KR20200078511A - 히터 및 그 제조 방법 - Google Patents
히터 및 그 제조 방법 Download PDFInfo
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- H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
- H10P72/722—Details of electrostatic chucks
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- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
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- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7614—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
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- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material
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- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- H01R4/28—Clamped connections, spring connections
- H01R4/30—Clamped connections, spring connections utilising a screw or nut clamping member
- H01R4/34—Conductive members located under head of screw
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
- H01R4/64—Connections between or with conductive parts having primarily a non-electric function, e.g. frame, casing, rail
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- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
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- H05B2203/017—Manufacturing methods or apparatus for heaters
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- H—ELECTRICITY
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- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
- H05B3/143—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds applied to semiconductors, e.g. wafers heating
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Abstract
[해결 수단] 단자(A, B) 사이에 히터 패턴(31, 32)이 병렬로 설치된 히터(30)에 있어서, 각 단자가 히터 패턴(31)에만 도통하는 분할 단자(37)와, 히터 패턴(32)에만 도통하는 분할 단자(38)로 분할되어 있다. 히터 본체(36)를 제작한 후, 급전 볼트(50)를 장착하기 전의 상태에서, 분할 단자(37, 37) 사이에 형성되는 가상 직렬 경로(45)와, 분할 단자(38, 38) 사이에 형성되는 가상 직렬 경로(46)의 각각에 대해 저항 조정한 후, 각 단자에 급전 볼트를 장착함으로써 복수의 가상 직렬 히터 패턴끼리를 도통시켜 병렬 회로를 형성한다.
Description
| 측정 구간 | 설계 저항값 (Ω) |
| A-P11 | 1.26 (r11) |
| P11-P12 | 1.19 (r12) |
| P12-B | 0.77 (r13) |
| B-P13 | 1.26 (r14) |
| P13-P14 | 1.19 (r15) |
| P14-A | 0.77 (r16) |
도 2는 도 1의 단자부 확대 평면도(a) 및 동 도면 중 I-I 절단선에 의한 단면도 (b)이다.
도 3은 급전 볼트가 제거된 상태의 전체 평면도이다.
도 4는 도 3의 단자부 확대 평면도(a) 및 동 도면 중 II-II 절단선에 의한 단면도 (b)이다.
도 5는 도 3 및 도 4에 도시하는 상태에서 저항 조정을 행하는 설명도이다.
도 6은 본 발명의 다른 실시형태(실시예 2)에 의한 병렬형 히터에 있어서 도 3과 마찬가지로 급전 볼트가 제거된 상태를 도시하는 전체 평면도이다.
도 7은 종래기술에 의한 직렬형 히터의 전체 평면도이다.
도 8은 종래기술에 의한 병렬형 히터의 전체 평면도이다.
도 9는 도 7의 직렬형 히터의 히터 패턴에 저항 측정점을 설치한 전체 평면도 (a) 및 그 저항 조정 설명도이다.
도 10은 도 8의 병렬형 히터의 히터 패턴에 저항 측정점을 설치한 전체 평면도 (a) 및 그 저항 조정 설명도 (b)이다.
도 11은 도 8의 병렬형 히터에 관한 저항 조정이 어려운 것을 구체예로 나타내는 저항 조정 설명도이다.
20 병렬형 히터(종래기술)
30 병렬형 히터(본 발명 실시예)
31, 32 병렬 히터 패턴
33 히터 베이스
34 히터 엘리먼트
35 오버코트
36 히터 본체
37, 38 분할 단자부(2분할)
39 볼트구멍
40 급전 볼트
41 너트
42 와셔
43 와셔
44 간극
45, 46 경로
50 병렬형 히터(본 발명 실시예)
51∼54 병렬 히터 패턴
55∼58 분할 단자부(4분할)
59 간극
Claims (7)
- 각각에 급전 볼트가 장착되는 한 쌍의 단자 사이에 복수의 히터 패턴이 병렬로 형성된 병렬형 히터로서, 각 단자는 히터 패턴수에 따라 복수개로 서로 비접촉으로 분할되고, 이들 복수의 분할 단자끼리가 급전 볼트에 의해 도통되어 있고, 급전 볼트가 장착되지 않은 상태에서는 일방의 단자 중 하나의 분할 단자 부재와 타방의 단자 중 하나의 분할 단자 사이에 복수의 가상 직렬 히터 패턴이 형성되고, 급전 볼트가 장착됨으로써 복수의 가상 직렬 히터 패턴끼리가 도통하여 병렬 회로가 형성되는 것을 특징으로 하는 병렬형 히터.
