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Engineering & Computer Science (AREA)
- Robotics (AREA)
Abstract
[해결수단] 판형의 피가공물을 가공하는 가공 장치에 병설되는 카세트 배치 기구로서, 피가공물을 수용하는 카세트가 배치되는, 배치대와, 배치대의 측방에 배치되며, 배치대에 배치된 카세트로부터 피가공물을 반송할 때에 피가공물을 통과시키는 개구부를 갖는, 프레임부와, 프레임부의 배치대와는 반대측에 마련되며, 개구부를 폐쇄하는, 도어부와, 프레임부의 배치대측에 마련되며, 배치대에 배치되는 카세트의 프레임부측의 일부를 제외한 측부를 보호할 수 있게 구성되는, 커버부와, 카세트의 프레임부측의 일부를 제외한 측부를 보호하는 보호 위치와 보호 위치보다 하방의 후퇴 위치 사이에서, 커버부를 승강시키는, 승강 기구를 구비하는, 카세트 배치 기구를 제공한다.
Description
도 2는 커버부 및 이동 기구의 사시도이다.
도 3은 도 2의 영역 A를 확대한 일부 단면 측면도이다.
도 4는 반송 작업 중의 모습을 나타내는 사시도이다.
도 5는 가공 및 반송 작업 종료 후의 모습을 나타내는 사시도이다.
도 6의 (a)는 카세트를 배치대에 배치하는 단계 S10을 나타내는 도면이고, 도 6의 (b)는 커버부를 보호 위치로 상승시키는 단계 S20을 나타내는 도면이며, 도 6의 (c)는 도어부를 개방 위치로 이동시킨 후, 반송 및 가공 작업을 행하는 단계 S30을 나타내는 도면이고, 도 6의 (d)는 도어부를 폐쇄 위치로 이동시키는 단계 S40을 나타내는 도면이며, 도 6의 (e)는 커버부를 후퇴 위치로 하강시키는 단계 S50을 나타내는 도면이다.
도 7은 제2 실시형태에 따른 가공 장치 및 카세트 배치 기구의 사시도이다.
도 8은 제3 실시형태에 따른 풋 스위치부의 사시도이다.
2a: 정면 3: 테이프
4: 모니터 5: 환형 프레임
6: 반송 아암 8: 제어부
9: 웨이퍼 유닛 10: 카세트 배치 기구
12: 베이스부 12a: 개구부
12b: 페달(풋 스위치부) 14: 배치대
16: 커버부 16a: 제1 측면부
16b: 제2 측면부 16c: 정면부
16d: 상단부 18: 승강 기구
20: 브래킷 20a: 제1 직선부
20b: 제2 직선부 20c: 제3 직선부
20d: 제1 코너부 20e: 제2 코너부
22a, 22b: 로드리스 실린더 24a, 24b: 보디부
24c, 24d: 실린더 튜브 24e, 24f: 베이스부
24g, 24h: 슬라이더 24i, 24j: 가이드 레일
26: 프레임부 26a: 정면
26b: 배면 26c: 개구부
26d: 캐스터 28: 도어부
30: 카세트 32a: 제1 측면부
32b: 제2 측면부 32c: 접속부
32d: 손잡이 32e: 선반판
32f: 걸림부측 32g: 반출입부측
A: 영역 40: 발광 소자
42: 수광 소자
Claims (3)
- 판형의 피가공물을 가공하는 가공 장치에 병설되는 카세트 배치 기구로서,
상기 피가공물을 수용하는 카세트가 배치되는, 배치대와,
상기 배치대의 측방에 배치되며, 상기 배치대에 배치된 상기 카세트로부터 상기 피가공물을 반송할 때에 상기 피가공물을 통과시키는 개구부를 갖는, 프레임부와,
상기 프레임부의 상기 배치대와는 반대측에 마련되며, 상기 개구부를 폐쇄하는, 도어부와,
상기 프레임부의 상기 배치대측에 마련되며, 상기 배치대에 배치되는 상기 카세트의 상기 프레임부측의 일부를 제외한 측부를 보호할 수 있게 구성되는, 커버부와,
상기 카세트의 상기 프레임부측의 상기 일부를 제외한 상기 측부를 보호하는 보호 위치와 상기 보호 위치보다 하방의 후퇴 위치 사이에서, 상기 커버부를 승강시키는, 승강 기구
를 구비하는 것을 특징으로 하는 카세트 배치 기구. - 제 1항에 있어서,
상기 카세트 배치 기구는,
상기 커버부가 상기 보호 위치로 상승된 것을 조건으로 하여, 상기 도어부가 상기 개구부를 폐쇄하는 폐쇄 위치로부터 상기 개구부를 개방하는 개방 위치로 이동되고, 또한,
상기 도어부가 상기 개방 위치로부터 상기 폐쇄 위치로 이동된 것을 조건으로 하여, 상기 커버부가 상기 후퇴 위치로 하강되도록 구성되는 것을 특징으로 하는 카세트 배치 기구. - 제 1항 또는 제 2항에 있어서,
상기 배치대의 하방에 마련되며, 상기 승강 기구를 동작시킬 수 있는 풋 스위치부를 더 구비하는 것을 특징으로 하는 카세트 배치 기구.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2018-209753 | 2018-11-07 | ||
| JP2018209753A JP7330606B2 (ja) | 2018-11-07 | 2018-11-07 | 加工装置及びカセット載置機構 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20200052836A true KR20200052836A (ko) | 2020-05-15 |
| KR102721340B1 KR102721340B1 (ko) | 2024-10-23 |
Family
ID=70555898
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020190137284A Active KR102721340B1 (ko) | 2018-11-07 | 2019-10-31 | 카세트 배치 기구 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7330606B2 (ko) |
| KR (1) | KR102721340B1 (ko) |