- 제1항에 있어서, 급전 볼트의 머리부가 직접 또는 도전성 재료로 이루어지는 와셔를 통하여 히터 패턴을 형성하는 히터 엘리먼트에 접촉하고 있는 것을 특징으로 하는 병렬형 히터.
- 제1항 또는 제2항에 있어서, 한 쌍의 단자 사이에 제1 및 제2 히터 패턴이 병렬로 형성되고, 각 단자는 제1 히터 패턴에만 도통하는 제1 분할 단자와, 제2 히터 패턴에만 도통하는 제2 분할 단자로 분할되어 있는 것을 특징으로 하는 병렬형 히터.
- 제3항에 있어서, 제1 및 제2 분할 단자는 각각 대략 반원 링 형상으로 형성되고, 그것들의 사이에 직경 방향으로 연장되도록 설치되는 간극으로 제1 및 제2 히터 패턴이 절연되어 있는 것을 특징으로 하는 병렬형 히터.
- 제1항 또는 제2항에 있어서, 한 쌍의 단자 사이에 제1 내지 제4 히터 패턴이 병렬로 형성되고, 각 단자는 제1 히터 패턴에만 도통하는 제1 분할 단자와, 제2 히터 패턴에만 도통하는 제2 분할 단자와, 제3 히터 패턴에만 도통하는 제3 분할 단자와, 제4 히터 패턴에만 도통하는 제4 분할 단자로 분할되어 있는 것을 특징으로 하는 병렬형 히터.
- 제5항에 있어서, 제1 내지 제4 분할 단자는 각각 대략 4반원 링 형상으로 형성되고, 그것들 사이에 직경 방향 및 원주 방향으로 연장되도록 설치되는 간극으로 제1 내지 제4 히터 패턴이 절연되어 있는 것을 특징으로 하는 병렬형 히터.
- 한 쌍의 단자 사이에 복수의 히터 패턴이 병렬로 형성된 히터 본체를 제작하고, 각 단자에 급전 볼트를 장착하기 전의 상태에서, 일방의 단자 중 하나의 분할 단자와 타방의 단자 중 하나의 분할 단자 사이에 형성되는 복수의 가상 직렬 히터 패턴에 대해 저항 조정을 행한 후, 각 단자에 급전 볼트를 장착함으로써 복수의 가상 직렬 히터 패턴끼리를 도통시켜 병렬 회로를 형성하는 것을 특징으로 하는 제1항 내지 제6항 중 어느 한 항에 기재된 병렬형 히터의 제조 방법.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017209520A JP6927851B2 (ja) | 2017-10-30 | 2017-10-30 | ヒータおよびその製造方法 |
| JPJP-P-2017-209520 | 2017-10-30 | ||
| PCT/JP2018/036650 WO2019087645A1 (ja) | 2017-10-30 | 2018-10-01 | ヒータおよびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20200078511A true KR20200078511A (ko) | 2020-07-01 |
| KR102586537B1 KR102586537B1 (ko) | 2023-10-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020207012171A Active KR102586537B1 (ko) | 2017-10-30 | 2018-10-01 | 히터 및 그 제조 방법 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US20200329534A1 (ko) |
| EP (1) | EP3706507B1 (ko) |
| JP (1) | JP6927851B2 (ko) |
| KR (1) | KR102586537B1 (ko) |
| CN (1) | CN111279790B (ko) |
| TW (1) | TWI787310B (ko) |
| WO (1) | WO2019087645A1 (ko) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2023023346A (ja) * | 2021-08-05 | 2023-02-16 | 日本特殊陶業株式会社 | マイクロヒータ及びガスセンサ |
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| JP2004087476A (ja) * | 2002-06-26 | 2004-03-18 | Okazaki Mfg Co Ltd | ウェハ加熱用熱盤の構造および熱盤の電極固定方法 |
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| US20120318785A1 (en) * | 2011-06-15 | 2012-12-20 | Shin-Etsu Chemical Co., Ltd. | Ceramic heater |
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| US6861165B2 (en) * | 2000-02-24 | 2005-03-01 | Ibiden Co., Ltd. | Aluminum nitride sintered compact, ceramic substrate, ceramic heater and electrostatic chuck |
| JPWO2002043441A1 (ja) | 2000-11-24 | 2004-04-02 | イビデン株式会社 | セラミックヒータ、および、セラミックヒータの製造方法 |
| JP2004296254A (ja) * | 2003-03-27 | 2004-10-21 | Sumitomo Electric Ind Ltd | セラミックスヒータおよびそれを搭載した半導体あるいは液晶製造装置 |
| US7361865B2 (en) * | 2003-08-27 | 2008-04-22 | Kyocera Corporation | Heater for heating a wafer and method for fabricating the same |
| US7280370B2 (en) * | 2005-08-26 | 2007-10-09 | Delphi Technologies, Inc. | Electronic package and circuit board having segmented contact pads |
| US8168050B2 (en) * | 2006-07-05 | 2012-05-01 | Momentive Performance Materials Inc. | Electrode pattern for resistance heating element and wafer processing apparatus |
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2017
- 2017-10-30 JP JP2017209520A patent/JP6927851B2/ja active Active
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2018
- 2018-07-28 TW TW107126253A patent/TWI787310B/zh active
- 2018-10-01 US US16/754,026 patent/US20200329534A1/en not_active Abandoned
- 2018-10-01 KR KR1020207012171A patent/KR102586537B1/ko active Active
- 2018-10-01 EP EP18874708.3A patent/EP3706507B1/en active Active
- 2018-10-01 WO PCT/JP2018/036650 patent/WO2019087645A1/ja not_active Ceased
- 2018-10-01 CN CN201880070242.4A patent/CN111279790B/zh active Active
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2024
- 2024-03-07 US US18/598,430 patent/US12432820B2/en active Active
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| JPH09102665A (ja) * | 1995-10-04 | 1997-04-15 | Omron Corp | 回路基板 |
| JPH10233436A (ja) * | 1997-02-18 | 1998-09-02 | Toto Ltd | 静電チャック |
| JPH11317284A (ja) * | 1998-04-30 | 1999-11-16 | Komatsu Ltd | 温度制御装置 |
| JPH11354260A (ja) | 1998-06-11 | 1999-12-24 | Shin Etsu Chem Co Ltd | 複層セラミックスヒータ |
| JP2004087476A (ja) * | 2002-06-26 | 2004-03-18 | Okazaki Mfg Co Ltd | ウェハ加熱用熱盤の構造および熱盤の電極固定方法 |
| JP2005093746A (ja) * | 2003-09-18 | 2005-04-07 | Sanko:Kk | 熱処理炉 |
| US20120318785A1 (en) * | 2011-06-15 | 2012-12-20 | Shin-Etsu Chemical Co., Ltd. | Ceramic heater |
| US20140263281A1 (en) * | 2013-03-13 | 2014-09-18 | Shin-Etsu Chemical Co., Ltd. | Ceramic heater |
| US10679873B2 (en) * | 2016-09-30 | 2020-06-09 | Ngk Spark Plug Co., Ltd. | Ceramic heater |
Also Published As
| Publication number | Publication date |
|---|---|
| EP3706507A1 (en) | 2020-09-09 |
| KR102586537B1 (ko) | 2023-10-10 |
| CN111279790A (zh) | 2020-06-12 |
| US20240215116A1 (en) | 2024-06-27 |
| EP3706507A4 (en) | 2021-09-08 |
| CN111279790B (zh) | 2022-10-14 |
| JP6927851B2 (ja) | 2021-09-01 |
| TWI787310B (zh) | 2022-12-21 |
| US12432820B2 (en) | 2025-09-30 |
| EP3706507B1 (en) | 2022-06-22 |
| TW201935996A (zh) | 2019-09-01 |
| WO2019087645A1 (ja) | 2019-05-09 |
| US20200329534A1 (en) | 2020-10-15 |
| JP2019083115A (ja) | 2019-05-30 |
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