| CN (1) | CN111162033B (ko) |
| TW (1) | TWI827722B (ko) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6906674B1 (ja) * | 2020-12-11 | 2021-07-21 | リンテック株式会社 | フレーム収容装置およびフレーム収容方法 |
| CN112242338B (zh) * | 2020-12-18 | 2021-03-02 | 西安奕斯伟硅片技术有限公司 | 能够保持foup的盖部的洁净度的装载端口及设备前端模块 |
| WO2024161644A1 (ja) * | 2023-02-03 | 2024-08-08 | ヤマハ発動機株式会社 | レーザ加工装置、半導体チップおよび半導体チップの製造方法 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10308440A (ja) * | 1997-05-01 | 1998-11-17 | Tokyo Electron Ltd | 操作器付きキャリア |
| JP2000091411A (ja) | 1998-09-11 | 2000-03-31 | Disco Abrasive Syst Ltd | カセット |
| JP2007250563A (ja) * | 2006-03-13 | 2007-09-27 | Disco Abrasive Syst Ltd | 研削装置 |
| KR20110005657A (ko) * | 2009-07-10 | 2011-01-18 | 신포니아 테크놀로지 가부시끼가이샤 | 로드 포트 장치 및 그 덮개체 착탈 장치 및 매핑 장치의 각 승강 기구의 제어 방법 |
| KR20180087260A (ko) * | 2015-11-30 | 2018-08-01 | 신포니아 테크놀로지 가부시끼가이샤 | 로드 포트 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0358443B1 (en) * | 1988-09-06 | 1997-11-26 | Canon Kabushiki Kaisha | Mask cassette loading device |
| JPH07211764A (ja) * | 1994-01-20 | 1995-08-11 | Nikon Corp | レーザ応用装置 |
| JPH10261686A (ja) * | 1997-03-17 | 1998-09-29 | Dainippon Screen Mfg Co Ltd | 基板処理装置および基板搬入搬出装置 |
| JP4195227B2 (ja) | 2002-02-22 | 2008-12-10 | 東京エレクトロン株式会社 | 被処理体の導入ポート構造 |
| JP2012216752A (ja) | 2011-03-31 | 2012-11-08 | Tokyo Electron Ltd | ロードロックモジュール、ウエハ加工処理システム及びウエハの加工処理方法 |
| JP2016181655A (ja) | 2015-03-25 | 2016-10-13 | 株式会社テックインテック | カセットステージおよび基板処理装置 |
| JP6551197B2 (ja) | 2015-11-30 | 2019-07-31 | シンフォニアテクノロジー株式会社 | ロードポート |
| JP6804146B2 (ja) * | 2016-11-10 | 2020-12-23 | 株式会社ディスコ | 搬送装置、加工装置及び搬送方法 |
-
2018
- 2018-11-07 JP JP2018209753A patent/JP7330606B2/ja active Active
-
2019
- 2019-10-31 KR KR1020190137284A patent/KR102721340B1/ko active Active
- 2019-11-01 CN CN201911059612.7A patent/CN111162033B/zh active Active
- 2019-11-05 TW TW108140132A patent/TWI827722B/zh active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10308440A (ja) * | 1997-05-01 | 1998-11-17 | Tokyo Electron Ltd | 操作器付きキャリア |
| JP2000091411A (ja) | 1998-09-11 | 2000-03-31 | Disco Abrasive Syst Ltd | カセット |
| JP2007250563A (ja) * | 2006-03-13 | 2007-09-27 | Disco Abrasive Syst Ltd | 研削装置 |
| KR20110005657A (ko) * | 2009-07-10 | 2011-01-18 | 신포니아 테크놀로지 가부시끼가이샤 | 로드 포트 장치 및 그 덮개체 착탈 장치 및 매핑 장치의 각 승강 기구의 제어 방법 |
| KR20180087260A (ko) * | 2015-11-30 | 2018-08-01 | 신포니아 테크놀로지 가부시끼가이샤 | 로드 포트 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI827722B (zh) | 2024-01-01 |
| JP2020077737A (ja) | 2020-05-21 |
| TW202018853A (zh) | 2020-05-16 |
| CN111162033A (zh) | 2020-05-15 |
| KR102721340B1 (ko) | 2024-10-23 |
| JP7330606B2 (ja) | 2023-08-22 |
| CN111162033B (zh) | 2025-03-04 |
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